JP5282093B2 - 電子部品の試験方法及び電子部品試験システム - Google Patents

電子部品の試験方法及び電子部品試験システム Download PDF

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Publication number
JP5282093B2
JP5282093B2 JP2010519708A JP2010519708A JP5282093B2 JP 5282093 B2 JP5282093 B2 JP 5282093B2 JP 2010519708 A JP2010519708 A JP 2010519708A JP 2010519708 A JP2010519708 A JP 2010519708A JP 5282093 B2 JP5282093 B2 JP 5282093B2
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test
electronic device
under test
device under
insert
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JPWO2010004844A1 (ja
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明浩 筬部
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Advantest Corp
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Advantest Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2010519708A 2008-07-08 2009-06-18 電子部品の試験方法及び電子部品試験システム Expired - Fee Related JP5282093B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010519708A JP5282093B2 (ja) 2008-07-08 2009-06-18 電子部品の試験方法及び電子部品試験システム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008178274 2008-07-08
JP2008178274 2008-07-08
PCT/JP2009/061100 WO2010004844A1 (ja) 2008-07-08 2009-06-18 電子部品の試験方法、インサート、トレイ及び電子部品試験装置
JP2010519708A JP5282093B2 (ja) 2008-07-08 2009-06-18 電子部品の試験方法及び電子部品試験システム

Publications (2)

Publication Number Publication Date
JPWO2010004844A1 JPWO2010004844A1 (ja) 2011-12-22
JP5282093B2 true JP5282093B2 (ja) 2013-09-04

Family

ID=41506964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010519708A Expired - Fee Related JP5282093B2 (ja) 2008-07-08 2009-06-18 電子部品の試験方法及び電子部品試験システム

Country Status (5)

Country Link
JP (1) JP5282093B2 (ko)
KR (1) KR101156962B1 (ko)
CN (1) CN102084260A (ko)
TW (1) TWI394960B (ko)
WO (1) WO2010004844A1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8829939B2 (en) * 2011-06-03 2014-09-09 Texas Instruments Incorporated Shuttle plate having pockets for accomodating multiple semiconductor package sizes
WO2013168196A1 (ja) * 2012-05-10 2013-11-14 ユニテクノ株式会社 半導体搬送テスト治具
JP2015105834A (ja) * 2013-11-28 2015-06-08 東京エレクトロン株式会社 電子部品検査装置、電子部品の検査方法、及び、検査方法のプログラム
TWI505051B (zh) * 2014-01-28 2015-10-21 Hon Tech Inc A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment
CN104375075A (zh) * 2014-11-05 2015-02-25 中山市智牛电子有限公司 一种测试仪
CN106291301B (zh) * 2015-06-08 2019-01-29 京元电子股份有限公司 半导体组件压力测试装置及其测试设备
KR102325275B1 (ko) * 2015-07-07 2021-11-11 (주)테크윙 테스트핸들러용 푸셔 조립체 및 매치플레이트
KR101587774B1 (ko) * 2015-12-14 2016-01-22 주식회사 케이엔케이 Ito 필름 검사를 위한 포고 핀 및 포고 핀 가이드 블록
KR102287237B1 (ko) * 2016-04-19 2021-08-09 주식회사 아이에스시 반도체 패키지를 수납하기 위한 인서트 조립체 및 이를 포함하는 테스트 트레이
KR101864939B1 (ko) * 2016-08-31 2018-06-05 세메스 주식회사 반도체 소자 테스트 장치
KR102287239B1 (ko) * 2016-11-11 2021-08-09 주식회사 아이에스시 반도체 소자 테스트 장치
CN108267618A (zh) * 2017-01-03 2018-07-10 东捷科技股份有限公司 具有可伸缩探针的夹具
CN106807650A (zh) * 2017-01-22 2017-06-09 江苏安纳金机械有限公司 一种充放电及休眠测试的自动拣料机及其运作方法
CN109990988B (zh) * 2017-12-29 2023-11-07 上海共联通信信息发展有限公司 一种4g无线基站设备板卡性能测试装置
TWI676033B (zh) * 2018-11-09 2019-11-01 京元電子股份有限公司 具浮動容置座之半導體元件測試載盤及其測試設備
CN111190087B (zh) * 2018-11-15 2022-03-15 京元电子股份有限公司 具浮动容置座的半导体元件测试载盘及其测试设备
KR102236103B1 (ko) * 2019-04-15 2021-04-05 주식회사 아테코 테스트 트레이 비전 검사기능이 구비된 전자부품 테스트 핸들러
TWI752760B (zh) * 2020-12-18 2022-01-11 致茂電子股份有限公司 測試座之晶片固定裝置
CN114046975A (zh) * 2021-11-10 2022-02-15 日月光半导体制造股份有限公司 适用于ic承载盘的测试治具和测试方法
CN115932342B (zh) * 2023-02-20 2023-05-16 天津伍嘉联创科技发展股份有限公司 一种电子元器件检测用可调节式测试台

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067000A1 (fr) * 2001-02-21 2002-08-29 Advantest Corporation Insert destine a un dispositif de test de composants electroniques
JP2003004800A (ja) * 2001-06-22 2003-01-08 Ando Electric Co Ltd デバイスキャリア及びオートハンドラ
JP2003066104A (ja) * 2001-08-22 2003-03-05 Advantest Corp インサートおよびこれを備えた電子部品ハンドリング装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5635832A (en) * 1994-06-15 1997-06-03 Advantest Corporation IC carrier for use with an IC handler
US6636060B1 (en) * 1999-07-16 2003-10-21 Advantest Corporation Insert for electric devices testing apparatus
TWM270487U (en) * 2004-10-26 2005-07-11 Advanced Semiconductor Eng A BGA type testbase having a counting a number of tests capability
JP4838522B2 (ja) * 2005-03-25 2011-12-14 株式会社エンプラス 電気接触子及び電気部品用ソケット
KR100702587B1 (ko) * 2005-04-16 2007-04-04 주식회사 대성엔지니어링 슬라이드 래치부재가 구비된 인서트
KR101042652B1 (ko) * 2006-05-18 2011-06-20 가부시키가이샤 아드반테스트 전자부품 시험장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067000A1 (fr) * 2001-02-21 2002-08-29 Advantest Corporation Insert destine a un dispositif de test de composants electroniques
JP2003004800A (ja) * 2001-06-22 2003-01-08 Ando Electric Co Ltd デバイスキャリア及びオートハンドラ
JP2003066104A (ja) * 2001-08-22 2003-03-05 Advantest Corp インサートおよびこれを備えた電子部品ハンドリング装置

Also Published As

Publication number Publication date
JPWO2010004844A1 (ja) 2011-12-22
TW201013197A (en) 2010-04-01
TWI394960B (zh) 2013-05-01
WO2010004844A1 (ja) 2010-01-14
KR101156962B1 (ko) 2012-06-20
KR20110018426A (ko) 2011-02-23
CN102084260A (zh) 2011-06-01

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