JP5265050B1 - Led光源装置、膜厚測定装置及び薄膜形成装置 - Google Patents

Led光源装置、膜厚測定装置及び薄膜形成装置 Download PDF

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Publication number
JP5265050B1
JP5265050B1 JP2012521822A JP2012521822A JP5265050B1 JP 5265050 B1 JP5265050 B1 JP 5265050B1 JP 2012521822 A JP2012521822 A JP 2012521822A JP 2012521822 A JP2012521822 A JP 2012521822A JP 5265050 B1 JP5265050 B1 JP 5265050B1
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light
led
film thickness
substrate
filter
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Japanese (ja)
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JPWO2013128537A1 (ja
Inventor
旭陽 佐井
陽平 日向
芳幸 大瀧
充祐 宮内
亦周 長江
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Shincron Co Ltd
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Shincron Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Led Device Packages (AREA)
JP2012521822A 2012-02-27 2012-02-27 Led光源装置、膜厚測定装置及び薄膜形成装置 Active JP5265050B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/054719 WO2013128537A1 (ja) 2012-02-27 2012-02-27 Led光源装置、膜厚測定装置及び薄膜形成装置

Publications (2)

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JP5265050B1 true JP5265050B1 (ja) 2013-08-14
JPWO2013128537A1 JPWO2013128537A1 (ja) 2015-07-30

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JP2012521822A Active JP5265050B1 (ja) 2012-02-27 2012-02-27 Led光源装置、膜厚測定装置及び薄膜形成装置

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Country Link
JP (1) JP5265050B1 (ko)
KR (1) KR101693397B1 (ko)
CN (1) CN104169676B (ko)
HK (1) HK1204491A1 (ko)
TW (1) TWI515407B (ko)
WO (1) WO2013128537A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016120226A1 (en) * 2015-01-30 2016-08-04 Odl Srl Projection system using leds or phosphor-converted light sources
US10948346B2 (en) 2016-11-08 2021-03-16 Samsung Electronics Co., Ltd. Spectrometer, apparatus and method for measuring biometric information

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107608037B (zh) * 2017-09-12 2020-03-20 杭州电子科技大学 应用于环介导等温扩增的光纤耦合装置
JP2019144217A (ja) * 2018-02-20 2019-08-29 国立大学法人千葉大学 膜厚測定装置、これを用いた蒸着装置及び膜特性評価装置
US10782120B2 (en) * 2018-07-03 2020-09-22 Kla Corporation Dual-interferometry wafer thickness gauge

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694910U (ko) * 1979-12-21 1981-07-28
JPH03162605A (ja) * 1989-11-20 1991-07-12 Fuji Electric Co Ltd 赤外線膜厚計
JPH08201168A (ja) * 1995-01-26 1996-08-09 Hamamatsu Photonics Kk 光帰還式光検出装置
JPH09113229A (ja) * 1995-10-17 1997-05-02 Sony Corp 膜厚管理装置及び膜厚検出方法
JPH09119812A (ja) * 1995-06-06 1997-05-06 Holtronic Technol Ltd 多層皮膜構造を特徴づけ、その皮膜に直面する2つの面の間の距離を測定する方法及び装置
JPH11241162A (ja) * 1997-12-01 1999-09-07 Natl Res Council Of Canada 光学的にモニタできるスパッタリング方法及びそのための装置
JP2000088531A (ja) * 1998-09-14 2000-03-31 Shincron:Kk 薄膜の膜厚計測装置及び薄膜の膜厚計測方法
JP2000258128A (ja) * 1999-03-02 2000-09-22 Internatl Business Mach Corp <Ibm> 膜厚検査装置及び膜厚検査方法
JP2002004046A (ja) * 2000-06-20 2002-01-09 Canon Inc 成膜方法および成膜装置
JP2002081910A (ja) * 2000-09-08 2002-03-22 Omron Corp 膜厚測定方法およびその方法を用いた膜厚センサ
JP2002277215A (ja) * 2001-03-14 2002-09-25 Omron Corp 膜厚測定方法およびその方法を用いた膜厚センサ
JP2003130615A (ja) * 2001-10-25 2003-05-08 Yokogawa Electric Corp 厚さ/成分計測方法及び装置
JP2004294155A (ja) * 2003-03-26 2004-10-21 Oyokoden Lab Co Ltd 屈折率及び厚さの測定装置ならびに測定方法
JP2005207829A (ja) * 2004-01-21 2005-08-04 Dainippon Printing Co Ltd 膜厚良否検査方法及び装置
JP2005214927A (ja) * 2004-02-02 2005-08-11 Yamagata Public Corp For The Development Of Industry 並列光ヘテロダイン検出法を用いた光干渉計測方法
JP2005344168A (ja) * 2004-06-03 2005-12-15 Shincron:Kk 薄膜形成方法,膜厚測定方法及び膜厚測定装置
JP2006009099A (ja) * 2004-06-25 2006-01-12 Asahi Glass Co Ltd 膜厚制御方法及び装置、並びに光学多層膜の製造方法
JP2006250851A (ja) * 2005-03-14 2006-09-21 Toppan Printing Co Ltd 膜厚ムラ検出方法および検出装置
JP2006275704A (ja) * 2005-03-29 2006-10-12 Toppan Printing Co Ltd 膜厚ムラ検出方法
US20080068722A1 (en) * 2003-07-11 2008-03-20 Chow Peter P Film mapping system
JP2011013145A (ja) * 2009-07-03 2011-01-20 Shincron:Kk 光学式膜厚計及び光学式膜厚計を備えた薄膜形成装置
JP2012021856A (ja) * 2010-07-14 2012-02-02 Keyence Corp 干渉膜厚計

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3944693B2 (ja) * 2001-10-04 2007-07-11 オムロン株式会社 膜厚測定装置
JP2006139044A (ja) 2004-11-12 2006-06-01 Shinka Cho Led光源装置

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694910U (ko) * 1979-12-21 1981-07-28
JPH03162605A (ja) * 1989-11-20 1991-07-12 Fuji Electric Co Ltd 赤外線膜厚計
JPH08201168A (ja) * 1995-01-26 1996-08-09 Hamamatsu Photonics Kk 光帰還式光検出装置
JPH09119812A (ja) * 1995-06-06 1997-05-06 Holtronic Technol Ltd 多層皮膜構造を特徴づけ、その皮膜に直面する2つの面の間の距離を測定する方法及び装置
JPH09113229A (ja) * 1995-10-17 1997-05-02 Sony Corp 膜厚管理装置及び膜厚検出方法
JPH11241162A (ja) * 1997-12-01 1999-09-07 Natl Res Council Of Canada 光学的にモニタできるスパッタリング方法及びそのための装置
JP2000088531A (ja) * 1998-09-14 2000-03-31 Shincron:Kk 薄膜の膜厚計測装置及び薄膜の膜厚計測方法
JP2000258128A (ja) * 1999-03-02 2000-09-22 Internatl Business Mach Corp <Ibm> 膜厚検査装置及び膜厚検査方法
JP2002004046A (ja) * 2000-06-20 2002-01-09 Canon Inc 成膜方法および成膜装置
JP2002081910A (ja) * 2000-09-08 2002-03-22 Omron Corp 膜厚測定方法およびその方法を用いた膜厚センサ
JP2002277215A (ja) * 2001-03-14 2002-09-25 Omron Corp 膜厚測定方法およびその方法を用いた膜厚センサ
JP2003130615A (ja) * 2001-10-25 2003-05-08 Yokogawa Electric Corp 厚さ/成分計測方法及び装置
JP2004294155A (ja) * 2003-03-26 2004-10-21 Oyokoden Lab Co Ltd 屈折率及び厚さの測定装置ならびに測定方法
US20080068722A1 (en) * 2003-07-11 2008-03-20 Chow Peter P Film mapping system
JP2005207829A (ja) * 2004-01-21 2005-08-04 Dainippon Printing Co Ltd 膜厚良否検査方法及び装置
JP2005214927A (ja) * 2004-02-02 2005-08-11 Yamagata Public Corp For The Development Of Industry 並列光ヘテロダイン検出法を用いた光干渉計測方法
JP2005344168A (ja) * 2004-06-03 2005-12-15 Shincron:Kk 薄膜形成方法,膜厚測定方法及び膜厚測定装置
JP2006009099A (ja) * 2004-06-25 2006-01-12 Asahi Glass Co Ltd 膜厚制御方法及び装置、並びに光学多層膜の製造方法
JP2006250851A (ja) * 2005-03-14 2006-09-21 Toppan Printing Co Ltd 膜厚ムラ検出方法および検出装置
JP2006275704A (ja) * 2005-03-29 2006-10-12 Toppan Printing Co Ltd 膜厚ムラ検出方法
JP2011013145A (ja) * 2009-07-03 2011-01-20 Shincron:Kk 光学式膜厚計及び光学式膜厚計を備えた薄膜形成装置
JP2012021856A (ja) * 2010-07-14 2012-02-02 Keyence Corp 干渉膜厚計

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPN6013001892; '特集*基礎からのLED活用テクニック' トランジスタ技術 2月号, 20060201, p.124-125,142, CQ出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016120226A1 (en) * 2015-01-30 2016-08-04 Odl Srl Projection system using leds or phosphor-converted light sources
US10948346B2 (en) 2016-11-08 2021-03-16 Samsung Electronics Co., Ltd. Spectrometer, apparatus and method for measuring biometric information

Also Published As

Publication number Publication date
KR20140121338A (ko) 2014-10-15
CN104169676A (zh) 2014-11-26
KR101693397B1 (ko) 2017-01-06
JPWO2013128537A1 (ja) 2015-07-30
CN104169676B (zh) 2019-01-15
WO2013128537A1 (ja) 2013-09-06
TW201335568A (zh) 2013-09-01
HK1204491A1 (en) 2015-11-20
TWI515407B (zh) 2016-01-01

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