JP5256848B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5256848B2
JP5256848B2 JP2008140214A JP2008140214A JP5256848B2 JP 5256848 B2 JP5256848 B2 JP 5256848B2 JP 2008140214 A JP2008140214 A JP 2008140214A JP 2008140214 A JP2008140214 A JP 2008140214A JP 5256848 B2 JP5256848 B2 JP 5256848B2
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JP
Japan
Prior art keywords
semiconductor device
support substrate
covering member
disposed
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008140214A
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English (en)
Japanese (ja)
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JP2009289930A (ja
JP2009289930A5 (enExample
Inventor
邦人 杉本
公樹 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2008140214A priority Critical patent/JP5256848B2/ja
Priority to EP09161417.2A priority patent/EP2128905B1/en
Priority to US12/473,944 priority patent/US8049318B2/en
Publication of JP2009289930A publication Critical patent/JP2009289930A/ja
Publication of JP2009289930A5 publication Critical patent/JP2009289930A5/ja
Application granted granted Critical
Publication of JP5256848B2 publication Critical patent/JP5256848B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

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  • Led Device Packages (AREA)
JP2008140214A 2008-05-29 2008-05-29 半導体装置 Active JP5256848B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008140214A JP5256848B2 (ja) 2008-05-29 2008-05-29 半導体装置
EP09161417.2A EP2128905B1 (en) 2008-05-29 2009-05-28 Semiconductor light emitting device
US12/473,944 US8049318B2 (en) 2008-05-29 2009-05-28 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008140214A JP5256848B2 (ja) 2008-05-29 2008-05-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2009289930A JP2009289930A (ja) 2009-12-10
JP2009289930A5 JP2009289930A5 (enExample) 2011-06-23
JP5256848B2 true JP5256848B2 (ja) 2013-08-07

Family

ID=40957753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008140214A Active JP5256848B2 (ja) 2008-05-29 2008-05-29 半導体装置

Country Status (3)

Country Link
US (1) US8049318B2 (enExample)
EP (1) EP2128905B1 (enExample)
JP (1) JP5256848B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4798725B2 (ja) * 2009-03-25 2011-10-19 スタンレー電気株式会社 照明装置
JP5652100B2 (ja) * 2010-10-05 2015-01-14 ソニー株式会社 表示パネル、表示装置、照明パネルおよび照明装置、ならびに表示パネルおよび照明パネルの製造方法
JP2012109475A (ja) * 2010-11-19 2012-06-07 Rohm Co Ltd 発光装置、発光装置の製造方法、および光学装置
CN102133668B (zh) * 2010-12-14 2013-05-01 浙江名芯半导体科技有限公司 一种led光源散热模组焊接方法
KR101959035B1 (ko) 2011-10-31 2019-03-18 서울바이오시스 주식회사 발광 다이오드 패키지 및 그것을 제조하는 방법
JP6187144B2 (ja) * 2013-10-23 2017-08-30 富士ゼロックス株式会社 露光装置及び画像形成装置
WO2015177679A1 (en) * 2014-05-21 2015-11-26 Koninklijke Philips N.V. Method of attaching a lens to an led module with high alignment accuracy
JP6602622B2 (ja) * 2014-09-25 2019-11-06 山村フォトニクス株式会社 光デバイス装置および光デバイスを覆うための保護カバー
JP6005779B2 (ja) * 2015-03-02 2016-10-12 ローム株式会社 発光装置、発光装置の製造方法、および光学装置
CN107195751B (zh) * 2016-03-14 2020-01-14 光宝光电(常州)有限公司 发光二极管封装结构
JP6162284B2 (ja) * 2016-03-30 2017-07-12 ローム株式会社 発光装置
JP6508189B2 (ja) * 2016-03-31 2019-05-08 日亜化学工業株式会社 発光装置
US10615314B2 (en) 2016-03-31 2020-04-07 Nichia Corporation Light-emitting device
JP7348533B2 (ja) * 2021-03-31 2023-09-21 日亜化学工業株式会社 発光装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置
TW552726B (en) * 2001-07-26 2003-09-11 Matsushita Electric Works Ltd Light emitting device in use of LED
JP2003282953A (ja) 2002-03-27 2003-10-03 Citizen Electronics Co Ltd 半導体チップ
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
JP2004119881A (ja) 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
JP4504662B2 (ja) * 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
JP2005079149A (ja) * 2003-08-28 2005-03-24 Seiko Epson Corp 光源装置及びプロジェクタ
TWM268733U (en) * 2004-09-10 2005-06-21 Sen Tech Co Ltd LED packaging structure containing fluorescent plate
JP4661147B2 (ja) * 2004-09-24 2011-03-30 日亜化学工業株式会社 半導体装置
JP2006269485A (ja) * 2005-03-22 2006-10-05 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP4961799B2 (ja) * 2005-04-08 2012-06-27 日亜化学工業株式会社 スクリーン印刷で形成したシリコーン樹脂層を有する発光装置
JP2007072432A (ja) * 2005-08-08 2007-03-22 Konica Minolta Opto Inc 光学素子及びそれを備えた照明装置
JP3982561B2 (ja) * 2005-09-09 2007-09-26 松下電工株式会社 Ｌｅｄ照明装置
JP2007080859A (ja) 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
US7378686B2 (en) * 2005-10-18 2008-05-27 Goldeneye, Inc. Light emitting diode and side emitting lens
JP4881001B2 (ja) * 2005-12-29 2012-02-22 シチズン電子株式会社 発光装置
JP5130680B2 (ja) * 2006-03-02 2013-01-30 日亜化学工業株式会社 半導体装置およびその形成方法

Also Published As

Publication number Publication date
EP2128905B1 (en) 2017-04-19
US8049318B2 (en) 2011-11-01
JP2009289930A (ja) 2009-12-10
EP2128905A2 (en) 2009-12-02
US20090294940A1 (en) 2009-12-03
EP2128905A3 (en) 2013-06-19

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