JP5252516B2 - 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置 - Google Patents

電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置 Download PDF

Info

Publication number
JP5252516B2
JP5252516B2 JP2012546570A JP2012546570A JP5252516B2 JP 5252516 B2 JP5252516 B2 JP 5252516B2 JP 2012546570 A JP2012546570 A JP 2012546570A JP 2012546570 A JP2012546570 A JP 2012546570A JP 5252516 B2 JP5252516 B2 JP 5252516B2
Authority
JP
Japan
Prior art keywords
electronic component
holding means
rod
holding
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012546570A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2012073282A1 (ja
Inventor
高之 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ueno Seiki Co Ltd
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Application granted granted Critical
Publication of JP5252516B2 publication Critical patent/JP5252516B2/ja
Publication of JPWO2012073282A1 publication Critical patent/JPWO2012073282A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Operations Research (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Specific Conveyance Elements (AREA)
JP2012546570A 2010-11-30 2010-11-30 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置 Active JP5252516B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/006991 WO2012073282A1 (ja) 2010-11-30 2010-11-30 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置

Publications (2)

Publication Number Publication Date
JP5252516B2 true JP5252516B2 (ja) 2013-07-31
JPWO2012073282A1 JPWO2012073282A1 (ja) 2014-05-19

Family

ID=46171274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012546570A Active JP5252516B2 (ja) 2010-11-30 2010-11-30 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置

Country Status (5)

Country Link
JP (1) JP5252516B2 (zh)
CN (1) CN103229610B (zh)
HK (1) HK1183400A1 (zh)
MY (1) MY159459A (zh)
WO (1) WO2012073282A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10477697B2 (en) 2014-07-02 2019-11-12 Shinkawa Ltd. Mounting apparatus

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104136325B (zh) * 2012-02-28 2015-09-30 上野精机株式会社 异常接触检测方法、电子元器件保持装置以及电子元器件搬运装置
WO2014087548A1 (ja) * 2012-12-04 2014-06-12 上野精機株式会社 保持手段の移動方法、電子部品保持装置、及び電子部品搬送装置
KR20150097535A (ko) * 2012-12-19 2015-08-26 이스메카 세미컨덕터 홀딩 에스.아. 힘을 제한하는 장치 및 방법
TWI478792B (zh) * 2012-12-27 2015-04-01 Ueno Seiki Co Ltd A method of moving the holding means, an electronic component holding means, and an electronic component handling means
JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
KR101543949B1 (ko) 2014-01-29 2015-08-11 세메스 주식회사 다이 본딩 헤드 및 이를 이용한 다이 본딩 방법
JP6329622B2 (ja) * 2014-03-24 2018-05-23 株式会社Ｆｕｊｉ ダイ実装システム及びダイ実装方法
JP6164624B1 (ja) * 2016-10-18 2017-07-19 上野精機株式会社 電子部品移動装置及び電子部品搬送装置
JP6543686B1 (ja) * 2017-12-26 2019-07-10 ミネベアミツミ株式会社 荷重センサおよび荷重センサ一体型多軸アクチュエータ
CN108428653B (zh) * 2018-05-23 2023-12-08 重庆市嘉凌新科技有限公司 功率器件封装设备
JP6716654B2 (ja) * 2018-09-26 2020-07-01 Ntn株式会社 塗布部材、塗布装置および塗布方法
CN110299312A (zh) * 2019-07-04 2019-10-01 深圳市诺泰自动化设备有限公司 一种转塔式固晶机
JP6817648B1 (ja) * 2019-09-20 2021-01-20 上野精機株式会社 電子部品の処理装置
CN111589728A (zh) * 2020-06-24 2020-08-28 金动力智能科技（深圳）有限公司 一种5g网分组件的智能测试组件
JP6842732B1 (ja) * 2020-09-24 2021-03-17 上野精機株式会社 電子部品の処理装置
KR20230096029A (ko) 2021-03-16 2023-06-29 가부시키가이샤 신가와 반송 장치, 반송 방법 및 프로그램

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034121A (ja) * 2008-07-25 2010-02-12 Juki Corp 電子部品搭載ヘッド
JP2010135357A (ja) * 2008-12-02 2010-06-17 Ueno Seiki Kk 表裏反転装置、表裏反転装置を備えたテストハンドラ
JP2010131680A (ja) * 2008-12-02 2010-06-17 Ueno Seiki Kk 保持手段駆動装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3848893B2 (ja) * 2002-04-02 2006-11-22 松下電器産業株式会社 部品の基板への部品押圧接合装置及び接合方法
JP2007317995A (ja) * 2006-05-29 2007-12-06 I-Pulse Co Ltd 表面実装機
CN102449751B (zh) * 2009-05-27 2014-10-15 上野精机株式会社 分类装置
CN102473665B (zh) * 2009-07-17 2014-11-19 上野精机株式会社 重新粘贴装置以及分类重新粘贴方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034121A (ja) * 2008-07-25 2010-02-12 Juki Corp 電子部品搭載ヘッド
JP2010135357A (ja) * 2008-12-02 2010-06-17 Ueno Seiki Kk 表裏反転装置、表裏反転装置を備えたテストハンドラ
JP2010131680A (ja) * 2008-12-02 2010-06-17 Ueno Seiki Kk 保持手段駆動装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10477697B2 (en) 2014-07-02 2019-11-12 Shinkawa Ltd. Mounting apparatus

Also Published As

Publication number Publication date
MY159459A (en) 2017-01-13
CN103229610A (zh) 2013-07-31
HK1183400A1 (zh) 2013-12-20
WO2012073282A1 (ja) 2012-06-07
JPWO2012073282A1 (ja) 2014-05-19
CN103229610B (zh) 2016-01-20

Similar Documents

Publication Publication Date Title
JP5252516B2 (ja) 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置
TWI615253B (zh) 移載裝置
EP3425661B1 (en) Chip bonding apparatus and method
TWI505901B (zh) 移載裝置
JP5544461B1 (ja) 姿勢補正装置、電子部品搬送装置、及び電子部品移載装置
JP6021550B2 (ja) 電子部品実装装置
WO2012107956A1 (ja) 電子部品搬送装置及びテーピングユニット
CN108605427B (zh) 安装装置
JP5548843B2 (ja) 電子部品検査装置及びトレイ移載装置
JP5725543B2 (ja) 電子部品測定装置
JP2010135574A (ja) 移載装置
JP2017204559A (ja) リペアユニットを有するシステム
JP5634021B2 (ja) 半導体装置の製造装置および半導体装置の製造方法
JP2017105618A (ja) 処理ユニット及び電子部品搬送装置
JP5544460B2 (ja) 電気特性検査装置、外置きユニット用搬送装置、及び電子部品搬送装置
JP5051713B2 (ja) 電子部品測定装置
WO2011007398A1 (ja) ピックアップ装置
JP2013197278A (ja) 半導体製造装置
JP4301393B2 (ja) 半導体装置の製造装置
CN118197955A (zh) 半导体制造装置及半导体器件的制造方法
JP2011228415A (ja) 電子部品取り付け状態検査装置及び電子部品取り付け状態検査方法
JPH0222835A (ja) 電子部品の実装装置
JP2005079193A (ja) ボンディング方法、ボンディングプログラム及びボンディング装置
JP2007251208A (ja) ボンディング方法、ボンディングプログラム及びボンディング装置

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130402

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130410

R150 Certificate of patent or registration of utility model

Ref document number: 5252516

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160426

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250