MY159459A - Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith - Google Patents

Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith

Info

Publication number
MY159459A
MY159459A MYPI2013700893A MYPI2013700893A MY159459A MY 159459 A MY159459 A MY 159459A MY PI2013700893 A MYPI2013700893 A MY PI2013700893A MY PI2013700893 A MYPI2013700893 A MY PI2013700893A MY 159459 A MY159459 A MY 159459A
Authority
MY
Malaysia
Prior art keywords
electronic component
provided therewith
device provided
suction nozzle
holding device
Prior art date
Application number
MYPI2013700893A
Inventor
Takayuki Masuda
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY159459A publication Critical patent/MY159459A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Abstract

THERE ARE PROVIDED AN ELECTRONIC COMPONENT HOLDING DEVICE THAT ENABLES BOTH SPEEDING-UP OF THE ASCENDING/DESCENDING SPEED OF AN ELECTRONIC COMPONENT HOLDING UNIT AND PRECISE CONTROL OF A LOAD APPLIED TO THE ELECTRONIC COMPONENT, AN ELECTRONIC COMPONENT INSPECTING DEVICE PROVIDED THEREWITH, AND AN ELECTRONIC COMPONENT CLASSIFICATION DEVICE PROVIDED THEREWITH. AN ELECTRONIC COMPONENT HOLDING DEVICE (3) INCLUDES A SUCTION NOZZLE (301), A SERVO MOTOR (318), AND A VOICE COIL MOTOR (309). THE SUCTION NOZZLE (301) IS SUPPORTED IN A MANNER CAPABLE OF ASCENDING/DESCENDING RELATIVE TO A PLACEMENT POSITION, AND HOLDS AND RELEASES AN ELECTRONIC COMPONENT D. THE SERVO MOTOR (318) CAUSES THE SUCTION NOZZLE (301) TO ASCEND/DESCEND RELATIVE TO THE PLACEMENT POSITION. THE VOICE COIL MOTOR (309) IS DISPOSED AS A SEPARATE UNIT FROM THE SERVO MOTOR (318), AND CONTROLS LOAD TO THE ELECTRONIC COMPONENT D PLACED ON THE PLACEMENT POSITION THROUGH THE SUCTION NOZZLE (301). (FIG. 1)
MYPI2013700893A 2010-11-30 2010-11-30 Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith MY159459A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/006991 WO2012073282A1 (en) 2010-11-30 2010-11-30 Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device

Publications (1)

Publication Number Publication Date
MY159459A true MY159459A (en) 2017-01-13

Family

ID=46171274

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013700893A MY159459A (en) 2010-11-30 2010-11-30 Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith

Country Status (5)

Country Link
JP (1) JP5252516B2 (en)
CN (1) CN103229610B (en)
HK (1) HK1183400A1 (en)
MY (1) MY159459A (en)
WO (1) WO2012073282A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104136325B (en) * 2012-02-28 2015-09-30 上野精机株式会社 Abnormal contact detecting method, electronic devices and components holding device and electronic devices and components Handling device
WO2014087548A1 (en) * 2012-12-04 2014-06-12 上野精機株式会社 Method of moving holding means, electronic component holding device, and electronic component conveyance device
EP2936176A1 (en) * 2012-12-19 2015-10-28 ISMECA Semiconductor Holding SA Device and method for limiting force
TWI478792B (en) * 2012-12-27 2015-04-01 Ueno Seiki Co Ltd A method of moving the holding means, an electronic component holding means, and an electronic component handling means
JP5555839B1 (en) * 2013-09-02 2014-07-23 上野精機株式会社 Appearance inspection device
KR101543949B1 (en) 2014-01-29 2015-08-11 세메스 주식회사 Die bong head and method of bonding a die using the die bonding head
US10032650B2 (en) * 2014-03-24 2018-07-24 Fuji Machine Mfg. Co., Ltd. Die mounting system and die mounting method
JP5755361B1 (en) 2014-07-02 2015-07-29 株式会社新川 Mounting device
JP6164624B1 (en) * 2016-10-18 2017-07-19 上野精機株式会社 Electronic component moving device and electronic component conveying device
JP6543686B1 (en) * 2017-12-26 2019-07-10 ミネベアミツミ株式会社 Load sensor and load sensor integrated multi-axis actuator
CN108428653B (en) * 2018-05-23 2023-12-08 重庆市嘉凌新科技有限公司 Power device packaging equipment
CN110299312A (en) * 2019-07-04 2019-10-01 深圳市诺泰自动化设备有限公司 A kind of rotary type tower bonder
JP6817648B1 (en) * 2019-09-20 2021-01-20 上野精機株式会社 Electronic component processing equipment
CN111589728A (en) * 2020-06-24 2020-08-28 金动力智能科技（深圳）有限公司 Intelligent test assembly of 5G network subassembly
JP6842732B1 (en) * 2020-09-24 2021-03-17 上野精機株式会社 Electronic component processing equipment
WO2022195693A1 (en) * 2021-03-16 2022-09-22 株式会社新川 Conveyance device, conveyance method, and program

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3848893B2 (en) * 2002-04-02 2006-11-22 松下電器産業株式会社 Component pressing and joining device to substrate and joining method
JP2007317995A (en) * 2006-05-29 2007-12-06 I-Pulse Co Ltd Surface-mounting apparatus
JP5372423B2 (en) * 2008-07-25 2013-12-18 Ｊｕｋｉ株式会社 Electronic component mounting head
JP5459820B2 (en) * 2008-12-02 2014-04-02 上野精機株式会社 Front / back reversing device, test handler with front / back reversing device
JP2010131680A (en) * 2008-12-02 2010-06-17 Ueno Seiki Kk Holding means driver
MY159061A (en) * 2009-05-27 2016-12-15 Ueno Seiki Co Ltd Classification apparatus
JP4462638B1 (en) * 2009-07-17 2010-05-12 上野精機株式会社 Pasting device and classification pasting method

Also Published As

Publication number Publication date
HK1183400A1 (en) 2013-12-20
JPWO2012073282A1 (en) 2014-05-19
JP5252516B2 (en) 2013-07-31
CN103229610B (en) 2016-01-20
WO2012073282A1 (en) 2012-06-07
CN103229610A (en) 2013-07-31

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