JP6817648B1 - Electronic component processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device for an electronic component which is effective for improving the positioning accuracy of the electronic component. SOLUTION: A processing device for an electronic component according to one aspect of the present disclosure has a swivel portion that can swivel around a central axis of a transport circulation orbit passing through a predetermined arrangement region, and swivels so as to be located in the transport circulation orbit. The electronic component holding portion provided in the portion, the holding position variable portion that enables the displacement of the electronic component holding portion with respect to the swivel portion in a predetermined displacement direction, and the electronic component holding portion that holds the electronic component are arranged in the arrangement area. A swivel drive unit that swivels the swivel portion around the central axis, and a displacement drive unit provided in the displacement region so as to move the electronic component holding portion arranged in the disposition area to one side in the displacement direction. Be prepared. The variable holding position portion has a plurality of parallel leaf springs that intersect in the displacement direction and connect the electronic component holding portion and the swivel portion. [Selection diagram] Fig. 3

Description

The present disclosure relates to a processing device for electronic components.

Patent Document 1 discloses an electronic component inspection device including a turntable and an electronic component holding device attached to an outer peripheral end of the turntable. The electronic component inspection device has a suction nozzle that can be raised and lowered with respect to the mounting position of the electronic component, and the suction nozzle is lowered to the mounting position to separate the electronic component at the mounting position, or the mounting position. Get electronic components from.

International Publication No. 2012/073282

The present disclosure provides an electronic component processing apparatus effective for improving the positioning accuracy of electronic components.

The electronic component processing device according to one aspect of the present disclosure is provided in a swivel portion that can swivel around the central axis of a transport circulation orbit that passes through a predetermined arrangement region, and a swivel portion that is located in the transport circulation orbit. The electronic component holding portion, the holding position variable portion that enables the displacement of the electronic component holding portion with respect to the swivel portion in a predetermined displacement direction, and the electronic component holding portion that holds the electronic component are centered so as to be arranged in the arrangement area. It includes a swivel drive unit that swivels the swivel unit around an axis, and a displacement drive unit provided in the displacement area so as to move the electronic component holding unit arranged in the disposition area to one side in the displacement direction. The variable holding position portion has a plurality of parallel leaf springs that intersect in the displacement direction and connect the electronic component holding portion and the swivel portion.

According to the present disclosure, an electronic component processing device effective for improving the positioning accuracy of electronic components is provided.

FIG. 1 is a plan view schematically showing an example of a processing device. FIG. 2 is a side view schematically showing the processing apparatus shown in FIG. FIG. 3 is an enlarged side view showing a part of the processing apparatus. FIG. 4 is a plan view schematically showing a part of the processing apparatus. 5 (a) and 5 (b) are schematic views for explaining the displacement of the electronic component holding portion.

Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same elements or elements having the same function are designated by the same reference numerals, and duplicate description will be omitted.

The electronic component processing device 1 according to the present embodiment is a so-called die sorter, and is subjected to processing such as appearance inspection, electrical characteristic inspection, marking, etc. while transporting the electronic component W formed in a pre-process such as dicing. It is a device that packs in storage members such as tapes, container tubes, and trays. The processing device 1 illustrated below is a device that performs various processing such as inspection on the electronic component W received from the component supply unit, and packs the electronic component W in the accommodating member without bonding to the substrate or the like.

As shown in FIGS. 1 and 2, the processing device 1 includes a rotary transfer unit 10 and a controller 100. The rotary transport unit 10 moves the electronic component W along the circulation track CR (circulation track for transport). The electronic component W to be transported may have two main surfaces Wa and Wb parallel to each other and an outer peripheral surface Wc surrounding the main surfaces Wa and Wb (see FIG. 3). The rotary transport unit 10 includes a swivel unit 20, a plurality of electronic component holding units 50, a plurality of holding position variable units 70, a swivel drive unit 60, and a displacement drive unit 80.

The swivel portion 20 can swivel around the central axis Ax of the circulation orbit CR passing through the plurality of arrangement regions AR. The swivel portion 20 has a turntable 22 that is swivelably provided around the central axis Ax, and a plurality of connecting portions 24. The outer circumference of the turntable 22 is located inside the circulation track CR. For example, the circular orbit CR is a horizontal circular orbit, and the central axis Ax is vertical.

The plurality of arrangement regions AR may be set so as to be evenly spaced from each other along the circulation orbit CR. The plurality of arrangement areas AR are areas that do not move even if the turning portion 20 turns. For example, in at least a part of the plurality of arrangement regions AR passing through the circulation orbit CR, the electronic component W is transferred from the swivel unit 20 to the processing unit 16. Specific examples of the processing unit 16 include a component supply unit that supplies the electronic component W, a collection unit that collects the electronic component W and packs it in the accommodating member, and an electronic component W between the component supply unit and the collection unit. An intermediate processing unit that performs a predetermined processing can be mentioned. Examples of the intermediate processing unit include an inspection unit that inspects the appearance of the electronic component W, an inspection unit that inspects the electrical characteristics of the electronic component W, and a marking unit that marks the electronic component W. The plurality of connecting portions 24 are arranged at equal intervals along the outer circumference of the turntable 22, and each protrudes from the turntable 22 toward the outer circumference.

The plurality of electronic component holding portions 50 are provided in the swivel portion 20 so as to be located in the circulation track CR. For example, the plurality of electronic component holding portions 50 are arranged at equal intervals along the circulation track CR, and are attached to the plurality of connecting portions 24, respectively. In addition, in this specification, "attached" includes not only the case of being attached directly but also the case of being attached via another member. As an example, the number of the plurality of electronic component holding units 50 and the number of the plurality of arrangement areas AR may be the same. The pitch angle at which the plurality of electronic component holding portions 50 are arranged along the circulation orbit CR (the angle between the electronic component holding portions 50 adjacent to each other) and the plurality of arrangement regions AR are arranged along the circulation orbit CR. The pitch angle may be the same.

Each of the plurality of electronic component holding units 50 holds the electronic component W. The electronic component holding unit 50 may hold the electronic component W by any method. Specific examples of the method of holding the electronic component W include negative pressure (vacuum) adsorption, electrostatic adsorption, and gripping. For example, the electronic component holding unit 50 attracts one of the main surfaces Wa and Wb by a negative pressure from one side in the direction orthogonal to the turntable 22 (Z-axis direction in the drawing).

As shown in FIG. 2, the holding position variable portion 70 connects between the swivel portion 20 and the electronic component holding portion 50, and enables the electronic component holding portion 50 to be displaced with respect to the swivel portion 20 in a predetermined direction. .. Hereinafter, the direction in which the electronic component holding portion 50 can be displaced by the holding position variable portion 70 is referred to as a “displacement direction”. For example, the holding position variable portion 70 enables the electronic component holding portion 50 to be displaced in a direction perpendicular to the turntable 22 (Z-axis direction in the drawing). As an example, the variable holding position 70 allows the electronic component holding portion 50 to be displaced between the transport position and the mounting position.

The transport position is a position where the electronic component holding portion 50 is arranged when the swivel portion 20 turns, and is set at the same height position as the turntable 22, for example. The mounting position is a position where the electronic component W is delivered to the processing unit 16, and is set to a position (in the negative direction of the Z axis) below the transport position.

The swivel drive unit 60 swivels the swivel unit 20 around the central axis Ax. The swivel drive unit 60 uses, for example, an electric motor as a power source, and rotates the turntable 22 around the central axis Ax by a direct drive without a gear. Since the plurality of electronic component holding portions 50 are attached to the turntable 22, the plurality of electronic component holding portions 50 move along the circulation orbit CR as the turntable 22 rotates (rotates around the central axis Ax). ). The swivel drive unit 60 swivels the swivel unit 20 so that each of the plurality of electronic component holding units 50 is sequentially arranged in one arrangement area AR. For example, the swivel drive unit 60 intermittently swivels the swivel unit 20 so that the plurality of electronic component holding units 50 are temporarily stopped in the plurality of arrangement areas AR. As a result, any one of the plurality of electronic component holding units 50 is sequentially suspended in one arrangement area AR.

As shown in FIG. 3, the electronic component holding portion 50 may have a suction nozzle 52, a nozzle holder 54, and a connection block 55.

The suction nozzle 52 is located on the circulation orbit CR. The suction nozzle 52 is open downward and sucks either one of the main surfaces Wa and Wb of the electronic component W from above by negative pressure. For example, the suction nozzle 52 extends perpendicularly to the turntable 22, and the lower end thereof opens downward. The electronic component holding unit 50 further includes a valve (not shown) for switching on and off of negative pressure suction by the suction nozzle 52 according to the input of a control signal. Specific examples of the valve include an electromagnetic valve and the like.

The nozzle holder 54 holds the suction nozzle 52. The suction nozzle 52 projects downward from the nozzle holder 54. The connection block 55 is adjacent to the nozzle holder 54 on the turntable 22 side and faces the connection portion 24. Hereinafter, the surface of the outer surface of the connection block 55 facing the connection portion 24 is referred to as an "inner surface 55a", and the surface of the outer surface of the connection portion 24 facing the connection block 55 is referred to as an "outer surface 24a".

The holding position variable portion 70 has a plurality of parallel leaf springs. The holding position variable portion 70 has, for example, two parallel leaf springs. Hereinafter, one of the two leaf springs will be referred to as a “leaf spring 72a” and the other will be referred to as a “leaf spring 72b”.

The leaf springs 72a and 72b intersect the electronic component holding portion 50 in the displacement direction to connect the electronic component holding portion 50 and the swivel portion 20. For example, the leaf springs 72a and 72b are separated from each other and arranged vertically, and extend horizontally to connect the inner surface 55a of the connection block 55 and the outer surface 24a of the connection portion 24. The distance between the leaf spring 72a and the leaf spring 72b may be larger than the thickness of the turntable 22. By connecting the electronic component holding portion 50 and the swivel portion 20 with two parallel leaf springs 72a and 72b, the direction in which the electronic component holding portion 50 is displaced with respect to the swivel portion 20 (movement operation of the electronic component holding portion 50). ) Is regulated. That is, the leaf springs 72a and 72b have a function of guiding the movement of the electronic component holding portion 50 with respect to the swivel portion 20.

The leaf spring 72a and the leaf spring 72b may be formed so as to have the same spring characteristics. For example, the leaf spring 72a and the leaf spring 72b are made of the same material. Further, the leaf spring 72a and the leaf spring 72b have the same shape. The same shape includes not only the case where the leaf spring 72a completely matches the leaf spring 72b but also the case where the leaf spring 72a substantially matches.

The displacement drive unit 80 moves the electronic component holding unit 50 arranged in the arrangement area AR to one side in the displacement direction. For example, the displacement drive unit 80 moves the electronic component holding unit 50 downward in the vertical direction. The rotary transport unit 10 may include a plurality of displacement drive units 80. The plurality of displacement drive units 80 are each provided with a plurality of arrangement areas AR. The plurality of displacement drive units 80 are fixed to the plurality of arrangement areas AR, respectively, and do not move even if the swivel unit 20 swivels. The displacement drive unit 80 may not be provided in the arrangement region AR where the electronic component holding unit 50 does not need to be displaced. One displacement drive unit 80 moves the electronic component holding unit 50, which is sequentially arranged in the arrangement area AR to which the displacement drive unit 80 is fixed, to one side in the displacement direction.

Returning to FIG. 2, the rotary transport unit 10 may further include a fixing plate 90 for fixing (holding) the plurality of displacement drive units 80. The fixing plate 90 is, for example, a plate-shaped member arranged above the turntable 22 of the swivel portion 20. The fixing plate 90 is configured so as not to turn together with the turntable 22. The plurality of displacement drive units 80 are fixed to the fixing plate 90 in a state of being located in each of the plurality of arrangement areas AR. Therefore, the plurality of displacement drive units 80 do not move even if the swivel unit 20 turns.

The displacement drive unit 80 includes, for example, a main body unit 81, a pusher 82, and a drive unit 84. The main body portion 81 is fixed to the arrangement area AR so as not to turn together with the turntable 22 (swivel portion 20). For example, the main body portion 81 is fixed to a portion of the outer edge portion of the fixing plate 90 corresponding to the arrangement area AR. The pusher 82 is provided on the main body 81 so that it can be displaced with respect to the main body 81 along the displacement direction. For example, the pusher 82 is held by the main body 81 so as to be movable in the vertical direction. The pusher 82 is located above the electronic component holding unit 50 in a state where the electronic component holding unit 50 is located in the arrangement area AR. The drive unit 84 moves the pusher 82 downward by using an electric motor, an air cylinder, or the like as a power source. As a result, the pusher 82 pushes the electronic component holding portion 50 downward. Even if the position of the point of action of the force from the displacement drive unit 80 to the electronic component holding unit 50 (hereinafter referred to as "point of action P1") and the position of the suction nozzle 52 are different in the direction orthogonal to the displacement direction. Good.

As shown in FIG. 3, the pusher 82 is located above the connection block 55 in a state where the electronic component holding portion 50 is located in the arrangement area AR, and when the electronic component holding portion 50 is pushed downward, the pusher 82 of the connecting block 55 It is in contact with the upper surface 55b. That is, the point of action P1 of the force acting from the displacement drive unit 80 to the electronic component holding unit 50 is located on the upper surface 55b of the connection block 55. When the displacement drive unit 80 releases the state in which the upper surface 55b of the connection block 55 is applied with a downward force, the electronic component holding unit 50 returns to the position before the displacement due to the reaction force of the leaf springs 72a and 72b.

The holding position variable portion 70 may further have an auxiliary spring 78. The auxiliary spring 78 pushes the electronic component holding portion 50 toward the other side in the displacement direction. For example, the auxiliary spring 78 pushes the electronic component holding unit 50 in the direction opposite to the direction in which the displacement driving unit 80 pushes the electronic component holding unit 50. The position of the point of action of the force from the auxiliary spring 78 to the electronic component holding portion 50 (hereinafter referred to as "point of action P2") and the position of the point of action P1 of the force from the displacement drive unit 80 to the electronic component holding portion 50. May be different from each other in the direction orthogonal to the displacement direction (X-axis direction in the figure).

As an example, the electronic component holding portion 50 further has an expansion portion 56 (first expansion portion), the connection portion 24 further has an expansion portion 28 (second expansion portion), and the auxiliary spring 78 expands with the expansion portion 56. It is provided between the portion 28 and the portion 28. The expansion portion 56 projects from the inner surface 55a of the connection block 55 toward the outer surface 24a of the connection portion 24. The expansion portion 28 projects from the outer surface 24a of the connection portion 24 toward the inner surface 55a of the connection block 55. The expansion portion 28 is located below the expansion portion 56, and the upper surface 28a of the expansion portion 28 faces the lower surface 56b of the expansion portion 56.

The auxiliary spring 78 is, for example, a coil spring (compression coil spring). The auxiliary spring 78 is arranged between the expansion portion 28 and the expansion portion 56 with its central axis along the displacement direction, and the lower end of the auxiliary spring 78 is in contact with the upper surface 28a of the expansion portion 28, and the auxiliary spring 78 The upper end of is in contact with the lower surface 56b of the expansion portion 56. When the electronic component holding portion 50 is displaced from the transport position to the mounting position, the auxiliary spring 78 applies a force to the electronic component holding portion 50 in the direction from the mounting position to the transport position.

At least one of the connecting portion 24 and the electronic component holding portion 50 may have a guide pin 32 that guides the deformation direction of the auxiliary spring 78 along the displacement direction. For example, the connecting portion 24 further has a guide pin 32, and the electronic component holding portion 50 further has a guide hole 58. The guide pin 32 projects from the expansion portion 28 toward the expansion portion 56. The guide pin 32 is formed in a columnar shape, for example. The guide hole 58 penetrates the expansion portion 56 at a position corresponding to the guide pin 32. For example, the guide hole 58 penetrates the expansion portion 56 in the vertical direction (Z-axis direction in the drawing).

The end of the guide pin 32 is passed through the guide hole 58. The inner diameter of the guide hole 58 is larger than the outer diameter of the end portion of the guide pin 32. Therefore, a gap is provided between the outer peripheral surface of the guide pin 32 and the inner peripheral surface of the guide hole 58. This gap is set to be larger than the amount of displacement of the electronic component holding portion 50 in the direction perpendicular to the displacement direction. The displacement of the electronic component holding portion 50 in the direction perpendicular to the displacement direction is a displacement caused by the bending of the leaf springs 72a and 72b in the displacement direction. The auxiliary spring 78 is arranged so as to surround the guide pin 32. As a result, the deformation direction of the auxiliary spring 78 is restricted to the direction along the guide pin 32.

The expansion portion 28 may be arranged so as to sandwich at least one of the leaf springs 72a and 72b with the expansion portion 56, and the auxiliary spring 78 is the expansion portion 56 and the expansion portion of the leaf springs 72a and 72b. The leaf spring located between the 28 and the expansion portion 56 may be in contact with the expansion portion 56 and the expansion portion 28. One of the expansion portion 56 and the expansion portion 28 may be located between the leaf springs 72a and 72b, and the other of the expansion portion 56 and the expansion portion 28 may be located outside between the leaf springs 72a and 72b.

As an example, the expansion portion 28 is located between the leaf springs 72a and 72b, and the expansion portion 56 is located outside between the leaf springs 72a and 72b. More specifically, the expansion portion 56 is located above the leaf spring 72a. That is, the expansion portion 28 is arranged so as to sandwich the leaf spring 72a with the expansion portion 56. For example, the expansion portion 56 is located near the upper end of the connection block 55, and the upper surface 55b of the connection block 55 and the upper surface 56a of the expansion portion 56 are flush with each other. The expansion portion 56 may be located above the turntable 22.

The leaf spring 72a has an opening 76a through which the guide pin 32 penetrates. The opening 76a vertically penetrates the leaf spring 72a. The leaf spring 72b through which the guide pin 32 does not penetrate may have an opening 76b similar to the opening 76a. The position, shape and size of the opening 76b in the leaf spring 72b may be the same as the position, shape and size of the opening 76a in the leaf spring 72a. Thereby, even when the guide pin 32 penetrates the leaf spring 72a and does not penetrate the leaf spring 72b, the spring characteristic of the leaf spring 72b can be made substantially the same as the spring characteristic of the leaf spring 72a. The size of the openings 76a and 76b may be at least larger than the guide pin 32 and further larger than the guide hole 58.

The arrangement relationship between the expansion portions 28 and 56 and the leaf springs 72a and 72b is not limited to the above example. The expansion portion 28, the leaf spring 72b, the expansion portion 56, and the leaf spring 72a may be arranged from below in this order. That is, the expansion portion 56 may be located between the leaf springs 72a and 72b, and the expansion portion 28 may be located outside the leaf springs 72a and 72b (below the leaf spring 72b). In this way, the expansion portion 56 may be arranged at a position where the leaf spring 72b is sandwiched between the expansion portion 56 and the expansion portion 28. In this example, the leaf spring 72a may not be located between the extension 28 and the extension 56 (may be above the extension 56), and the leaf spring 72b may be located above the extension 28. It may be located between the extension portion 56 and the extension portion 56. In this case, the guide pin 32 and the auxiliary spring 78 may not penetrate through the opening 76a of the leaf spring 72a, and the guide pin 32 and the auxiliary spring 78 may penetrate through the opening 76b of the leaf spring 72b.

The expansion portion 28 and the expansion portion 56 may be located between the leaf springs 72a and 72b. In this case, the guide pin 32 and the auxiliary spring 78 may penetrate through the openings 76a and 76b of the leaf springs 72a and 72b. The expansion portion 28 and the expansion portion 56 may be located outside the leaf springs 72a and 72b. That is, the expansion portion 28 and the expansion portion 56 may be located above the leaf spring 72a or below the leaf spring 72b. In this case, the leaf springs 72a and 72b may not be provided with openings 76a and 76b.

The holding position variable portion 70 may have at least one other leaf spring in addition to the leaf springs 72a and 72b. In the example shown in FIG. 3, at least one other leaf spring may be provided below the expansion portion 28, or may be provided between the expansion portion 28 and the expansion portion 56. Further, one or more other leaf springs may be provided below the expansion portion 28, and one or more other leaf springs may be provided between the expansion portion 28 and the expansion portion 56. Another leaf spring may be formed in the same shape by the same material as the leaf springs 72a and 72b. The other leaf spring may also be provided with the same opening as the opening 76a (opening 76b). Even when the expansion portion 56 is located between the leaf springs 72a and 72b and the expansion portion 28 is located outside the leaf springs 72a and 72b, even if at least one other leaf spring is similarly provided. Good.

In the examples shown in FIGS. 3 and 4, the auxiliary spring 78 is provided at a position where it overlaps with the leaf springs 72a and 72b when viewed from above, but the auxiliary spring 78 is provided at a position where it does not overlap with the leaf springs 72a and 72b. May be done. In this case, the leaf springs 72a and 72b may not be provided with openings 76a and 76b, and the expansion portions 28 and 56 may not overlap with the leaf springs 72a and 72b when viewed from above. The holding position variable portion 70 does not have to have the auxiliary spring 78. In this case, the expansion portion 28, the guide pin 32, and the expansion portion 56 may not be provided.

The swivel portion 20 may further include a regulating portion 34 that regulates the movement of the electronic component holding portion 50 in the direction in which the auxiliary spring 78 pushes the electronic component holding portion 50 (for example, upward). For example, the swivel portion 20 further has a regulating portion 34 provided at the upper end of the guide pin 32. The regulating portion 34 is formed in a shape and size that cannot pass through the guide hole 58 (interferes with the peripheral edge portion of the guide hole 58). As an example, as shown in FIG. 4, the shape of the regulating portion 34 is a polygon whose maximum width is larger than the diameter of the guide hole 58 when viewed from above.

The regulation unit 34 is arranged at a height in contact with the upper surface 56a of the expansion unit 56 when the electronic component holding unit 50 is located at the transport position. As a result, even if the electronic component holding portion 50 tries to move above the transport position, it comes into contact with the regulating portion 34 and the movement is hindered. The auxiliary spring 78 may be configured to press the expansion portion 56 against the regulation portion 34 in a state where the expansion portion 56 is in contact with the regulation portion 34. For example, the natural length of the auxiliary spring 78 may be longer than the distance between the expansion portion 56 and the expansion portion 28 when the expansion portion 56 is in contact with the regulation portion 34.

The reaction force generated by the auxiliary spring 78 with respect to the displacement of the electronic component holding unit 50 by the displacement drive unit 80 may be larger than the total reaction force generated by the leaf springs 72a and 72b with respect to the displacement. For example, the spring constant of the auxiliary spring 78 with respect to the displacement may be 2 to 20 times, 5 to 15 times, or 8 to 12 times the spring constant of the leaf springs 72a and 72b. Good.

The controller 100 is a computer that controls the rotary transfer unit 10 according to a preset control procedure. In this control, the controller 100 controls the swivel drive unit 60 so as to move the electronic component holding unit 50 to any of the arrangement areas AR while the electronic component holding unit 50 holds the electronic component W at least. This is done, and the displacement drive unit 80 is controlled so as to displace the electronic component holding unit 50 that has moved to the arrangement area AR from the transport position to the mounting position in the vertical direction.

During the period in which the swivel drive unit 60 swivels the swivel unit 20, the electronic component holding unit 50 is arranged at the transport position. When the electronic component holding portion 50 is in the transport position, the extension portion 56 is pressed against the regulating portion 34 by the auxiliary spring 78. Therefore, the vibration of the electronic component holding portion 50 accompanying the movement of the swivel portion 20 is suppressed. When the electronic component holding unit 50 arranged in the arrangement area AR is displaced to the mounting position, the displacement drive unit 80 located in the arrangement area AR lowers the pusher 82. When the pusher 82 is lowered by a predetermined amount from the initial position, the pusher 82 comes into contact with the connection block 55 as shown in FIG. 5A.

Then, when the displacement drive unit 80 further applies a force to the point of action P1 by the pusher 82, the force with which the pusher 82 pushes the electronic component holding portion 50 exceeds the reaction force of the leaf springs 72a and 72b and the auxiliary spring 78, and the electronic component The holding portion 50 moves downward. At this time, as shown in FIG. 5B, since the leaf springs 72a and 72b are deformed while maintaining a substantially parallel state, the posture of the electronic component holding portion 50 is kept substantially constant. That is, the electronic component holding portion 50 is displaced downward while substantially maintaining the state in which the suction nozzle 52 is directed vertically downward.

When the electronic component holding portion 50 is displaced downward, the leaf springs 72a and 72b that were horizontal before the displacement are bent between the inner surface 55a of the connecting block 55 and the outer surface 24a of the connecting portion 24. Therefore, the distance between the inner surface 55a and the outer surface 24a is shorter than the total length of the leaf springs 72a and 72b. As a result, the electronic component holding portion 50 is also displaced in the horizontal direction toward the central axis Ax of the swivel portion 20. As long as the downward displacement of the electronic component holding portion 50 is smaller than the total length of the leaf springs 72a and 72b, the horizontal displacement of the electronic component holding portion 50 is minute. As described above, if the gap between the guide hole 58 and the guide pin 32 is set to be larger than the displacement amount of the electronic component holding portion 50 in the direction perpendicular to the displacement direction (X-axis direction in the drawing), Contact and rubbing between the electronic component holding portion 50 and the guide pin 32 due to the displacement of the electronic component holding portion 50 in the horizontal direction are suppressed.

In a state where the displacement drive unit 80 applies a force to the point of action P1 by the pusher 82 (a state in which the electronic component holding unit 50 is located at the mounting position), the electronic component W is between the electronic component holding unit 50 and the processing unit 16. Is delivered. For example, the suction of the electronic component W held by the suction nozzle 52 is released, and the electronic component W is passed from the electronic component holding unit 50 to the processing unit 16. Then, the displacement drive unit 80 reduces the force applied to the point of action P1. When the force applied to the point of action P1 decreases, the reaction force of the leaf springs 72a and 72b and the auxiliary spring 78 exceeds the force with which the pusher 82 pushes the electronic component holding portion 50, and the electronic component holding portion 50 is displaced upward.

After that, the electronic component holding unit 50 (expansion unit 56) hits the regulating unit 34, the ascending of the electronic component holding unit 50 stops, and the pusher 82 separates from the electronic component holding unit 50. As a result, the electronic component holding unit 50 is returned to a state in which it can be swiveled (conveyed) again. When the electronic component holding unit 50 that does not hold the electronic component W receives the electronic component W from the processing unit 16, the electronic component holding unit 50 may be lowered and raised in the same manner.

As described above, the processing device 1 according to one aspect of the present disclosure is located in the circulation orbit CR and the swivel portion 20 that can turn around the central axis Ax of the circulation orbit CR passing through the predetermined arrangement region AR. An electronic component holding portion 50 provided in the swivel portion 20, a holding position variable portion 70 that enables displacement of the electronic component holding portion 50 with respect to the swivel portion 20 in a predetermined displacement direction, and an electronic component that holds the electronic component W. The swivel drive unit 60 that swivels the swivel unit 20 around the central axis Ax so that the holding unit 50 is arranged in the arrangement area AR, and the electronic component holding unit 50 arranged in the arrangement area AR are moved to one side in the displacement direction. The displacement drive unit 80 provided in the arrangement area AR as described above is provided. The holding position variable portion 70 has two parallel leaf springs 72a and 72b that intersect the displacement direction and connect the electronic component holding portion 50 and the swivel portion 20.

Examples of the mechanism for guiding the displacement of the electronic component holding unit 50 in a predetermined displacement direction include a slide guide for guiding the movement of the electronic component holding unit 50 along the displacement direction. However, structural backlash is indispensable for the slide guide, and the movement of the electronic component holding portion in the direction perpendicular to the displacement direction cannot be completely regulated. It is also conceivable that play will increase over time due to wear and the like. On the other hand, according to the holding position variable portion 70 having two parallel leaf springs 72a and 72b that intersect in the displacement direction and connect the electronic component holding portion 50 and the swivel portion 20, the leaf springs 72a and 72b It is possible to allow the movement of the electronic component holding portion 50 in the direction perpendicular to the leaf springs 72a and 72b while restricting the movement of the electronic component holding portion 50 in the direction along the line without play.

According to the mechanism that enables the displacement of the electronic component holding portion 50 by the deformation of the leaf springs 72a and 72b, the displacement of the electronic component holding portion 50 in the direction perpendicular to the displacement direction (hereinafter referred to as "vertical displacement"). .) Will also occur. With respect to this displacement, the vertical displacement can be suppressed to a small value by setting the lengths of the leaf springs 72a and 72b sufficiently larger than the amount of displacement in the displacement direction. In addition, the magnitude of vertical displacement is less likely to change over time compared to the magnitude of structural backlash in the slide guide, so positioning accuracy can be improved by setting the position where vertical displacement is expected as the target position. The positioning accuracy can be maintained for a long period of time. Therefore, it is effective in improving the positioning accuracy of the electronic component W.

The displacement drive unit 80 is provided on the main body 81 fixed to the arrangement area AR so as not to rotate together with the swivel portion 20 and on the main body 81 so as to be displaceable along the displacement direction, and is provided on one side in the displacement direction. It may have a pusher 82 that pushes the electronic component holding unit 50 toward the user, and a drive unit 84 that moves the pusher 82 along the displacement direction. By providing the displacement drive unit 80 together with the swivel unit 20 in the arrangement area AR without turning, the mechanism for displacementing the electronic component holding unit 50 in the arrangement area AR is simplified.

The processing device 1 may include a plurality of electronic component holding units 50 and a plurality of holding position variable units 70. The plurality of electronic component holding portions 50 each enable displacement of the plurality of electronic component holding portions 50 with respect to the swivel portion 20. The swivel drive unit 60 swivels the swivel unit 20 so that each of the plurality of electronic component holding units 50 is sequentially arranged in the arrangement area AR. In this case, the plurality of electronic components W can be simultaneously conveyed by the plurality of electronic component holding units 50. Therefore, it is effective for efficient processing of the electronic component W.

The displacement drive unit 80 may be configured to push the electronic component holding unit 50 toward one side in the displacement direction. The holding position variable portion 70 may further include an auxiliary spring 78 that pushes the electronic component holding portion 50 toward the other side in the displacement direction. According to the leaf springs 72a and 72b, the moving direction of the electronic component holding portion 50 can be regulated without backlash, while the reaction force due to the leaf springs 72a and 72b causes variations in the thickness of the leaf springs 72a and 72b. It is easy to vary depending on each. On the other hand, as the auxiliary spring 78, a spring whose magnitude of reaction force can be easily adjusted can be used without considering the function of restricting the moving direction of the electronic component holding portion 50. Therefore, according to the above configuration in which the holding position variable portion 70 further has the auxiliary spring 78, the reaction force applied to the electronic component holding portion 50 by the holding position variable portion 70 can be adjusted with higher accuracy.

The swivel portion 20 may further include a regulating portion 34 that restricts the movement of the electronic component holding portion 50 in the direction in which the auxiliary spring 78 pushes the electronic component holding portion 50. In this case, by pressing the electronic component holding portion 50 against the regulating portion 34, the rigidity of the connecting portion between the electronic component holding portion 50 and the swivel portion 20 is increased. Further, the strength of the rigidity can be appropriately adjusted by the magnitude of the reaction force by the auxiliary spring 78. As a result, it is possible to suppress the vibration of the electronic component holding portion 50 in response to the rotation and stop of the swivel portion 20, so that the rotation speed of the swivel portion 20 can be easily increased. Increasing the rotation speed of the swivel unit 20 is effective in further improving the processing efficiency of the electronic component W.

The point of action P2 of the force from the auxiliary spring 78 to the electronic component holding portion 50 and the point of action P1 of the force acting from the displacement driving unit 80 to the electronic component holding portion 50 may be different in the direction orthogonal to the displacement direction. .. In this case, space saving can be achieved by utilizing the posture holding function of the electronic component holding portion 50 by the two leaf springs 72a and 72b.

The electronic component holding portion 50 may have an expansion portion 56 protruding toward the swivel portion 20. The swivel portion 20 may have an expansion portion 28 projecting toward the electronic component holding portion 50 at a position where at least two leaf springs 72a and 72b are sandwiched between the swivel portion 20 and the expansion portion 56. The auxiliary spring 78 may penetrate the leaf spring located between the expansion portion 56 and the expansion portion 28 of the two leaf springs 72a and 72b and come into contact with the expansion portion 56 and the expansion portion 28. In this case, space saving can be further achieved by using a part between the two leaf springs 72a and 72b as an arrangement space for the auxiliary spring 78.

Even if one of the expansion portion 56 and the expansion portion 28 is located between the two leaf springs 72a and 72b, and the other of the expansion portion 56 and the expansion portion 28 is located outside the two leaf springs 72a and 72b. Good. In this case, space saving can be further achieved by using the space between the two leaf springs 72a and 72b as the arrangement space for the expansion portion 56 or the expansion portion 28.

Of the two leaf springs 72a and 72b, the leaf spring located between the expansion portion 28 and the expansion portion 56 has an opening through which the auxiliary spring 78 penetrates, and is located between the expansion portion 28 and the expansion portion 56. A leaf spring that does not have the same opening as the above opening. In this case, the leaf spring through which the auxiliary spring 78 does not penetrate is provided with the same opening as the leaf spring through which the auxiliary spring penetrates, so that both space saving and positioning accuracy can be more reliably achieved.

The electronic component holding portion 50 may have a guide hole 58 penetrating the expansion portion 56. The swivel portion 20 may have a guide pin 32 that projects from the expansion portion 28 toward the expansion portion 56 and penetrates the guide hole 58 to guide the auxiliary spring 78. The gap between the guide hole 58 and the guide pin 32 may be set to be larger than the displacement amount of the electronic component holding portion 50 in the direction perpendicular to the displacement direction. In this case, the auxiliary spring 78 can be guided without hindering the displacement of the electronic component holding portion 50 according to the deformation of the two leaf springs 72a and 72b by the contact between the guide hole 58 and the guide pin 32. As a result, the reaction force applied to the electronic component holding portion 50 by the holding position variable portion 70 can be adjusted with higher accuracy.

The reaction force generated by the auxiliary spring 78 with respect to the displacement of the electronic component holding unit 50 by the displacement drive unit 80 may be larger than the total reaction force generated by the two leaf springs 72a and 72b with respect to the displacement. In this case, the reaction force applied to the electronic component holding portion by the holding position variable portion can be adjusted with higher accuracy.

Although the embodiments have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

1 ... processing device, 20 ... swivel part, 28 ... expansion part, 32 ... guide pin, 34 ... regulation part, 56 ... expansion part, 60 ... swivel drive part, 70 ... holding position variable part, 72a, 72b ... leaf spring, 78 ... Auxiliary spring, 80 ... Displacement drive unit, 90 ... Fixed plate, AR ... Arrangement area, CR ... Circulation trajectory, Ax ... Central axis.

Claims (5)

A swivel part that can swivel around the central axis of the transport circulation track that passes through a predetermined arrangement area,
An electronic component holding portion provided in the swivel portion so as to be located in the transport circulation track, and
A holding position variable portion that enables displacement of the electronic component holding portion with respect to the swivel portion in a predetermined displacement direction,
A rotation driving section to the electronic component holder holding the electronic parts to pivot the pivoting part about said central axis so as to place said placement area,
A displacement drive unit provided in the arrangement area so as to move the electronic component holding unit arranged in the arrangement area to one side in the displacement direction is provided.
The displacement drive unit is configured to push the electronic component holding unit toward one side in the displacement direction.
The holding position varying section, possess parallel leaf springs of several sheets double and an auxiliary spring,
Each of the plurality of parallel leaf springs extends along a direction intersecting the displacement direction to connect the electronic component holding portion and the swivel portion.
The auxiliary spring is configured to push the electronic component holding portion displaced to one side in the displacement direction by the displacement drive unit toward the other side in the displacement direction. apparatus. The displacement drive unit
A main body fixed to the arrangement area so as not to turn together with the turning part,
A pusher provided on the main body so as to be displaceable along the displacement direction and pushes the electronic component holding portion toward one side in the displacement direction.
The electronic component processing apparatus according to claim 1, further comprising a drive unit for moving the pusher along the displacement direction. A plurality of electronic component holding units including the electronic component holding unit, and
A plurality of holding position variable portions including the holding position variable portion are provided.
The plurality of variable holding position portions enable displacement of the plurality of electronic component holding portions with respect to the swivel portion.
The electronic component processing device according to claim 1 or 2, wherein the swivel drive unit swivels the swivel portion so that each of the plurality of electronic component holding portions is sequentially arranged in the arrangement region. The electronic component according to any one of claims 1 to 3 , further comprising a regulating portion that restricts the movement of the electronic component holding portion in a direction in which the auxiliary spring pushes the electronic component holding portion. Processing equipment. And the point of application of force from the auxiliary spring to the electronic component holder, and the point of action of the force from the displacement drive to the electronic component holder is different in the direction perpendicular to the displacement direction, claim The electronic component processing apparatus according to any one of 1 to 4 .

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