CN100568475C - Die bonder, the thermo-compressed strap cuts out and adhering method, and system - Google Patents
Die bonder, the thermo-compressed strap cuts out and adhering method, and system Download PDFInfo
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- CN100568475C CN100568475C CNB2007101364965A CN200710136496A CN100568475C CN 100568475 C CN100568475 C CN 100568475C CN B2007101364965 A CNB2007101364965 A CN B2007101364965A CN 200710136496 A CN200710136496 A CN 200710136496A CN 100568475 C CN100568475 C CN 100568475C
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- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000010521 absorption reaction Methods 0.000 claims abstract description 273
- 238000007731 hot pressing Methods 0.000 claims abstract description 201
- 239000000758 substrate Substances 0.000 claims abstract description 120
- 238000005520 cutting process Methods 0.000 claims abstract description 68
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000012423 maintenance Methods 0.000 claims description 48
- 238000003466 welding Methods 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000004513 sizing Methods 0.000 claims description 9
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000009795 derivation Methods 0.000 claims description 2
- 238000009950 felting Methods 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 abstract description 49
- 238000002788 crimping Methods 0.000 abstract description 20
- 238000009423 ventilation Methods 0.000 description 107
- 230000000694 effects Effects 0.000 description 11
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to die bonder, the thermo-compressed strap of die bonder cuts out and adhering method, and adhesive system.Problem of the present invention is, in die bonder, carries out the conveying of hot pressing tape splicing by simple structure, and the handover of the thermo-compressed strap of cut-out is bonding.Prevent to stop up when the hot pressing tape splicing from carrying.Die bonder comprises and is used for guide (33) that hot pressing tape splicing (41) is led that band absorption collet chuck (13) keeps substrate (35) and cutting knife (60).The hot pressing tape splicing (41) of band absorption collet chuck (13) on initial position absorption guide (33), the length direction of edge band leads to and keeps on the substrate.The hot pressing tape splicing (41) of drawing is adsorbed to be fixed in and keeps on the substrate (35).Cut off by cutting knife (60), form the thermo-compressed strap.Band absorption collet chuck (13) heat of adsorption crimping strap (23) is transplanted on the lead frame, and the thermo-compressed strap is bonded on the lead frame.Be with bonding after, band absorption collet chuck (13) resets to initial position.
Description
Technical field
The present invention relates to die bonder (die bonder) structure, and in die bonder, the hot pressing tape splicing of using from the semiconductor core chip bonding cuts out and the method for bonding thermo-compressed strap, and system.
Background technology
As the chips welding operation of one of semiconductor device manufacturing process, be meant the formed semiconductor chip of preceding operation is fixed on the chip of lead frame or lead frame.The chips welding operation in semiconductor chip fixing, use following thermal pressure welding method: on the hot pressing tape splicing of two sides cementability, form to engage and use resin, be cut into a certain size thermo-compressed strap, supply with chip, by this thermo-compressed strap, thermo-compressed semiconductor chip and chip (for example, with reference to patent documentation 1).
Generally, the width of the hot pressing tape splicing that uses and the width of semiconductor chip are roughly the same, the thermo-compressed strap is by the band conveying mechanism hot pressing tape splicing on the reel to be sent into shut-off mechanism by institute's sizing, by the band shut-off mechanism along with the rectangular direction of strip length direction, cut off to form.Therefore, the size of thermo-compressed strap is by the sendout decision of the band of the band conveying mechanism that band is passed out to shut-off mechanism.Conveying mechanism as such hot pressing tape splicing, following conveying mechanism is proposed: the mutual outer contacting of pair of rolls, drive the side revolution of described pair of rolls, the hot pressing tape splicing that will be clamped between the roller is sent to shut-off mechanism, perhaps at the pawl of configuration up and down of hot pressing tape splicing, by clamping band about this pawl, the hot pressing tape splicing is sent to shut-off mechanism (for example with reference to patent documentation 1-3).
The hot pressing tape splicing that the band conveying mechanism is sent to shut-off mechanism is cut off by shut-off mechanism, forms the thermo-compressed strap.Formed thermo-compressed strap by the strap bonding agency from the band shut-off mechanism pick up, be transplanted on the chip after, be positioned on the chip.Use the mouth or the collet chuck of absorption/release thermo-compressed strap, make it move up and down or all around, as strap bonding agency (for example with reference to patent documentation 1 and 3).
[patent documentation 1] spy opens flat 4-199720 communique
[patent documentation 2] spy opens the 2003-133341 communique
[patent documentation 3] spy opens the 2004-6599 communique
In the die bonder of patent documentation 1 or 3 prior arts of putting down in writing, above-mentioned band conveying mechanism and band bonding agency are assembled in wherein as the mechanism that separates respectively, complicated integral structure, the problem of existence maximization.
On the other hand, in recent years,, use than the thinner person of above-mentioned hot pressing tape splicing along with the slimming requirement of semiconductor device.The rigidity of this slim hot pressing tape splicing is low, therefore, in the band conveying mechanism of in patent documentation 1-3, putting down in writing, when being sent to shut-off mechanism, because of the frictional force between the face of shut-off mechanism and the band applies compression stress on the subband greater than the load of buckling of band, band is buckled and is produced so-called the obstruction, and existence can not be carried hot pressing tape splicing problem.
Summary of the invention
The present invention puts forward for solving the existing problem of above-mentioned prior art, first purpose of the present invention is, the handover, bonding die bonder of thermo-compressed strap that can carry out conveying, the cut-out of hot pressing tape splicing by simple structure is provided, and the hot pressing tape splicing cuts out and adhering method, and system.
Second purpose of the present invention is, the obstruction when the hot pressing tape splicing that prevents die bonder is carried.
In order to achieve the above object, the present invention proposes following technical scheme.
(1) a kind of die bonder, be provided with strap bonding agency and welding mechanism, the hot pressing tape splicing that described strap bonding agency is used from the semiconductor core chip bonding cuts out the thermo-compressed strap of institute's sizing, above-mentioned thermo-compressed strap is bonded on the welding object, described welding mechanism by above-mentioned by bonding thermo-compressed strap with above-mentioned semiconductor chip thermo-compressed on above-mentioned welding object; It is characterized in that:
This die bonder comprises:
Guide leads along its length to above-mentioned hot pressing tape splicing;
Keep substrate, with above-mentioned guide in abutting connection with setting, absorption keeps above-mentioned hot pressing tape splicing;
Cutting knife is used to cut off above-mentioned hot pressing tape splicing;
Band absorption collet chuck is used to adsorb above-mentioned hot pressing tape splicing;
Control part is carried out the action control of above-mentioned cutting knife and band absorption collet chuck, and the absorption of above-mentioned maintenance substrate control;
Above-mentioned control part comprises:
Band is drawn the unit, adsorbs hot pressing tape splicing on the above-mentioned guide by band absorption collet chuck, will cut off unit length towards length direction and be drawn out on the above-mentioned maintenance substrate;
The band absorbing unit is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned maintenance substrate;
The band cutting unit is cut to the thermo-compressed strap by above-mentioned cutting knife with the hot pressing tape splicing of said fixing;
The band felting cell, by above-mentioned band absorption collet chuck with above-mentioned thermo-compressed strap be transplanted on carry out on the above-mentioned welding object bonding;
Band absorption collet chuck reset unit makes above-mentioned band absorption collet chuck reset to above-mentioned guide top.
(2) in above-mentioned (1) described die bonder, it is characterized in that:
Above-mentioned guide absorption keeps above-mentioned hot pressing tape splicing;
Above-mentioned control part is controlled the absorption of above-mentioned guide;
Above-mentioned band absorbing unit is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned guide.
(3) in above-mentioned (1) or (2) described die bonder, it is characterized in that:
Above-mentioned control part is provided with band absorption collet chuck and keeps out of the way the unit, when cutting off fixing hot pressing tape splicing, makes above-mentioned band absorption collet chuck keep out of the way above-mentioned cutting knife and the hands-off retreating position of above-mentioned band absorption collet chuck.
(4) in above-mentioned (1) or (2) described die bonder, it is characterized in that:
Above-mentioned band absorption collet chuck is driven by servomotor.
(5) in above-mentioned (1) or (2) described die bonder, it is characterized in that:
Along throughput direction, above-mentioned guide is installed in the upstream side of band absorption collet chuck absorption initial position, forms the band path.
(6) a kind of thermo-compressed strap of die bonder cuts out and adhering method, described die bonder is provided with semiconductor chip is engaged the guide that the hot pressing tape splicing of usefulness leads along its length, with the maintenance substrate of above-mentioned guide in abutting connection with setting, the above-mentioned hot pressing tape splicing of absorption maintenance, be used to cut off the cutting knife of above-mentioned hot pressing tape splicing, be used to adsorb the band absorption collet chuck of above-mentioned hot pressing tape splicing; This method cuts out the thermo-compressed strap of institute's sizing from above-mentioned hot pressing tape splicing, and above-mentioned thermo-compressed strap is bonded on the welding object, it is characterized in that, comprising:
Band is drawn operation, adsorbs hot pressing tape splicing on the above-mentioned guide by above-mentioned band absorption collet chuck, will cut off unit length towards length direction and be drawn out on the above-mentioned maintenance substrate;
The band absorption process is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned maintenance substrate;
Band cuts off operation, by above-mentioned cutting knife the hot pressing tape splicing of said fixing is cut to the thermo-compressed strap;
The band bonding process, by above-mentioned band absorption collet chuck with above-mentioned thermo-compressed strap be transplanted on carry out on the above-mentioned welding object bonding;
The band absorption collet chuck operation that resets makes above-mentioned band absorption collet chuck reset to above-mentioned guide top.
(7) the thermo-compressed strap of above-mentioned (6) described die bonder cut out and adhering method in, it is characterized in that:
Above-mentioned guide absorption keeps above-mentioned hot pressing tape splicing;
Above-mentioned band absorption process is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned guide.
(8) the thermo-compressed strap of above-mentioned (6) or (7) described die bonder cut out and adhering method in, it is characterized in that:
Comprise that band adsorbs collet chuck and keeps out of the way operation, when cutting off fixing hot pressing tape splicing, make above-mentioned band absorption collet chuck keep out of the way above-mentioned cutting knife and the hands-off retreating position of above-mentioned band absorption collet chuck.
(9) a kind of thermo-compressed strap of die bonder cuts out and adhesive system, described die bonder is provided with semiconductor chip is engaged the guide that the hot pressing tape splicing of usefulness leads along its length, with the maintenance substrate of above-mentioned guide in abutting connection with setting, the above-mentioned hot pressing tape splicing of absorption maintenance, be used to cut off the cutting knife of above-mentioned hot pressing tape splicing, be used to adsorb the band absorption collet chuck of above-mentioned hot pressing tape splicing; Native system cuts out the thermo-compressed strap of institute's sizing from above-mentioned hot pressing tape splicing, and above-mentioned thermo-compressed strap is bonded on the welding object, it is characterized in that, comprising:
The band derivation mechanism adsorbs hot pressing tape splicing on the above-mentioned guide by above-mentioned band absorption collet chuck, will cut off unit length towards length direction and be drawn out on the above-mentioned maintenance substrate;
The band adsorbing mechanism is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned maintenance substrate;
The band shut-off mechanism is cut to the thermo-compressed strap by above-mentioned cutting knife with the hot pressing tape splicing of said fixing;
The band bonding agency, by above-mentioned band absorption collet chuck with above-mentioned thermo-compressed strap be transplanted on carry out on the above-mentioned welding object bonding;
Band absorption collet chuck resetting device makes above-mentioned band absorption collet chuck reset to above-mentioned guide top.
(10) the thermo-compressed strap of above-mentioned (9) described die bonder cut out and adhesive system in, it is characterized in that:
Above-mentioned guide absorption keeps above-mentioned hot pressing tape splicing;
Above-mentioned band adsorbing mechanism is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned guide.
(11) the thermo-compressed strap of above-mentioned (9) or (10) described die bonder cut out and adhesive system in, it is characterized in that:
Comprise that band adsorbs collet chuck and keeps out of the way mechanism, when cutting off fixing hot pressing tape splicing, make above-mentioned band absorption collet chuck keep out of the way above-mentioned cutting knife and the hands-off retreating position of above-mentioned band absorption collet chuck.
(12) a kind of thermo-compressed strap of die bonder cuts out and bonding procedure, described die bonder is provided with semiconductor chip is engaged the guide that the hot pressing tape splicing of usefulness leads along its length, with the maintenance substrate of above-mentioned guide in abutting connection with setting, the above-mentioned hot pressing tape splicing of absorption maintenance, be used to cut off the cutting knife of above-mentioned hot pressing tape splicing, be used to adsorb the band absorption collet chuck of above-mentioned hot pressing tape splicing; Native system cuts out the thermo-compressed strap of institute's sizing from above-mentioned hot pressing tape splicing, and above-mentioned thermo-compressed strap is bonded on the welding object, it is characterized in that, comprising:
Band is drawn program, adsorbs hot pressing tape splicing on the above-mentioned guide by above-mentioned band absorption collet chuck, will cut off unit length towards length direction and be drawn out on the above-mentioned maintenance substrate;
Band absorption program is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned maintenance substrate;
Band cut-out program is cut to the thermo-compressed strap by above-mentioned cutting knife with the hot pressing tape splicing of said fixing;
The band bonding procedure, by above-mentioned band absorption collet chuck with above-mentioned thermo-compressed strap be transplanted on carry out on the above-mentioned welding object bonding;
Band absorption collet chuck reset routine makes above-mentioned band absorption collet chuck reset to above-mentioned guide top.
(13) the thermo-compressed strap of above-mentioned (12) described die bonder cut out and bonding procedure in, it is characterized in that:
Above-mentioned guide absorption keeps above-mentioned hot pressing tape splicing;
Above-mentioned band absorption program is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned guide.
(14) the thermo-compressed strap of above-mentioned (12) or (13) described die bonder cut out and bonding procedure in, it is characterized in that:
Comprise that band adsorbs collet chuck and keeps out of the way program, when cutting off fixing hot pressing tape splicing, make above-mentioned band absorption collet chuck keep out of the way above-mentioned cutting knife and the hands-off retreating position of above-mentioned band absorption collet chuck.
The following describes effect of the present invention.
According to die bonder of the present invention, the thermo-compressed strap of die bonder cuts out and adhering method, and the thermo-compressed strap of die bonder cuts out and adhesive system, has the conveying that can carry out the hot pressing tape splicing by simple structure, the handover of the thermo-compressed strap that cuts off, bonding effect.In addition, has the effect of stopping up when the hot pressing tape splicing that can prevent die bonder is carried.
Description of drawings
Fig. 1 is the elevation of the die bonder structure of expression the invention process form.
Fig. 2 is the plane graph of the die bonder structure of expression the invention process form.
Fig. 3 is the structure of die bonder of expression the invention process form and the key diagram of control system.
Fig. 4 A and 4B are the key diagrams on plane of the die bonder of expression the invention process form.
Fig. 5 is the flow chart of the die bonder action of expression the invention process form.
Fig. 6 is the action specification figure of the die bonder action of expression the invention process form, the expression initial condition.
Fig. 7 is the action specification figure of the die bonder action of expression the invention process form, the decline and the heat of adsorption crimping band of expression band absorption collet chuck.
Fig. 8 is the action specification figure of the die bonder action of expression the invention process form, expression band absorption collet chuck heat of adsorption crimping band, and the hot pressing tape splicing is mentioned from guide.
Fig. 9 is the action specification figure of the die bonder action of expression the invention process form, and the expression band adsorbs collet chuck heat of adsorption crimping band, leads to keep on the substrate.
Figure 10 is the action specification figure of the die bonder action of expression the invention process form, and expression keeps the absorption action to the hot pressing tape splicing of substrate.
Figure 11 is the action specification figure of the die bonder action of expression the invention process form, and expression band absorption collet chuck descends, and with the hot pressing tape splicing of absorption collet chuck absorption to the absorption that keeps substrate.
Figure 12 is the action specification figure of the die bonder action of expression the invention process form, and the expression cutting knife cuts off the hot pressing tape splicing.
Figure 13 is the action specification figure of the die bonder action of expression the invention process form, and the expression cutting knife is towards the vertical motion of initial position.
Figure 14 is the action specification figure of the die bonder action of expression the invention process form, and the band absorption collet chuck of expression heat of adsorption crimping strap is from keeping the vertical motion of substrate.
Figure 15 is the action specification figure of the die bonder action of expression the invention process form, expression band absorption collet chuck moving on lead frame.
Figure 16 is the action specification figure of the die bonder action of expression the invention process form, and expression band absorption collet chuck makes the thermo-compressed strap bonding on lead frame.
Figure 17 is the action specification figure of the die bonder action of expression the invention process form, and expression band absorption collet chuck stops heat of adsorption crimping strap, and the rising of band absorption collet chuck.
Figure 18 is the action specification figure of the die bonder action of expression the invention process form, and expression band absorption collet chuck resets to initial position.
Figure 19 is the flow chart of the die bonder action of another example of expression the present invention.
Figure 20 is the action specification figure of the die bonder action of expression the present invention another example, and expression band absorption collet chuck descends, and with the hot pressing tape splicing of absorption collet chuck absorption to the absorption that keeps substrate.
Figure 21 is the action specification figure of the die bonder action of another example of expression the present invention, the action that the feasible band absorption of expression collet chuck rises.
Figure 22 is the action specification figure of the die bonder action of another example of expression the present invention, and expression makes band absorption collet chuck move to the action of retreating position.
Figure 23 is the action specification figure of the die bonder action of another example of expression the present invention, and the expression cutting knife cuts off the hot pressing tape splicing.
Figure 24 is the action specification figure of the die bonder action of another example of expression the present invention, and the expression cutting knife is towards the vertical motion of initial position.
Figure 25 is the action specification figure of the die bonder action of another example of expression the present invention, and expression makes band absorption collet chuck move to the action that is absorbed and fixed on the thermo-compressed strap that keeps on the substrate.
Figure 26 is the action specification figure of the die bonder action of another example of expression the present invention, and expression makes is with the absorption collet chuck to descend, and makes that being absorbed and fixed at the thermo-compressed strap that keeps on the substrate is adsorbed on the action of being with on the absorption collet chuck.
Figure 27 is the action specification figure of the die bonder action of another example of expression the present invention, and the band absorption collet chuck of expression heat of adsorption crimping strap is from keeping the vertical motion of substrate.
Symbol description is as follows:
The 10-die bonder, 11-is with bonding head, 12-is with bonding arm, 13-band absorption collet chuck, the 14-plumb joint, the 15-welding arm, 16-welds collet chuck, 17-framework feeder, the 18-wafer rack, 19-chip jack-up unit, 20-framework loader, the 21-framework unloads device, the 22-lead frame, 23-thermo-compressed strap, the 23a-bonding location, the 24-semiconductor chip, 31-hot pressing tape splicing conveying device, the 33-guide, 34a-fixed guide post, the 34b-guide plate, 34c-adjusts lead, 35-keeps substrate, 39-Z direction driving mechanism, 40-is with bonding caster bed, 41-hot pressing tape splicing, 42,43, the 44-air vent hole, 42a, 43a, the 44a-groove, 45,46, the 47-pipe arrangement of ventilating, 48-guide ventilation main valve, 49-keeps substrate ventilation main valve, 50-absorption collet chuck ventilation main valve, 51-guide ventilation reversal valve, 52-keeps substrate ventilation reversal valve, 53-absorption collet chuck ventilation reversal valve, the 55-vacuum plant, the 57-air blast, the 60-cutting knife, 61-cutting knife head guide, 63-cutting knife head, the 65-blade, the 67-reel, the 71-control part, the 73-data/address bus, the 75-storage part, 77-is with bonding driving interface, 79-Z direction driving mechanism interface, 80-cutting knife head driving mechanism interface, 81-guide ventilation main valve interface, 82-keeps substrate ventilation main valve interface, 83-absorption collet chuck ventilation main valve interface, 84-guide ventilation reversal valve interface, 85-keeps substrate ventilation reversal valve interface, 86-absorption collet chuck ventilation reversal valve interface, 100-strap bonding agency, 200-chips welding mechanism.
Embodiment
The preferable example of die bonder of the present invention is described with reference to the accompanying drawings.In following example, though to inscape, kind, combination, shape, configuration waits and has done various qualifications relatively,, these only exemplify, and the present invention is not limited thereto.
Embodiment 1
As depicted in figs. 1 and 2, die bonder 10 is provided with strap bonding agency 100, chips welding mechanism 200, framework feeder 17, and wafer rack 18.The hot pressing tape splicing 41 that described strap bonding agency 100 is used from the semiconductor core chip bonding cuts out the thermo-compressed strap 23 of institute's sizing, and thermo-compressed strap 23 is bonded in as on the lead frame 22 of adhering object or the semiconductor chip 24 that welded; Described chips welding mechanism 200 by bonding thermo-compressed strap 23 with semiconductor chip 24 thermo-compressed on lead frame 22; Described framework feeder 17 is supplied with strap bonding agency 100 and chips welding mechanism 200 with lead frame 22; Described wafer rack 18 keeps cut crystal.In the following description, be directions X with the throughput direction of lead frame 22, being the Y direction with the rectangular direction of directions X in the horizontal plane, with upper and lower to being that the Z direction describes.
Be with bonding 11 being with on the bonding caster bed 40, freely removable in the XY plane, be provided with in inside and make the Z direction driving mechanism 39 that moves with bonding arm 12 front end edge Z directions.Band with bonding arm 12 front ends adsorbs collet chuck 13 owing to the XY direction with bonding 11 moves and Z direction driving mechanism 39, can move freely in the XYZ direction.
Described relatively framework feeder 17, guide 33, maintenance substrate 35 and cutting knife 60 are located at the opposition side with bonding 11.The hot pressing tape splicing 41 that 33 pairs of guides are wound on the reel 67 is that directions X leads towards keeping substrate 35 along its length.When cut-out is transported next hot pressing tape splicing 41 by guide 33, keep substrate 35 absorption to keep hot pressing tape splicings 41.Relative guide 33 and maintenance substrate 35, cutting knife 60 is located at the opposition side with bonding 11, cuts off hot pressing tape splicing 41 between guide 33 and maintenance substrate 35, formation thermo-compressed strap 23.
Along framework feeder 17,, be provided with wafer rack 18 at the opposition side of plumb joint 14.On wafer rack 18, be provided with chip jack-up unit 19.Chip jack-up unit 19 is such devices: jack-up remains on a semiconductor chip 24 in the wafer on the wafer rack 18, make with other semiconductor chips 24 between produce difference in height, weld collet chuck 16 and can adsorb this semiconductor chip 24.
With reference to Fig. 3 and Fig. 4 A, the detailed structure and the control system of the strap bonding agency 100 of 4B explanation said chip bonding machine 10.Fig. 3 and Fig. 4 A, the XYZ direction among the 4B and Fig. 1, XYZ direction illustrated in fig. 2 are consistent.In addition, the same position mark same-sign that illustrated in Fig. 1, Fig. 2 illustrates omission.
Shown in Fig. 3, Fig. 4 A, strap bonding agency 100 is provided with is with bonding 11, guide 33, and keep substrate 35.Be with bonding the 11 bonding arm 12 of front end mounting strap, be with bonding arm 12 to be provided with band absorption collet chuck 13 at this.
Shown in Fig. 3, Fig. 4 A, guide 33 is provided with fixed guide post 34a and adjusts lead 34c on the spigot surface that along its length hot pressing tape splicing 41 is led, at each lead 34a, guide plate 34b is housed above the 34c.Adjusting lead 34c can be corresponding with the width of the hot pressing tape splicing of carrying 41, moves along the Width of hot pressing tape splicing 41.Shown in Fig. 4 A, 2 fixed guide post 34a and adjust lead 34c, can lead to hot pressing tape splicing 41 in hot pressing tape splicing 41 both sides along its length towards the throughput direction alternate configurations.And, be on the width of hot pressing tape splicing 41, to add the gap of carrying hot pressing tape splicing 41 necessity by the formed tape guide width of each lead 34a, 34c.Each lead 34a, 34c and guide plate 34b constitute the band path.
Shown in Fig. 3, Fig. 4 A, the tape feeding direction side at the band path of spigot surface along the width and the length direction of hot pressing tape splicing 41, is respectively equipped with a plurality of air vent holes 42, is provided with a plurality of groove 42a towards each air vent hole 42 of spigot surface.Each groove 42a is communicated with air vent hole 42.A plurality of air vent holes 42 link to each other with ventilation pipe arrangement 45 in the inside or the outside of guide 33.Be provided with at ventilation pipe arrangement 45 and be used to cut off the guide of air flows of pipe arrangement 45 main valve 48 of ventilating of ventilate.Guide ventilation main valve 48 is connected with guide ventilation reversal valve 51 by the air pipe arrangement.Guide ventilation reversal valve 51 is connected with air blast 57 with vacuum plant 55 by the air pipe arrangement, make guide ventilate main valve 48 with are switched vacuum plant 55 or being connected of air blast 57.In this example, guide ventilation reversal valve 51 is triple valves, and a side links to each other with guide ventilation main valve 48, and the opposing party links to each other with vacuum plant 55, also has a side to link to each other with air blast 57.
Shown in Fig. 3, Fig. 4 A, keep substrate 35 to draw direction in abutting connection with setting along the hot pressing tape splicing 41 of guide 33.Keep the height (Z direction position) of the spigot surface that hot pressing tape splicing 41 is led of adsorption plane and guide 33 of hot pressing tape splicing 41 of substrate 35 roughly the same, between guide 33 and maintenance substrate 35, be provided with for example minim gap of several microns degree.On the adsorption plane of the hot pressing tape splicing 41 that keeps substrate 35, be provided with a plurality of air vent holes 43 and groove 43a.And a plurality of air vent holes 43 are in the inside that keeps substrate 35 or outsidely be connected with ventilation pipe arrangement 46, are provided with at ventilation pipe arrangement 46 to be used to cut off the maintenance substrate of air flows of pipe arrangement 46 main valve 49 of ventilating of ventilating.Keep substrate ventilation main valve 49 to be connected with keeping substrate ventilation reversal valve 52 by the air pipe arrangement, keep substrate ventilation reversal valve 52 to be connected with air blast 57 with vacuum plant 55, make to keep substrate ventilation main valve 49 and are switched vacuum plant 55 or being connected of air blast 57 by the air pipe arrangement.In this example, keeping substrate ventilation reversal valve 52 and guide ventilation reversal valve 51 the same is triple valve.
Shown in Fig. 3, Fig. 4 A, be with bonding arm 12 to be installed in and be with on bonding 11, and be with bonding 11 being with bonding caster bed 40 upper edge XY directions to slide freely.The servomotor that the XY direction drives usefulness is installed on bonding 11, can be controlled driving and amount of movement with bonding 11 XY direction by its anglec of rotation.The servomotor of this XY direction driving usefulness also can not be installed on is with bonding 11, is with on the bonding caster bed 40 and be installed on, with the driving of bonding 11 XY direction and the control of amount of movement.The XY direction drives and is not limited to servomotor, also can carry out the driving of XY direction by general purpose motor, detects by position detector and is with bonding 11 position, FEEDBACK CONTROL general purpose motor.
Make the Z direction driving mechanism 39 that moves with bonding arm 12 front end edge Z directions being equipped with bonding 11.Z direction driving mechanism 39 can constitute: make by motor and rotate at the centre of gyration on bonding 11 with bonding arm 12 windings, make the band absorption collet chuck 13 of front end move along the Z direction, band absorption collet chuck 13 also can constitute: if can move along the Z direction, then do not make and be with bonding arm 12 wraparound commentaries on classics centers rotations, and make the linearity above-below direction with the linear guide on bonding 11 etc. and move along being located at.The linearity above-below direction moves occasion, can also can drive its above-below direction by electromagnetic force and move by the bonding arm 12 of linear electric motor band.Also can use the servomotor interlock with being installed in to drive with the XY direction on bonding 11 by cam etc., the realization above-below direction moves.By this spline structure, can move freely in the XYZ direction with the front end of bonding arm 12.
In hot pressing tape splicing side, the band absorption collet chuck 13 that is used for heat of adsorption crimping band 41 is housed with the front end of bonding arm 12.Band absorption collet chuck 13 has the plane adsorption plane of heat of adsorption crimping band 41.Fig. 4 B is a plane graph of seeing band absorption collet chuck 13 from this adsorption plane side.Shown in Fig. 4 B, on the adsorption plane of band absorption collet chuck 13, be provided with and same air vent hole 44 and the groove 44a of adsorption plane that keeps substrate.Each air vent hole 44 links to each other with ventilation pipe arrangement 47 by being located at the air flue in the bonding arm 12, is provided with at ventilation pipe arrangement 47 to be used to cut off the absorption collet chuck of air flows of pipe arrangement 47 main valve 50 of ventilating of ventilating.Absorption collet chuck ventilation main valve 50 is connected with absorption collet chuck ventilation reversal valve 53 by the air pipe arrangement, absorption collet chuck ventilation reversal valve 53 is connected with air blast 57 with vacuum plant 55 by the air pipe arrangement, makes absorption collet chuck ventilation main valve 50 and is switched vacuum plant 55 or being connected of air blast 57.In this example, absorption collet chuck ventilation reversal valve 53 is identical with guide ventilation reversal valve 51, is triple valve.Band absorption collet chuck 13 can be changed according to the size of the thermo-compressed strap 23 of the width of hot pressing tape splicing 41 and formation, and loading and unloading freely.
Shown in Fig. 4 A, be provided with cutting knife 60 on the next door of guide 33 and maintenance substrate 35.Cutting knife 60 is provided with cutting knife head 63 and cutting knife head guide 61, and described cutting knife head 63 is equipped with blade 65, and 61 pairs of cutting knife heads 63 of described cutting knife head guide lead along the Z direction.At cutting knife head 63 servomotor that the Z direction drives usefulness is housed, can makes blade 65 move along the Z direction.Drive cutting knife head 63 and be not limited to servomotor, also can drive by for example driving with cylinder.Blade 65 is installed in the position that its front end can insert between guide 33 and the maintenance substrate 35, can cut off hot pressing tape splicing 41, has the above length of width of hot pressing tape splicing 41.Also can blade be set, so that the face of the maintenance substrate-side of the face of guide 33 sides that can be by blade 65 and guide 33 cuts off hot pressing tape splicing 41 in the guiding side end face of the maintenance substrate-side of guide 33.
As shown in Figure 3, the strap bonding agency 100 of the die bonder 10 of this example is controlled by the 70 pairs of integral body of control part that comprise CPU71.Following equipment: be with bonding 11, Z direction driving mechanism 39, cutting knife head 63, guide ventilation main valve 48, keep substrate ventilation main valve 49, absorption collet chuck ventilation main valve 50, guide ventilation reversal valve 51, keep substrate ventilation reversal valve 52, absorption collet chuck ventilation reversal valve 53 is respectively by being with bonding driving interface 77, Z direction driving mechanism interface 79, cutting knife head driving mechanism interface 80, guide ventilation main valve interface 81, keep substrate ventilation main valve interface 82, absorption collet chuck ventilation main valve interface 83, guide ventilation reversal valve interface 84, keep substrate ventilation reversal valve interface 85, absorption collet chuck ventilation reversal valve interface 86 links to each other with data/address bus 73.Because data/address bus 73 links to each other with the CPU71 of control part 70, can control by 70 pairs of each equipment of control part.Data/address bus 73 is connected with storage part 75, and file is drawn program in advance, band absorption program, and band cut-out program, the band bonding procedure is with absorption collet chuck reset routine, and band absorption collet chuck is kept out of the way program, and controls and use program, and/or data etc.
In this example, vacuum plant 55, air blast 57 Be Controlled that links to each other with other control parts not shown in the figures, the operate condition of each equipment can be by the CPU71 of data/address bus 73 input control parts 70.The CPU71 of other control parts and control part 70 coordinates the control to each equipment of die bonder 10.But the said equipment also can link to each other with the CPU71 of control part 70 by each interface, constitutes the control part of one.
Die bonder 10 structures to this example are illustrated above, below, with reference to accompanying drawing to the thermo-compressed strap 23 of the die bonder 10 of this example cut out and bonding action describes.Fig. 5 is the flow chart of this example of expression action, and Fig. 6-Figure 18 is the action specification figure of expression operate condition.
As shown in Figure 6, in the initial condition before the die bonder 10 action beginnings of this example, band absorption collet chuck 13 is in following state: its adsorption plane is positioned at the top of air vent hole 42 of the tape feeding direction side of guide 33, from the adsorption plane of guide 33 towards Z direction upside, the for example position about 0.1～0.2mm of rising, hot pressing tape splicing 41 enter between the adsorption plane of the adsorption plane of band absorption collet chuck 13 and guide 33.In initial condition, guide ventilation main valve 48 shown in Figure 3, keep substrate ventilation main valve 49, absorption collet chuck ventilation main valve 50 all is in closed condition, each air vent hole 42,43,44 and each groove 42a, 43a, no air flows in the 44a, the hot pressing tape splicing 41 that is wound on the reel 67 passes through by fixed guide post 34a, adjust lead 34c, the band path that guide plate 34b forms is that directions X extends along its length, being set to its top becomes near the reference position of end face of maintenance substrate 35 sides that are positioned at guide 33, and hot pressing tape splicing 41 covers the air vent hole 42 and the groove 42a of the spigot surface that is positioned at guide 33.At this, the reference position is meant the position along the strip length direction of the blade tip of blade 65.In initial condition, the cutting knife head 63 of cutting knife 60 is in lifting position, guarantee with bonding arm 12 can be at blade 65 and guide 33, keep the space of moving between the substrate 35.
Then, if die bonder 10 begins action, shown in the step S101 of Fig. 5, the CPU71 of control part 70 confirms whether band absorption collet chuck 13 is positioned at the initial position of guide 33 tops, when band absorption collet chuck 13 does not have in the initial position occasion, the XY direction that the output order rotating band is bonding 11 drives with servomotor and 39 actions of Z direction driving mechanism, makes the initial position that moves on the guide 33 with bonding 11.From the instruction of the CPU71 of control part 70 by being with bonding driving interface 77, Z direction driving mechanism interface 79 respectively to being with bonding 11 and Z direction driving mechanism 39 to transmit control signals, make and be with bonding 11 and 39 actions of Z direction driving mechanism, make band absorption collet chuck 13 move to initial position.
Shown in the step S102 of Fig. 5, the CPU71 output order of control part 70 makes the band that is installed in bonding arm 12 front ends adsorb the spigot surface decline of collet chuck 13 towards guide 33 by Z direction driving mechanism 39.As shown in Figure 7, according to this instruction, 39 actions of Z direction driving mechanism descend band absorption collet chuck 13, begin band and draw operation.
Shown in the step S103 of Fig. 5, the CPU71 output order of control part 70 makes absorption collet chuck ventilation reversal valve 53 shown in Figure 3 switch to vacuum plant 55 sides.This instruction transmits to absorption collet chuck ventilation reversal valve 53 as control signal by absorption collet chuck ventilation reversal valve interface 86,53 actions of absorption collet chuck ventilation reversal valve, and absorption collet chuck ventilation reversal valve 53 is switched to vacuum plant 55 sides.Then, shown in the step S104 of Fig. 5, the instruction of absorption collet chuck ventilation main valve 50 is opened in the CPU71 of control part 70 output.This instruction transmits to absorption collet chuck ventilation main valve 50 as control signal by absorption collet chuck ventilation main valve interface 83,50 actions of absorption collet chuck ventilation main valve, and absorption collet chuck ventilation main valve 50 is opened.So as shown in Figure 7, vacuum plant 55 is communicated with ventilation pipe arrangement 47, sucks air from air vent hole 44 and the groove 44a that is located on the band absorption collet chuck 13, the adsorption plane of band absorption collet chuck 13 holds hot pressing tape splicing 41.
Shown in the step S105 of Fig. 5, the CPU71 of control part 70 output makes guide ventilation reversal valve 51 shown in Figure 3 switch to the instruction of air blast 57 sides.This instruction transmits to guide ventilation reversal valve 51 as control signal by guide ventilation reversal valve interface 84,51 actions of guide ventilation reversal valve, and guide ventilation reversal valve 51 switches to air blast 57 sides.Then, shown in the step S106 of Fig. 5, the instruction that the CPU71 of control part 70 output is opened guide ventilation main valve 48 shown in Figure 3.This instruction transmits to guide ventilation main valve 48 as control signal by guide ventilation main valve interface 81,48 actions of guide ventilation main valve, and guide ventilation main valve 48 is opened.So as shown in Figure 7, air blast 57 is communicated with ventilation pipe arrangement 45, spray air from the air vent hole 42 and the groove 42a of the spigot surface that is located at guide 33.
Shown in the step S107 of Fig. 5, the CPU71 of control part 70 output makes the band that is installed in bonding arm 12 front ends adsorb the instruction that collet chuck 13 rises along the Z direction by Z direction driving mechanism 39.As shown in Figure 8, according to this instruction, 39 actions of Z direction driving mechanism, band absorption collet chuck 13 rises.The height that band absorption collet chuck 13 rises, as long as the hot pressing tape splicing can guarantee when drawing and guide 33, keep gap between the substrate 35, for example, about 0.1～0.2mm.According to the kind of hot pressing tape splicing 41 and the physical dimension of rigidity or each one etc., can change this lifting height.As shown in Figure 8, band absorption collet chuck 13 is when heat of adsorption crimping band 41 rises, and air vent hole 42 and groove 42a ejection air from guide 33 are peeled off hot pressing tape splicing 41 easily from the spigot surface of guide 33.
Shown in the step S108 of Fig. 5, it is that directions X moves to the instruction that keeps on the substrate 35 along hot pressing tape splicing 41 length directions that the CPU71 of control part 70 output makes band absorption collet chuck 13.As shown in Figure 9,, drive with the servomotor action, the band absorption collet chuck 13 with bonding arm 12 front ends is moved on the maintenance substrate 35 towards hot pressing tape splicing 41 length directions with bonding 11 XY direction according to this instruction.By the servomotor precision control well with bonding 11 be the amount of movement of directions X along the strip length direction.As shown in Figure 9, the band absorption collet chuck 13 with bonding arm 12 front ends is moving on maintenance substrate 35 under the state that hot pressing tape splicing 41 is adsorbed on its adsorption plane.By this action, hot pressing tape splicing 41 is drawn out to towards length direction with the band of bonding arm 12 front ends absorption collet chuck 13 and keeps on the substrate.Hot pressing tape splicing 41 is located at each lead 34a, 34c on the guide 33 and the guiding of guide plate 34b when drawing, and is drawn as the crow flies along the length direction of band.And the top of hot pressing tape splicing 41 is drawn length from the reference position of the blade tip of blade 65 and is equivalent to the displacement of adsorbing collet chuck 13.
Like this, draw hot pressing tape splicing 41, carry along its length, therefore, can not apply compression stress during conveying hot pressing tape splicing 41.Thereby in the time of can preventing to carry hot pressing tape splicing 41, hot pressing tape splicing 41 buckling distortions produce to stop up and cause the conveying interruption, can carry hot pressing tape splicing 41 swimmingly along its length.In addition, because hot pressing tape splicing 41 does not have in course of conveying because of compression stress produces deflection, therefore the precision height of the amount of movement of band absorption collet chuck 13, improves the precision of drawing length of hot pressing tape splicing 41, can improve the delivery size precision of hot pressing tape splicing.Have again, because hot pressing tape splicing 41 is led by each lead 34a, 34c and guide plate 34b, therefore, even dwindle gap between each lead 34a, 34c and the hot pressing tape splicing 41 to improve directional precision, resistance does not increase in the time of can not passing through each lead 34a, 34c and guide plate 34b because of the hot pressing tape splicing yet, hot pressing tape splicing 41 produces and stops up, and has both improved the throughput direction precision, can carry hot pressing tape splicing 41 swimmingly along its length again.
As the step S109 of Fig. 5 and shown in Figure 9, bonding 11 of the CPU71 rotating band of control part 70 is that the length direction of thermo-compressed band 41 moves along directions X, moves it with upper/lower positions: the displacement along the length direction of hot pressing tape splicing 41 of band absorption collet chuck 13 becomes the cut-out unit length of being cut off a slice thermo-compressed strap 23 length that form by cutting knife 60.Then, shown in the step S110 of Fig. 5, if this displacement becomes the cut-out unit length, then output stops the instruction of moving towards directions X with bonding 11.According to this instruction, stop to move of directions X with bonding 11.With bonding 11 move halted state towards directions X under, the top of hot pressing tape splicing 41 is the cut-out unit length that directions X is drawn thermo-compressed strap 23 length from the reference position of the blade tip of blade 65 along the strip length direction.Then, if band absorption collet chuck 13 stops along the moving of directions X, then band is drawn operation and is finished.
Band is drawn operation one end, begins to be with absorption process.Shown in the step S111 of Fig. 5, the CPU71 of control part 70 output makes maintenance substrate ventilation reversal valve 52 shown in Figure 3 switch to the instruction of vacuum plant 55 sides.This instruction transmits to maintenance substrate reversal valve 52 as control signal by keeping substrate ventilation reversal valve interface 85, keeps 52 actions of substrate ventilation reversal valve, and maintenance substrate ventilation reversal valve 52 is switched to vacuum plant 55 sides.Then, shown in the step S112 of Fig. 5, the CPU71 of control part 70 output makes the instruction that keeps substrate ventilation main valve 49 to open.This instruction transmits to maintenance substrate ventilation main valve 49 as control signal by keeping substrate ventilation main valve interface 82, keeps substrate ventilation main valve 49 to move, and keeps substrate ventilation main valve 49 to become unlatching.So as shown in figure 10, vacuum plant 55 is communicated with ventilation pipe arrangement 46, suck air from being located at the air vent hole 43 and the groove 43a that keep substrate 35.In this state, hot pressing tape splicing 41 is attracted on the adsorption plane of band absorption collet chuck 13, separates for example gap about 0.1～0.2mm between the adsorption plane of hot pressing tape splicing 41 and maintenance substrate 35.
Shown in the step S113 of Fig. 5, the CPU71 of control part 70 output makes the band that is installed in bonding arm 12 front ends adsorb the instruction that collet chuck 13 descends towards the adsorption plane that keeps substrate 35 by Z direction driving mechanism 39.According to this instruction, 39 actions of Z direction driving mechanism descend band absorption collet chuck 13.If band absorption collet chuck 13 drops to the adsorption plane that keeps substrate 35, then as shown in figure 11, hot pressing tape splicing 41 is absorbed and fixed on the adsorption plane that keeps substrate 35.In addition, in the time of on dropping to the adsorption plane that keeps substrate 35, band absorption collet chuck 13 also can the clamping pushing be in the hot pressing tape splicing that keeps between substrate 35 and the band absorption collet chuck 13.As the step S114 of Fig. 5 and shown in Figure 11, the CPU71 of control part 70 output makes guide ventilation reversal valve 51 switch to the instruction of vacuum plant 55 sides.According to this instruction, guide ventilation reversal valve 51 is switched to vacuum plant 55 sides, sucks air from the air vent hole 42 and the groove 42a of the spigot surface of guide 33, and the hot pressing tape splicing 41 on the spigot surface is adsorbed and is fixed in spigot surface.Keep on substrate 35 and the guide 33 if hot pressing tape splicing 41 is adsorbed to be fixed in, then be with absorption process to finish.
Band absorption process one finishes, and begins band and cuts off operation.Shown in the step S115 of Fig. 5, the instruction that the CPU71 output of control part 70 descends the cutter head 63 of cutting knife 60, as shown in figure 12, according to this instruction, control cutter head 63 positions, angle of revolution by the control servomotor, by the Z direction position of control cutter head 63, control the Z direction position on the top of the blade 65 that is installed in cutter head 63.As the step S116 of Fig. 5 and shown in Figure 12, the blade tip of the blade 65 of cutter head 63 drops to the position that cuts off hot pressing tape splicing 41, and blade 65 cuts off hot pressing tape splicings 41.The top of hot pressing tape splicing 41 is that the reference position is drawn out on the maintenance substrate 35 along the strip length direction from blade 65 positions, only drawn length part of thermo-compressed strap 23, therefore, cut off, on the adsorption plane that keeps substrate 35, form thermo-compressed strap 23 by this.The reference position that becomes along strip length direction position on the top of the hot pressing tape splicing 41 after the cut-out is blade 65 positions.
Shown in the step S117 of Fig. 5, to cut off one and finish, the CPU71 output of control part 70 makes cutter head 63 rise to the instruction of initial position, and as shown in figure 13, according to this instruction, cutter head 63 rises to initial position, and band cuts off operation to be finished.In this example, band cuts off during the operation, absorption collet chuck ventilation reversal valve 53 is maintained at vacuum plant 55 sides, and absorption collet chuck ventilation main valve 50 is in opening, and band absorption collet chuck 13 becomes heat of adsorption crimping band 41 states, but, the present invention is not limited thereto, also can temporary close adsorb collet chuck ventilation main valve 50, carries out band and cut off operation, after band cuts off the operation end, open absorption collet chuck ventilation main valve 50 once more.
Finish if band cuts off operation, then begin to be with bonding process.As the step S118 of Fig. 5 and shown in Figure 14, the CPU71 of control part 70 output makes and keeps substrate ventilation reversal valve 52 to switch to the instruction of air blast pusher side.According to this instruction, keep substrate ventilation reversal valve 52 to be switched to the air blast pusher side, from the air vent hole 43 and the groove 43a ejection air of the adsorption plane that keeps substrate 35, the adsorption plane that keeps substrate 35 is heat of adsorption crimping band 41 not.
Shown in the step S119 of Fig. 5, keep thermo-compressed strap 23 if keep substrate 35 not adsorb, then the CPU71 of control part 70 output makes the instruction that band absorption collet chuck 13 rises.As shown in figure 14, according to this instruction, with 39 actions of bonding 11 Z direction driving mechanism, band absorption collet chuck 13 rises.
Shown in the step S120 of Fig. 5, the CPU71 of control part 70 output makes the instruction that keeps substrate ventilation main valve 49 to close.As shown in figure 15,, keep substrate ventilation main valve 49 to close, stop air vent hole 43 and groove 43a ejection air from adsorption plane according to this instruction.Shown in the step S121 of Fig. 5, the instruction that the CPU71 of control part 70 output is closed guide ventilation main valve 48.As shown in figure 15, according to this instruction, guide ventilation main valve 48 is closed, and stops air vent hole 42 and groove 42a absorption stationary heat crimping band 41 by guide 33.
Shown in the step S122 of Fig. 5, the CPU71 of control part 70 output makes band absorption collet chuck 13 move to the instruction of the bonding location 23a of the thermo-compressed strap 23 on the lead frame 22.As Figure 15 and shown in Figure 4, according to this instruction, be installed in the servomotor action that drives usefulness with the XY direction on bonding 11, move to and make band absorption collet chuck 13 become the bonding location 23a of thermo-compressed strap 23.In this moves, band absorption collet chuck 13 surpasses the framework feeder 17 that is positioned at the upside of the face that keeps substrate 35 along the Z direction, move on the lead frame 22, when mobile, not only the XY direction is mobile, and can make band absorption collet chucks 13 further rise along the Z direction by Z direction driving mechanism 39.Be installed in rotary position by control with the servomotor of the XY direction on bonding 11, the position along the XY direction of band absorption collet chuck 13 when energy control is mobile, the rotary position of the servomotor by control Z direction driving mechanism 39, the position of control Z direction.
Shown in the step S123 of Fig. 5, if the position of band absorption collet chuck 13 become on the lead frame 22 fixed bonding location 23a, then the CPU71 of control part 70 output stops the instruction of moving with absorption collet chuck 13.Then, shown in the step S124 of Fig. 5,, stop moving along XY direction and Z direction with absorption collet chuck 13 according to this instruction.
Shown in the step S125 of Fig. 5, the CPU71 of control part 70 output makes band absorption collet chuck 13 drop to the instruction on the lead frame 22.As shown in figure 16, according to this instruction, 39 actions of Z direction driving mechanism, band absorption collet chuck 13 is adsorbed on the adsorption plane under the state at thermo-compressed strap 23, descend towards lead frame 22, then, if band absorption collet chuck 13 drops on the lead frame 22, then thermo-compressed strap 23 is bonded on the lead frame 22.
Shown in the step S126 of Fig. 5, the CPU71 of control part 70 output makes absorption collet chuck ventilation reversal valve 53 switch to the instruction of air blast pusher side.As shown in figure 17, according to this instruction, absorption collet chuck ventilation reversal valve 53 is switched to the air blast pusher side, adsorbs the air vent hole 44 and the groove 44a ejection air of the adsorption plane of collet chuck 13 from band, and the adsorption plane of band absorption collet chuck 13 is heat of adsorption crimping strap 23 not.
Shown in the step S127 of Fig. 5, the instruction that the CPU71 of control part 70 output is risen band absorption collet chuck 13.As shown in figure 17, according to this instruction, 39 actions of Z direction driving mechanism, band absorption collet chuck 13 rises along the Z direction.If band absorption collet chuck 13 rises to institute's take the altitude, then shown in the step S128 of Fig. 5, the instruction of absorption collet chuck ventilation main valve 50 is closed in the CPU71 of control part 70 output.According to this instruction, absorption collet chuck ventilation main valve 50 is closed, and stops from the air vent hole 44 and the groove 44a ejection air of the adsorption plane of band absorption collet chuck 13.Then be with bonding process to finish if stop from band absorption collet chuck 13 ejection air.
If the band bonding process finishes, begin the band absorption collet chuck operation that resets.Shown in the step S129 of Fig. 5, the CPU71 of control part 70 output makes band absorption collet chuck 13 reset to the instruction of position originally.As shown in figure 18, according to this instruction, be installed in the servomotor action that drives usefulness with the XY direction on bonding 11, band absorption collet chuck 13 moves to initial position.In this moved, band absorption collet chuck 13 surpassed framework feeder 17 and moves to guide 33 tops, and therefore, when mobile, not only the XY direction moves, and can make band absorption collet chuck 13 further rise along the Z direction by Z direction driving mechanism 39.Be installed in the rotary position that drives the servomotor of usefulness with the XY direction on bonding 11 by control, the position along the XY direction of band absorption collet chuck 13 when energy control is mobile, the rotary position of the servomotor by control Z direction driving mechanism 39, the position of control Z direction.If band absorption collet chuck 13 resets to position originally, then the band absorption collet chuck operation that resets finishes.
Like this, draw in the operation at band, by band absorption collet chuck 13 heat of adsorption crimping bands 41, keeping substrate 35 to draw the cut-out unit length from initial position, in absorption process, the hot pressing tape splicing 41 of drawing is adsorbed on the adsorption plane that keeps substrate 35, in cutting off operation, cut off adsorbed hot pressing tape splicing 41 by cutting knife 60, become thermo-compressed strap 23, in the band bonding process, to be transplanted on by the thermo-compressed strap 23 of band absorption collet chuck 13 absorption carry out on the lead frame 22 bonding, in the operation that resets, stop absorption with 13 pairs of hot pressing tape splicings of bonding collet chuck, make it be reset to initial position.Draw operation by above-mentioned band repeatedly, absorption process cuts off operation, the band bonding process, the operation that resets can be that thermo-compressed strap 23 length carry hot pressing tape splicing 41 to cutting knife 60 repeatedly by cutting off unit length part, can be cut into thermo-compressed strap 23, be bonded on the lead frame 22.
The die bonder 10 of this example moves by band absorption collet chuck 13, can draw hot pressing tape splicing 41, the thermo-compressed strap 23 that cuts off is transplanted on lead frame 22, carry out bonding, therefore, needn't form the mechanism that forms thermo-compressed straps 23 from hot pressing tape splicing 41 respectively, and the thermo-compressed strap 23 that forms is bonded to mechanism on the lead frame 22, can constitute with a mechanism.Thus, have and to transport hot pressing tape splicing 41 with simple structure, the thermo-compressed strap 23 that cuts off is transferred, and carried out bonding effect.
The die bonder 10 of this example to keeping substrate 35 to draw the cut-out unit length, is carried hot pressing tape splicing 41 from initial position with band absorption collet chuck 13 heat of adsorption crimping bands 41 along its length, can not apply compression stress to hot pressing tape splicing 41 during conveying.Therefore, cause the conveying interruption because of hot pressing tape splicing 41 buckling distortions produce to stop up in the time of can preventing to carry, have the effect that to carry hot pressing tape splicing 41 swimmingly along its length.
In addition, hot pressing tape splicing 41 is drawn by 13 absorption of band absorption collet chuck, hot pressing tape splicing 41 no deflections in the conveying, the amount of movement along directions X of band absorption collet chuck 13 is controlled with servomotor by the XY direction driving with bonding 11, its amount of movement precision height, therefore, improve the precision that hot pressing tape splicing 41 is drawn length, had an effect that can improve hot pressing tape splicing delivery size precision.Hot pressing tape splicing 41 is drawn at band and is only drawn thermo-compressed strap 23 length in the operation and promptly cut off unit length, therefore, improves the delivery size precision, has improved the dimensional accuracy of the thermo-compressed strap 23 of final formation, has the effect that improves welding quality.
In this example, the fixed guide post 34a of guide 33, adjustment lead 34c, guide plate 34b lead to hot pressing tape splicing 41 at length direction, along throughput direction, described fixed guide post 34a, adjustment lead 34c, guide plate 34b are installed in the upstream side of the initial position of band absorption collet chuck 13, form the band path, hot pressing tape splicing 41 is drawn by 13 absorption of band absorption collet chuck by this band path.Therefore, even dwindle the interval between band path and the hot pressing tape splicing 41, make the straight along its length conveying occasion of hot pressing tape splicing 41, the obstruction that causes because of the resistance increase in the time of also can not taking place hot pressing tape splicing 41 by the band path can improve hot pressing tape splicing 41 throughput direction precision.Thus, improve the precision of angle between hot pressing tape splicing 41 and the blade 65, have the effect that improves formed thermo-compressed strap 23 form accuracies.
As mentioned above, the die bonder 10 of this example can transport hot pressing tape splicing 41 by simple structure, and the thermo-compressed strap 23 that transfer to cut off carries out bondingly, simultaneously, has and can prevent that hot pressing tape splicing 41 from the effect of stopping up taking place when carrying.
In this example, guide 33, keep on substrate 35 and the band absorption collet chuck 13 air vent hole 42 being set respectively, 43,44 and groove 42a, 43a, 44a, by each valve 48,49,50 and each reversal valve 51,52,53 make above-mentioned air vent hole 42,43,44 and groove 42a, 43a, 44a links to each other with air blast 57 with vacuum plant 55, by each valve 48,49,50 switching and each reversal valve 51,52,53 switching, from each air vent hole 42,43,44 and each groove 42a, 43a, 44a carries out air and sucks, ejection, stop, but the present invention is not limited thereto, as long as can be from each air vent hole 42,43,44 and each groove 42a, 43a, 44a carries out air and sucks, ejection, stop, also can use other structures.
Embodiment 2
Another example with reference to description of drawings die bonder of the present invention.Be marked with same symbol with embodiment 1 same section, omission is described.The die bonder 10 of this example is to cut out the thermo-compressed strap 23 littler than embodiment 1 size, and it is bonded on the lead frame 22.Therefore, hot pressing tape splicing 41 to keep on the substrate 35 to draw length short, be used to adsorb fixedly be drawn out to the air vent hole 43 that keeps the hot pressing tape splicing 41 on the substrate 35 and groove 43a and be made as with weak point and draw the corresponding scope of length.Therefore, the number of air vent hole 43 and groove 43a is lacked than embodiment 1.Other are identical with embodiment 1.
Below, with reference to accompanying drawing to the thermo-compressed strap 23 of the die bonder 10 of this example cut out and bonding action describes.Figure 19 is the flow chart of die bonder 10 actions of this example of expression, and Figure 20-Figure 27 is the action specification figure of expression operate condition.
Operation drawn by the band of the step S201-S214 of Figure 19 and the band absorption process is identical with the foregoing description 1.In band absorption process ending phase, as shown in figure 20, each air vent hole 42,43 of guide 33 and maintenance substrate 35 all is communicated with vacuum plant 55 shown in Figure 3, and hot pressing tape splicing 41 is absorbed and fixed at guide 33 and keeps on the substrate 35.Band absorption collet chuck 13 becomes the state that drops to the adsorption plane that keeps substrate 35.
If the band absorption process finishes, then begin band absorption collet chuck and keep out of the way operation.Shown in the step S215 of Figure 19, the CPU71 of control part 70 output makes absorption collet chuck ventilation reversal valve 53 shown in Figure 3 switch to the instruction of air blast pusher side.According to this instruction, absorption collet chuck ventilation reversal valve 53 is switched to the air blast pusher side.As shown in figure 21, air vent hole 44 and the groove 44a from band absorption collet chuck 13 sprays air.
As the step S216 of Figure 19 and shown in Figure 21, the CPU71 of control part 70 output makes the instructions that band absorption collet chucks 13 rise along the Z direction by Z direction driving mechanism 39.According to this instruction, with 39 actions of bonding 11 Z direction driving mechanism, band absorption collet chuck 13 rises.At this moment, adsorb the air vent hole 44 and the groove 44a ejection air of the adsorption plane of collet chuck 13 from band, therefore, band absorption collet chuck 13 can easily leave hot pressing tape splicing 41 and rise.
As the step S217 of Figure 19 and shown in Figure 22, the instruction that the CPU71 of control part 70 output is closed absorption collet chuck ventilation main valve 50 shown in Figure 3.According to this instruction, absorption collet chuck ventilation main valve 50 is closed, and stops from the air vent hole 44 and the groove 44a ejection air of the adsorption plane of band absorption collet chuck 13.
As the step S218 of Figure 19 and shown in Figure 22, the CPU71 of control part 70 output makes band absorption collet chuck 13 keep out of the way the instruction of retreating position from keeping substrate 35 tops.So long as the position that cutting knife 60 is not interfered with band absorption collet chuck 13, described retreating position both can be as shown in figure 22 the hot pressing tape splicing draw direction, also can keep out of the way from keeping substrate 35 upper edge Y directions.According to this instruction, be installed in the servomotor action that drives usefulness with the XY direction on bonding 11, band absorption collet chuck 13 moves to retreating position.In this moved, not only the XY direction moved, and can make band absorption collet chuck 13 further rise along the Z direction by Z direction driving mechanism 39.Be installed in the rotary position that drives the servomotor of usefulness with the XY direction on bonding 11 by control, the position along the XY direction of band absorption collet chuck 13 when energy control is mobile, the rotary position of the servomotor by control Z direction driving mechanism 39, the position of control Z direction.If band absorption collet chuck 13 moves to retreating position, then be with the absorption collet chuck to keep out of the way operation and finish.
If band absorption collet chuck is kept out of the way operation and finished, begin band and cut off operation.Shown in the step S219-S221 of Figure 19, carry out the action same with the foregoing description 1, cutter head 63 descends, and blade 65 cuts off hot pressing tape splicings 41, forms thermo-compressed strap 23, and cutter head 63 rises to initial position once more, and band cuts off operation to be finished.As Figure 23, shown in 24, this band cuts off during the operation, and band absorption collet chuck 13 becomes the state of keeping out of the way retreating position.
Finish if cut off operation, then begin the strap bonding process.As the step S222 of Figure 19 and shown in Figure 25, the CPU71 of control part 70 output makes band absorption collet chuck 13 come the instruction that is absorbed and fixed on the thermo-compressed strap 23 that keeps on the substrate 35.According to this instruction, be installed in the servomotor action that drives usefulness with bonding 11 XY direction, band absorption collet chuck 13 moves on the thermo-compressed strap 23.In this moved, not only the XY direction moved, and can make band absorption collet chuck 13 move along the Z direction by Z direction driving mechanism 39, became the institute take the altitude position on the thermo-compressed strap 23.Be installed in the rotary position that drives the servomotor of usefulness with the XY direction on bonding 11 by control, the position along the XY direction of band absorption collet chuck 13 when energy control is mobile, the rotary position of the servomotor by control Z direction driving mechanism 39, the position of control Z direction.
Be absorbed and fixed on the thermo-compressed strap 23 that keeps on the substrate 35 if band absorption collet chuck 13 is come, then as the step S223 of Figure 19 and shown in Figure 26, the CPU71 output of control part 70 makes the instructions of band absorption collet chucks 13 declines by Z direction driving mechanism 39.According to this instruction, with 39 actions of bonding 11 Z direction driving mechanism, band absorption collet chuck 13 descends towards the thermo-compressed strap 23 that keeps substrate 35.If band absorption collet chuck 13 drops to thermo-compressed strap 23, then as the step S224 of Figure 19 and shown in Figure 26, the CPU71 output of control part 70 makes the absorption collet chuck shown in Figure 3 reversal valve 53 of ventilating switch to the instruction of vacuum plant 55 sides.According to this instruction, absorption collet chuck ventilation reversal valve 53 is switched to vacuum plant 55 sides.Then, shown in the step S225 of Figure 19, the instruction that the CPU71 of control part 70 output is opened absorption collet chuck ventilation main valve 50 shown in Figure 3.According to this instruction, absorption collet chuck ventilation main valve 50 is opened, and sucks air from air vent hole 44 and the groove 44a that is positioned at the adsorption plane of being with absorption collet chuck 13, band absorption collet chuck 13 heat of adsorption crimping straps 23.
As the step S226 of Figure 19 and shown in Figure 27, the CPU71 of control part 70 output makes maintenance substrate ventilation reversal valve 52 shown in Figure 3 switch to the instruction of air blast pusher side.According to this instruction, keep substrate ventilation reversal valve 52 to be switched to the air blast pusher side, from the air vent hole 43 and the groove 43a ejection air that keep substrate 35, the adsorption plane of maintenance substrate 35 is heat of adsorption crimping strap 23 not.
As the step S227 of Figure 19 and shown in Figure 27, the instruction that the CPU71 of control part 70 output is risen band absorption collet chuck 13.According to this instruction, with 39 actions of bonding 11 Z direction driving mechanism, band absorption collet chuck 13 rises along the Z direction.
If band absorption collet chuck 13 rises, then same with the foregoing description 1, shown in the step S228-S237 of Figure 19, band absorption collet chuck 13 is transplanted on thermo-compressed strap 23 institute's allocation of lead frame 22, after being bonded in thermo-compressed strap 23 on the lead frame 22, each breather valve 48,49 shown in Figure 3,50 close, and the band bonding process finishes.If the band bonding process finishes, then begin the action identical with the foregoing description 1, begin the band absorption collet chuck operation that resets.Then, if band absorption collet chuck 13 resets to initial position, then the band absorption collet chuck operation that resets finishes.
Present embodiment can cut out and the effect of the thermo-compressed strap 23 of bonding smaller szie except having the effect identical with the foregoing description 1, also having.
In this example, guide 33, keep on substrate 35 and the band absorption collet chuck 13 air vent hole 42 being set respectively, 43,44 and groove 42a, 43a, 44a, by each valve 48,49,50 and each reversal valve 51,52,53 make above-mentioned air vent hole 42,43,44 and groove 42a, 43a, 44a links to each other with air blast 57 with vacuum plant 55, by each valve 48,49,50 switching and each reversal valve 51,52,53 switching, from each air vent hole 42,43,44 and each groove 42a, 43a, 44a carries out air and sucks, ejection, stop, but this example is not limited thereto, as long as can be from each air vent hole 42,43,44 and each groove 42a, 43a, 44a carries out air and sucks, ejection, stop, also can use other structures.
Above with reference to description of drawings embodiments of the invention, but the present invention is not limited to above-mentioned example.Can do all changes in the technology of the present invention thought range, they all belong to protection scope of the present invention.
Claims (11)
1. die bonder, be provided with strap bonding agency and welding mechanism, the hot pressing tape splicing that described strap bonding agency is used from the semiconductor core chip bonding cuts out the thermo-compressed strap of institute's sizing, above-mentioned thermo-compressed strap is bonded on the welding object, described welding mechanism by above-mentioned by bonding thermo-compressed strap with above-mentioned semiconductor chip thermo-compressed on above-mentioned welding object; It is characterized in that:
This die bonder comprises:
Guide leads along its length to above-mentioned hot pressing tape splicing;
Keep substrate, with above-mentioned guide in abutting connection with setting, absorption keeps above-mentioned hot pressing tape splicing;
Cutting knife is used to cut off above-mentioned hot pressing tape splicing;
Band absorption collet chuck is used to adsorb above-mentioned hot pressing tape splicing;
Control part is carried out the action control of above-mentioned cutting knife and band absorption collet chuck, and the absorption of above-mentioned maintenance substrate control;
Above-mentioned control part comprises:
Band is drawn the unit, adsorbs hot pressing tape splicing on the above-mentioned guide by band absorption collet chuck, will cut off unit length towards length direction and be drawn out on the above-mentioned maintenance substrate;
The band absorbing unit is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned maintenance substrate;
The band cutting unit is cut to the thermo-compressed strap by above-mentioned cutting knife with the hot pressing tape splicing of said fixing;
The band felting cell, by above-mentioned band absorption collet chuck with above-mentioned thermo-compressed strap be transplanted on carry out on the above-mentioned welding object bonding;
Band absorption collet chuck reset unit makes above-mentioned band absorption collet chuck reset to above-mentioned guide top.
2. according to the die bonder described in the claim 1, it is characterized in that:
Above-mentioned guide absorption keeps above-mentioned hot pressing tape splicing;
Above-mentioned control part is controlled the absorption of above-mentioned guide;
Above-mentioned band absorbing unit is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned guide.
3. according to the die bonder described in claim 1 or 2, it is characterized in that:
Above-mentioned control part is provided with band absorption collet chuck and keeps out of the way the unit, when cutting off fixing hot pressing tape splicing, makes above-mentioned band absorption collet chuck keep out of the way above-mentioned cutting knife and the hands-off retreating position of above-mentioned band absorption collet chuck.
4. according to the die bonder of claim 1 or 2 records, it is characterized in that:
Above-mentioned band absorption collet chuck is driven by servomotor.
5. according to the die bonder of claim 1 or 2 records, it is characterized in that:
Along throughput direction, above-mentioned guide is installed in the upstream side of band absorption collet chuck absorption initial position, forms the band path.
6. the thermo-compressed strap of a die bonder cuts out and adhering method, described die bonder is provided with semiconductor chip is engaged the guide that the hot pressing tape splicing of usefulness leads along its length, with the maintenance substrate of above-mentioned guide in abutting connection with setting, the above-mentioned hot pressing tape splicing of absorption maintenance, be used to cut off the cutting knife of above-mentioned hot pressing tape splicing, be used to adsorb the band absorption collet chuck of above-mentioned hot pressing tape splicing; This method cuts out the thermo-compressed strap of institute's sizing from above-mentioned hot pressing tape splicing, and above-mentioned thermo-compressed strap is bonded on the welding object, it is characterized in that, comprises;
Band is drawn operation, adsorbs hot pressing tape splicing on the above-mentioned guide by above-mentioned band absorption collet chuck, will cut off unit length towards length direction and be drawn out on the above-mentioned maintenance substrate;
The band absorption process is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned maintenance substrate;
Band cuts off operation, by above-mentioned cutting knife the hot pressing tape splicing of said fixing is cut to the thermo-compressed strap;
The band bonding process, by above-mentioned band absorption collet chuck with above-mentioned thermo-compressed strap be transplanted on carry out on the above-mentioned welding object bonding;
The band absorption collet chuck operation that resets makes above-mentioned band absorption collet chuck reset to above-mentioned guide top.
7. the thermo-compressed strap according to the die bonder described in the claim 6 cuts out and adhering method, it is characterized in that;
Above-mentioned guide absorption keeps above-mentioned hot pressing tape splicing;
Above-mentioned band absorption process is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned guide.
8. the thermo-compressed strap according to the die bonder described in claim 6 or 7 cuts out and adhering method, it is characterized in that;
Comprise that band adsorbs collet chuck and keeps out of the way operation, when cutting off fixing hot pressing tape splicing, make above-mentioned band absorption collet chuck keep out of the way above-mentioned cutting knife and the hands-off retreating position of above-mentioned band absorption collet chuck.
9. the thermo-compressed strap of a die bonder cuts out and adhesive system, described die bonder is provided with semiconductor chip is engaged the guide that the hot pressing tape splicing of usefulness leads along its length, with the maintenance substrate of above-mentioned guide in abutting connection with setting, the above-mentioned hot pressing tape splicing of absorption maintenance, be used to cut off the cutting knife of above-mentioned hot pressing tape splicing, be used to adsorb the band absorption collet chuck of above-mentioned hot pressing tape splicing; Native system cuts out the thermo-compressed strap of institute's sizing from above-mentioned hot pressing tape splicing, and above-mentioned thermo-compressed strap is bonded on the welding object, it is characterized in that, comprising:
The band derivation mechanism adsorbs hot pressing tape splicing on the above-mentioned guide by above-mentioned band absorption collet chuck, will cut off unit length towards length direction and be drawn out on the above-mentioned maintenance substrate;
The band adsorbing mechanism is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned maintenance substrate;
The band shut-off mechanism is cut to the thermo-compressed strap by above-mentioned cutting knife with the hot pressing tape splicing of said fixing;
The band bonding agency, by above-mentioned band absorption collet chuck with above-mentioned thermo-compressed strap be transplanted on carry out on the above-mentioned welding object bonding;
Band absorption collet chuck resetting device makes above-mentioned band absorption collet chuck reset to above-mentioned guide top.
10. the thermo-compressed strap according to the die bonder described in the claim 9 cuts out and adhesive system, it is characterized in that:
Above-mentioned guide absorption keeps above-mentioned hot pressing tape splicing;
Above-mentioned band adsorbing mechanism is absorbed and fixed at above-mentioned hot pressing tape splicing of drawing on the above-mentioned guide.
11. the thermo-compressed strap according to the die bonder described in claim 9 or 10 cuts out and adhesive system, it is characterized in that:
Comprise that band adsorbs collet chuck and keeps out of the way mechanism, when cutting off fixing hot pressing tape splicing, make above-mentioned band absorption collet chuck keep out of the way above-mentioned cutting knife and the hands-off retreating position of above-mentioned band absorption collet chuck.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007005397 | 2007-01-15 | ||
| JP2007005397A JP5002267B2 (en) | 2007-01-15 | 2007-01-15 | Die bonder, die bonding and thermobonding tape piece cutting and pasting method and program |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101226885A CN101226885A (en) | 2008-07-23 |
| CN100568475C true CN100568475C (en) | 2009-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101364965A Active CN100568475C (en) | 2007-01-15 | 2007-07-10 | Die bonder, the thermo-compressed strap cuts out and adhering method, and system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5002267B2 (en) |
| KR (1) | KR100874367B1 (en) |
| CN (1) | CN100568475C (en) |
| TW (1) | TW200830435A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6527817B2 (en) * | 2015-12-11 | 2019-06-05 | リンテック株式会社 | Sheet sticking apparatus and sticking method |
| CN109742040B (en) * | 2019-01-04 | 2024-08-20 | 吉林华微电子股份有限公司 | Mucous membrane machine and mucous membrane method |
| CN110212252B (en) * | 2019-07-02 | 2024-06-21 | 博众精工科技股份有限公司 | Rubber coating machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767162A (en) * | 2004-10-26 | 2006-05-03 | 育霈科技股份有限公司 | Chip-size package structure and forming method of the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3147548B2 (en) * | 1992-11-17 | 2001-03-19 | 松下電器産業株式会社 | Apparatus for sticking conductive film |
| JP3063436B2 (en) * | 1992-11-25 | 2000-07-12 | 松下電器産業株式会社 | Apparatus for sticking conductive film |
| JP3886266B2 (en) * | 1998-09-30 | 2007-02-28 | オプトレックス株式会社 | ACF sticking device for liquid crystal display panel |
| KR100469169B1 (en) * | 2002-08-14 | 2005-02-02 | 삼성전자주식회사 | Apparatus for bonding stack chip using insulating adhesive tape |
| JP4249570B2 (en) | 2003-08-26 | 2009-04-02 | パナソニック株式会社 | Tape application method |
| JP4723216B2 (en) | 2004-09-06 | 2011-07-13 | リンテック株式会社 | Tape sticking device, mounting device, and mounting method |
| JP2006187862A (en) * | 2006-03-07 | 2006-07-20 | Lintec Corp | Cutting apparatus and cutting method |
| JP2008159913A (en) * | 2006-12-25 | 2008-07-10 | Shinkawa Ltd | Tape transfer device, method and program thereof |
-
2007
- 2007-01-15 JP JP2007005397A patent/JP5002267B2/en active Active
- 2007-06-23 TW TW096122662A patent/TW200830435A/en not_active IP Right Cessation
- 2007-07-10 CN CNB2007101364965A patent/CN100568475C/en active Active
- 2007-08-09 KR KR1020070080077A patent/KR100874367B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767162A (en) * | 2004-10-26 | 2006-05-03 | 育霈科技股份有限公司 | Chip-size package structure and forming method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI351065B (en) | 2011-10-21 |
| CN101226885A (en) | 2008-07-23 |
| JP2008172114A (en) | 2008-07-24 |
| KR100874367B1 (en) | 2008-12-18 |
| JP5002267B2 (en) | 2012-08-15 |
| TW200830435A (en) | 2008-07-16 |
| KR20080067274A (en) | 2008-07-18 |
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