TW202122331A - Electronic component processing device - Google Patents

Abstract

This electronic component processing device comprises: a swivel unit; an electronic component holding unit that is provided to the swivel unit; a holding position variable unit that enables displacement of the electronic component holding unit with respect to the swivel unit in a predetermined displacement direction; a swivel drive unit that causes the swivel unit to turn; and a displacement drive unit that is provided so as to move the electronic component holding unit to one side in the displacement direction. The holding position variable unit has a plurality of parallel plate springs that intersect the displacement direction and connect the electronic component holding unit and the swivel unit.

Description

Processing device for electronic parts

The present invention relates to a processing device for electronic parts.

Patent Document 1 discloses an electronic component inspection device including a rotating platform and an electronic component holding device attached to the outer peripheral end of the rotating platform. The electronic component inspection device has a suction nozzle that can be raised and lowered with respect to the mounting position of the electronic component, and the suction nozzle is lowered to the mounting position to remove the electronic component from the mounting position or obtain the electronic component from the mounting position. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2012/073282

[The problem to be solved by the invention]

The present invention provides a processing device for electronic parts, which can effectively improve the positioning accuracy of electronic parts. [Technical means to solve the problem]

An electronic component processing device of one aspect of the present invention is provided with: a winding part which can be wound around the central axis of a conveying circulating track passing through a predetermined arrangement area; an electronic part holding part, which is provided in the winding part so as to be positioned at the carrying Circulating track is used; the holding position variable part can displace the electronic part holding part with respect to the winding part in a predetermined displacement direction; the winding drive part is used to keep the electronic part holding part of the electronic part arranged in the arrangement area. The revolving part revolves around the central axis; and the displacement driving part, which is provided in the arrangement area, and moves the electronic component holding part arranged in the arrangement area to one side of the displacement direction. The holding position variable part has a plurality of parallel leaf springs that are staggered with the displacement direction and connect the electronic component holding part and the winding part. [Effects of Invention]

According to the present invention, a processing device for electronic parts is provided, which can effectively improve the positioning accuracy of electronic parts.

Hereinafter, the embodiment will be described in detail with reference to the drawings. In the description, the same symbols are attached to the same elements or the same functions, and repeated descriptions are omitted.

The electronic component processing device 1 of this embodiment is a so-called work sorting machine, which carries the electronic components W formed in the pre-processing process such as cutting, and performs processing such as appearance inspection, electrical characteristic inspection, marking, etc. , A device packed with storage components such as tape, storage tube, tray, etc. The processing apparatus 1 exemplified below is an apparatus for performing various processes such as inspection on the electronic component W received from the component supply unit, and packaging the electronic component W in a storage member without bonding the electronic component W to a substrate or the like.

As shown in FIG. 1 and FIG. 2, the processing device 1 includes a rotating conveyance unit 10 and a controller 100. The conveyance unit 10 is rotated to move the electronic component W along the circulation track CR (circulation track for conveyance). The electronic component W to be conveyed has two main surfaces Wa and Wb parallel to each other, and an outer peripheral surface Wc surrounding the main surfaces Wa and Wb (see FIG. 3). The rotating conveyance unit 10 has a winding unit 20, a plurality of electronic component holding units 50, a plurality of holding position variable units 70, a winding drive unit 60, and a displacement drive unit 80.

The revolving part 20 can revolve around the central axis Ax of the circulating track CR passing through the plurality of arrangement areas AR. The revolving part 20 has a rotating platform 22 that is provided to be revolved around the central axis Ax, and a plurality of connecting parts 24. The outer circumference of the rotating platform 22 is located on the inner side of the circulating track CR. For example, the circulating orbit CR is a horizontal circular orbit, and the central axis Ax is vertical.

The plural arrangement areas AR may be set at equal intervals along the circulating track CR. The plural arrangement areas AR are areas where the winding part 20 does not move even if it is wound. For example, in at least a part of a plurality of arrangement areas AR passing through the circulating track CR, the electronic components W from the winding part 20 to the processing part 16 are accepted. Specific examples of the processing unit 16 include: a parts supply unit that supplies electronic components W, a collection unit that collects electronic parts W and packs them in a housing member, and performs predetermined processing on electronic parts W between the parts supply unit and the collection unit. The intermediate processing department. Examples of the intermediate processing unit include an inspection unit that performs an appearance inspection of the electronic component W, an inspection unit that inspects the electrical characteristics of the electronic component W, and a marking unit that marks the electronic component W. The plurality of connecting portions 24 are arranged at equal intervals along the outer circumference of the rotating platform 22, and each protrudes from the rotating platform 22 to the outer circumferential side.

The plurality of electronic component holding parts 50 are provided in the winding part 20 so as to be located in the circulation track CR. For example, the plurality of electronic component holding parts 50 are arranged at equal intervals along the circulation track CR, and are respectively attached to the plurality of connection parts 24. In addition, in this manual, "installation" does not only refer to the case of direct installation, but also includes the case of installation through other components. As an example, the number of the plurality of electronic component holding parts 50 may be the same as the number of the plurality of arrangement areas AR. The pitch angle at which the plurality of electronic component holding parts 50 are arranged along the circulating track CR (the angle between the adjacent electronic part holding parts 50), and the pitch angle at which the plural arrangement areas AR are arranged along the circulating track CR is The same can be used.

Each of the plurality of electronic component holding parts 50 holds the electronic component W. The electronic component holding portion 50 may hold the electronic component W in any manner. Specific examples of the method of holding the electronic component W include negative pressure (vacuum) suction, electrostatic suction, and holding. For example, the electronic component holding portion 50 sucks either one of the main surfaces Wa and Wb by negative pressure from one side in the direction orthogonal to the rotating table 22 (the Z-axis direction in the figure).

As shown in FIG. 2, the holding position variable part 70 connects the winding part 20 and the electronic component holding part 50 so that the electronic component holding part 50 can be displaced relative to the winding part 20 in a predetermined direction. Hereinafter, the direction in which the electronic component holding portion 50 can be displaced by the holding position variable portion 70 is referred to as the "displacement direction". For example, the holding position variable part 70 can displace the electronic component holding part 50 in a direction perpendicular to the rotating platform 22 (the Z-axis direction in the figure). As an example, the holding position variable part 70 can displace the electronic component holding part 50 between the conveyance position and the placement position.

The transport position is a position where the electronic component holding part 50 is arranged when the winding part 20 is wound, and is set at the same height position as the rotating platform 22, for example. The placement position is a position where the electronic component W is received and delivered to the processing unit 16, and is set at a position (in the negative direction of the Z axis) below the transport position.

The driving part 60 is revolved so that the revolving part 20 is revolved around the central axis Ax. The revolving drive unit 60 uses, for example, an electric motor as a power source, and rotates the rotating platform 22 around the central axis Ax by direct drive without gears. The plurality of electronic component holding parts 50 are mounted on the rotating platform 22, so as the rotating platform 22 rotates, the plural electronic component holding parts 50 move along the circulating track CR (rotate around the central axis Ax). The revolving drive unit 60 revolves the revolving unit 20 so that each of the plurality of electronic component holding units 50 is sequentially arranged in one arrangement area AR. For example, the drive unit 60 is revolved to revolve the reel 20 intermittently, and the plural electronic component holding units 50 are temporarily stopped in the plural arrangement areas AR, respectively. Thereby, in one arrangement area AR, one of the plurality of electronic component holding parts 50 is temporarily stopped in order.

As shown in FIG. 3, the electronic component holding part 50 may also have a suction nozzle 52, a suction nozzle holder 54, and a connecting block 55.

The suction nozzle 52 is located on the circulating track CR. The suction nozzle 52 opens below, and sucks either one of the main surfaces Wa and Wb of the electronic component W by negative pressure from above. For example, the suction nozzle 52 extends perpendicularly to the rotating platform 22, and its lower end opens below. The electronic component holding portion 50 further has a valve (not shown) for switching the on and off of the negative pressure suction of the suction nozzle 52 in response to the input of the control signal. As a specific example of the valve, a solenoid valve or the like is exemplified.

The suction nozzle holder 54 holds the suction nozzle 52. The suction nozzle 52 protrudes downward from the suction nozzle holder 54. The connecting block 55 is adjacent to the side of the rotating platform 22 with respect to the nozzle holder 54 and faces the connecting portion 24. Hereinafter, the surface of the outer surface of the connecting block 55 facing the connecting portion 24 is referred to as "inner surface 55a", and the surface of the outer surface of the connecting portion 24 facing the connecting block 55 is called "outer surface 24a". .

The holding position variable part 70 has a plurality of parallel leaf springs. The holding position variable part 70 has, for example, two parallel leaf springs. Hereinafter, one of the two leaf springs will be referred to as the "plate spring 72a", and the other will be described as the "plate spring 72b".

The leaf springs 72 a and 72 b are staggered with the displacement direction of the electronic component holding portion 50 and connect the electronic component holding portion 50 and the winding portion 20. For example, the leaf springs 72a and 72b are separated from each other and arranged up and down, and each extend horizontally to connect the inner surface 55a of the block 55 and the outer surface 24a of the connecting portion 24. The distance between the leaf spring 72a and the leaf spring 72b may be larger than the thickness of the rotating platform 22. Two parallel leaf springs 72a and 72b connect the electronic component holding portion 50 and the winding portion 20, thereby restricting the direction in which the electronic component holding portion 50 displaces the winding portion 20 (moving operation of the electronic component holding portion 50). That is, the leaf springs 72a and 72b have a function of guiding the movement of the electronic component holding portion 50 to the winding portion 20.

The leaf spring 72a and the leaf spring 72b may be formed to have the same spring characteristics. For example, the leaf spring 72a and the leaf spring 72b are made of the same material. In addition, the leaf spring 72a and the leaf spring 72b have the same shape. In addition, the same shape means not only the case where the leaf spring 72a and the leaf spring 72b are completely consistent, but also the case where they are substantially the same.

The displacement drive part 80 moves the electronic component holding part 50 arrange|positioned in the arrangement area|region AR to one side of a displacement direction. For example, the displacement drive unit 80 moves the electronic component holding unit 50 downward in the vertical direction. The rotating conveyance unit 10 may be provided with a plurality of displacement driving units 80. The plurality of displacement driving units 80 are respectively provided in the plurality of arrangement areas AR. The plurality of displacement driving parts 80 are respectively fixed to the plurality of arrangement areas AR, so that the winding part 20 does not move even if the winding part 20 is rotated. In addition, in the arrangement area AR where it is not necessary to displace the electronic component holding part 50, the displacement driving part 80 may not be provided. One displacement driving part 80 moves the electronic component holding parts 50 sequentially arranged in the arrangement area AR where the displacement driving part 80 is fixed to one side of the displacement direction.

Returning to FIG. 2, the rotating conveyance unit 10 may further include a fixing plate 90 that fixes (holds) a plurality of displacement driving units 80. The fixing plate 90 is, for example, a plate-shaped member arranged above the rotating platform 22 of the winding part 20. The fixed plate 90 is configured not to be wound together with the rotating platform 22. The plurality of displacement driving parts 80 are fixed to the fixed plate 90 in a state where each is located in the plurality of arrangement areas AR. Therefore, the plurality of displacement driving parts 80 will not move even if the winding part 20 is rotated.

The displacement driving unit 80 includes, for example, a main body 81, a push rod 82, and a driving unit 84. The main body part 81 is fixed to the arrangement area AR so as not to be wound together with the rotating platform 22 (the winding part 20). For example, the main body 81 is fixed to a portion corresponding to the arrangement area AR among the outer edges of the fixing plate 90. The push rod 82 is provided on the main body 81 so as to be displaceable in the displacement direction with respect to the main body 81. For example, the push rod 82 is held by the main body 81 and can move in the vertical direction. The push rod 82 is located above the electronic component holding portion 50 when the electronic component holding portion 50 is located in the arrangement area AR. The driving unit 84 uses an electric motor, a pneumatic cylinder, or the like as a power source to move the push rod 82 downward. Thereby, the electronic component holding portion 50 is pressed downward by the push rod 82. The position of the point of application of the force from the displacement driving section 80 to the electronic component holding section 50 (hereinafter referred to as the "point of application P1") and the position of the suction nozzle 52 may be different in the direction orthogonal to the displacement direction.

As shown in FIG. 3, the push rod 82 is located above the connecting block 55 when the electronic component holding portion 50 is located in the arrangement area AR, and contacts the connecting block 55 when the electronic component holding portion 50 is pressed downward.的上55b. That is, the point of action P1 of the force from the displacement driving portion 80 to the electronic component holding portion 50 is located on the upper surface 55b of the connecting block 55. If the displacement driving part 80 releases the state in which downward force is applied to the upper surface 55b of the connecting block 55, the electronic component holding part 50 will be returned to the position before displacement by the reaction force of the leaf springs 72a and 72b.

The holding position variable part 70 may further have an auxiliary spring 78. The auxiliary spring 78 presses the electronic component holding portion 50 toward the other side of the displacement direction. For example, the auxiliary spring 78 presses the electronic component holding portion 50 in a direction opposite to the direction in which the displacement driving portion 80 presses the electronic component holding portion 50. The position of the point of application of the force from the auxiliary spring 78 to the electronic component holding portion 50 (hereinafter referred to as "point of application P2") and the position of the point of application P1 of the force from the displacement driving portion 80 to the electronic component holding portion 50 are at The direction orthogonal to the displacement direction (the X-axis direction in the figure) may be different.

As an example, the electronic component holding portion 50 further has an expansion portion 56 (first expansion portion), the connection portion 24 further has an expansion portion 28 (second expansion portion), and the auxiliary spring 78 is provided between the expansion portion 56 and the expansion portion 28. The expansion portion 56 protrudes from the inner surface 55 a of the connecting block 55 toward the outer surface 24 a of the connecting portion 24. The expansion portion 28 protrudes from the outer surface 24 a of the connecting portion 24 toward the inner surface 55 a of the connecting block 55. The expansion portion 28 is located below the expansion portion 56, and the upper surface 28 a of the expansion portion 28 and the lower surface 56 b of the expansion portion 56 are opposed to each other.

The auxiliary spring 78 is, for example, a coil spring (compression coil spring). The auxiliary spring 78 is arranged between the expansion part 28 and the expansion part 56 with its central axis along the displacement direction. The lower end of the auxiliary spring 78 is in contact with the upper surface 28a of the expansion part 28, and the upper end of the auxiliary spring 78 is in contact with the expansion part. The lower surface 56b of the section 56. The auxiliary spring 78 applies force to the electronic component holding section 50 in the direction from the placing position to the transporting position when the electronic component holding section 50 is displaced from the transport position to the placing position.

At least one of the connecting portion 24 and the electronic component holding portion 50 may have a guide pin 32 that guides the deformation direction of the auxiliary spring 78 along the displacement direction. For example, the connecting portion 24 further has a guide pin 32, and the electronic component holding portion 50 further has a guide hole 58. The guide pin 32 protrudes from the expansion part 28 toward the expansion part 56. The guide pin 32 is formed in a cylindrical shape, for example. The guide hole 58 penetrates the expansion part 56 at a position corresponding to the guide pin 32. For example, the guide hole 58 penetrates the expansion part 56 in the vertical direction (the Z-axis direction in the figure).

The end of the guide pin 32 passes through the guide hole 58. The inner diameter of the guide hole 58 is larger than the outer diameter of the end of the guide pin 32. Therefore, a gap is provided between the outer circumferential surface of the guide pin 32 and the inner circumferential surface of the guide hole 58. This gap is set to be larger than the displacement amount of the electronic component holding portion 50 in the direction perpendicular to the displacement direction. In addition, the displacement of the electronic component holding portion 50 in the direction perpendicular to the displacement direction is the displacement caused by the deflection of the leaf springs 72a and 72b in the displacement direction. The auxiliary spring 78 is arranged to surround the guide pin 32. Thereby, the deformation direction of the auxiliary spring 78 is restricted to be along the direction of the guide pin 32.

The expansion portion 28 is arranged to sandwich at least one of the leaf springs 72a, 72b between at least the expansion portion 56, and the auxiliary spring 78 provides the leaf spring between the expansion portion 56 and the expansion portion 28 among the leaf springs 72a, 72b. It may penetrate through and contact the expansion part 56 and the expansion part 28. One of the expansion part 56 and the expansion part 28 is arranged between the leaf springs 72a and 72b, and the other orientation of the expansion part 56 and the expansion part 28 may be other than between the leaf springs 72a and 72b.

As an example, the expansion part 28 is positioned between the leaf springs 72a and 72b, and the expansion part 56 is positioned outside of the space between the leaf springs 72a and 72b. More specifically, the expansion portion 56 is located above the leaf spring 72a. That is, the expansion part 28 is arranged to sandwich the leaf spring 72a between the expansion part 56 and the expansion part 56. For example, the expansion portion 56 is located near the upper end of the connecting block 55, and the upper surface 55b of the connecting block 55 and the upper surface 56a of the expansion portion 56 are in the same plane. The expansion part 56 may be positioned above the rotating platform 22.

The leaf spring 72a has an opening 76a through which the guide pin 32 penetrates. The opening 76a penetrates the leaf spring 72a vertically. The leaf spring 72b through which the guide pin 32 does not penetrate may have the same opening 76b as the opening 76a. The position, shape, and size of the opening 76b of the leaf spring 72b may be the same as the position, shape, and size of the opening 76a of the leaf spring 72a. Thereby, even if the guide pin 32 penetrates the leaf spring 72a and does not penetrate the leaf spring 72b, the spring characteristics of the leaf spring 72b and the spring characteristics of the leaf spring 72a can be made substantially the same. The size of the openings 76a and 76b is at least larger than the guide pin 32, or even larger than the guide hole 58.

The mutual arrangement relationship of the expansion parts 28, 56 and the leaf springs 72a, 72b is not limited to the above-mentioned example. The expansion portion 28, the leaf spring 72b, the expansion portion 56, and the leaf spring 72a may be arranged from below in this order. That is, the expansion part 56 may be positioned between the leaf springs 72a and 72b, and the expansion part 28 may be positioned outside the leaf springs 72a and 72b (below the leaf spring 72b). As described above, the expansion part 56 may be arranged at a position where the leaf spring 72b is sandwiched between the expansion part 28 and the expansion part 28. In this example, the leaf spring 72a may be located between the expansion portion 28 and the expansion portion 56 (it may also be located above the expansion portion 56), and the leaf spring 72b may be located between the expansion portion 28 and the expansion portion 56. In this case, the guide pin 32 and the auxiliary spring 78 do not penetrate through the opening 76a of the leaf spring 72a, and the guide pin 32 and the auxiliary spring 78 may penetrate through the opening 76b of the leaf spring 72b.

The expansion part 28 and the expansion part 56 may be located between the leaf springs 72a and 72b. In this case, the guide pin 32 and the auxiliary spring 78 may penetrate through the openings 76a, 76b of the leaf springs 72a, 72b. The expansion part 28 and the expansion part 56 may be located outside the leaf springs 72a and 72b. That is, the expansion portion 28 and the expansion portion 56 may be located above the leaf spring 72a or below the leaf spring 72b. In this case, the openings 76a and 76b may not be provided in the leaf springs 72a and 72b.

The holding position variable part 70 may have at least one other leaf spring in addition to the leaf springs 72a and 72b. In the example shown in FIG. 3, at least one other leaf spring may be provided below the expansion portion 28 or may be provided between the expansion portion 28 and the expansion portion 56. In addition, one or more other leaf springs may be provided below the expansion portion 28, and more than one other leaf spring may be provided between the expansion portion 28 and the expansion portion 56. The other leaf springs may be made of the same material as the leaf springs 72a and 72b, and may be formed in the same shape. The other leaf spring may be provided with the same opening as the opening 76a (opening 76b). In addition, when the expansion part 56 is positioned between the leaf springs 72a and 72b, and the expansion part 28 is positioned outside the leaf springs 72a and 72b, at least one other leaf spring may be provided in the same manner.

In the example shown in FIGS. 3 and 4, although the auxiliary spring 78 is provided at a position overlapping the leaf springs 72a and 72b when viewed from above, the auxiliary spring 78 may be provided at a position that does not overlap the leaf springs 72a and 72b. . In this case, the openings 76a and 76b may not be provided in the leaf springs 72a and 72b, and the expansion portions 28 and 56 may not overlap the leaf springs 72a and 72b when viewed from above. The holding position variable part 70 may not have the auxiliary spring 78. In this case, the expansion part 28, the guide pin 32, and the expansion part 56 may not be provided.

The winding portion 20 may further have a restricting portion 34 that restricts the movement of the auxiliary spring 78 to the electronic component holding portion 50 in the direction (for example, upward) that presses the electronic component holding portion 50. For example, the winding portion 20 further has a restricting portion 34 provided at the upper end of the guide pin 32. The restricting portion 34 is formed in a shape and size that cannot pass through the guide hole 58 (which interferes with the peripheral edge of the guide hole 58). As an example, as shown in FIG. 4, the shape of the restricting portion 34 is a polygon having a maximum width larger than the diameter of the guide hole 58 when viewed from above.

The restricting portion 34 is arranged at a height that contacts the upper surface 56 a of the expansion portion 56 when the electronic component holding portion 50 is located at the above-mentioned conveying position. Thereby, even if the electronic component holding part 50 tries to move above the conveyance position, it will contact the restricting part 34 and the movement will be hindered. The auxiliary spring 78 may be configured to abut the expansion portion 56 against the restriction portion 34 when the expansion portion 56 is in contact with the restriction portion 34. For example, the natural length of the auxiliary spring 78 may be longer than the interval between the expansion portion 56 and the expansion portion 28 in a state where the expansion portion 56 is in contact with the restricting portion 34.

The reaction force of the auxiliary spring 78 to the displacement of the electronic component holding part 50 caused by the displacement drive part 80 may be greater than the total of the reaction forces of the leaf springs 72a and 72b to the displacement. For example, the spring constant of the auxiliary spring 78 for the aforementioned displacement may be 2-20 times, 5-15 times, or 8-12 times the spring constant of the leaf springs 72a and 72b.

The controller 100 is a computer that controls the rotary conveyance unit 10 in a control sequence set in advance. In this control, the controller 100 executes at least the following: in a state where the electronic component holder 50 holds the electronic component W, it controls the winding drive unit 60 to move the electronic component holder 50 to any arrangement area AR; control The drive unit 80 is displaced to displace the electronic component holding unit 50 that has moved to the arrangement area AR from the conveyance position to the placement position in the vertical direction.

While the winding drive part 60 is winding the winding part 20, the electronic component holding part 50 is arrange|positioned at the said conveyance position. When the electronic component holding portion 50 is at the transport position, the expansion portion 56 is pressed against the restricting portion 34 by the auxiliary spring 78. Therefore, the vibration of the electronic component holding portion 50 accompanying the movement of the winding portion 20 is suppressed. When displacing the electronic component holding part 50 arranged in the arrangement area AR to the placing position, the displacement driving part 80 arranged in the arrangement area AR lowers the push rod 82. If the push rod 82 is lowered from the initial position by a predetermined amount, as shown in FIG. 5( a ), the push rod 82 contacts the connecting block 55.

Then, if the displacement driving part 80 further applies a force to the point of application Pl by the push rod 82, the force of the push rod 82 pressing the electronic component holding part 50 will exceed the reaction force of the leaf springs 72a, 72b and the auxiliary spring 78, causing the electronic The component holding part 50 moves downward. At this time, as shown in FIG. 5(b), the leaf springs 72a and 72b are deformed while maintaining a substantially parallel state, so the posture of the electronic component holding portion 50 is maintained substantially constant. That is, the electronic component holding portion 50 substantially holds the suction nozzle 52 in a state of facing vertically downward and displaces downward.

Furthermore, if the electronic component holding portion 50 is displaced downward, the plate springs 72a and 72b, which were horizontal before the displacement, will bend between the inner surface 55a of the connection block 55 and the outer surface 24a of the connection portion 24. Therefore, the distance between the inner surface 55a and the outer surface 24a becomes shorter than the total length of the leaf springs 72a and 72b. Thereby, the electronic component holding part 50 will also be displaced in the horizontal direction toward the central axis Ax of the winding part 20. As long as the downward displacement of the electronic component holding portion 50 is smaller than the total length of the leaf springs 72a and 72b, the horizontal displacement of the electronic component holding portion 50 is still small. As described above, if the gap between the guide hole 58 and the guide pin 32 is set to be larger than the displacement of the electronic component holding portion 50 in the direction perpendicular to the displacement direction (the X-axis direction in the figure), it can be suppressed The contact and friction between the electronic component holding portion 50 and the guide pin 32 caused by the displacement of the electronic component holding portion 50 in the horizontal direction.

In the state in which the displacement driving section 80 applies force to the point of application Pl by the push rod 82 (the state where the electronic component holding section 50 is in the placement position), the electronic component W is operated between the electronic component holding section 50 and the processing section 16 Accept. For example, the suction of the electronic component W held by the suction nozzle 52 is released, and the electronic component W is delivered from the electronic component holding unit 50 to the processing unit 16. Then, the drive unit 80 is displaced to reduce the force applied to the point of application Pl. If the force applied to the point of application P1 decreases, the reaction force of the leaf springs 72a, 72b and the auxiliary spring 78 exceeds the force of the push rod 82 pressing the electronic component holding portion 50, and the electronic component holding portion 50 is displaced upward.

After that, the electronic component holding portion 50 (expansion portion 56) abuts on the restricting portion 34, the ascent of the electronic component holding portion 50 is stopped, and the push rod 82 is separated from the electronic component holding portion 50. Thereby, the electronic component holding part 50 is returned to the state which can be rewound (transported) again. In addition, when the electronic component holding unit 50 that does not hold the electronic component W receives the electronic component W from the processing unit 16, the electronic component holding unit 50 may be lowered and raised in the same manner.

As described above, the processing device 1 of one aspect of the present invention includes: a winding part 20 which can be wound around the central axis Ax of the circulating track CR passing through the predetermined arrangement area AR; and the electronic component holding part 50 The winding part 20 is arranged to be located on the circulating track CR; the holding position variable part 70 can make the electronic component holding part 50 displace the winding part 20 in a predetermined displacement direction; the winding driving part 60 is used to hold the electronic part W The electronic component holding portion 50 is arranged in the arrangement area AR so that the winding portion 20 is wound around the central axis Ax; and the displacement driving portion 80 is arranged in the arrangement area AR so that the electronic component holding portion 50 arranged in the arrangement area AR moves toward One side of the displacement direction moves. The holding position variable part 70 has two parallel leaf springs 72 a and 72 b that are staggered with the above-mentioned displacement direction and connect the electronic component holding part 50 and the winding part 20.

As a mechanism for guiding the displacement of the electronic component holding portion 50 in a predetermined displacement direction, a sliding guide that guides the movement of the electronic component holding portion 50 along the displacement direction is exemplified. However, the sliding guide is structurally indispensable and cannot completely restrict the movement of the electronic component holding portion in a direction perpendicular to the displacement direction. Moreover, the gap will increase over the years due to wear and the like. On the other hand, by having the holding position variable part 70 of the two parallel leaf springs 72a, 72b intersecting with the displacement direction to connect the electronic part holding part 50 and the winding part 20, the holding position of the electronic part can be restricted without any gap. The portion 50 moves in the direction along the leaf springs 72a and 72b and allows the electronic component holding portion 50 to move in the direction perpendicular to the leaf springs 72a and 72b.

In addition, according to the mechanism that can displace the electronic component holding portion 50 by the deformation of the leaf springs 72a and 72b, the electronic component holding portion 50 is also displaced in a direction perpendicular to the above-mentioned displacement direction (hereinafter referred to as "vertical displacement"). ). With respect to this displacement, the lengths of the leaf springs 72a and 72b are set to be sufficiently larger than the amount of displacement in the displacement direction, whereby the vertical displacement can be suppressed to be small. In addition, the size of the vertical displacement is difficult to change over time compared with the size of the gap in the structure of the sliding guide. Therefore, as long as the position including the vertical displacement is used as the target position, the positioning accuracy can be improved and the long-term Maintain the positioning accuracy. Therefore, the positioning accuracy of the electronic component W is effectively improved.

The displacement driving part 80 has: a main body 81 which is fixed in the arrangement area AR so as not to rotate together with the winding part 20; and a push rod 82 which is provided in the main body 81 so as to be displaceable along the displacement direction and faces one side of the displacement direction The side presses the electronic component holding part 50; and the driving part 84, which moves the push rod 82 along the displacement direction. The displacement driving part 80 is provided in the arrangement area AR so as not to revolve together with the winding part 20, thereby simplifying the mechanism for displacing the electronic component holding part 50 in the arrangement area AR.

The processing device 1 may include a plurality of electronic component holding parts 50 and a plurality of holding position variable parts 70. The plurality of electronic component holding parts 50 can each displace the plurality of electronic component holding parts 50 with respect to the winding part 20. The revolving drive unit 60 revolves the revolving unit 20 so that the respective pair arrangement regions AR of the plurality of electronic component holding units 50 are sequentially arranged. In this case, a plurality of electronic components W can be simultaneously carried by the plurality of electronic component holding parts 50. Thus, efficient processing of the electronic component W can be performed.

The displacement driving part 80 may be configured to press the electronic component holding part 50 toward one side of the displacement direction. The holding position variable part 70 may further have an auxiliary spring 78 which presses the electronic component holding part 50 toward the other side of the displacement direction. According to the leaf springs 72a and 72b, the moving direction of the electronic component holding portion 50 can be restricted seamlessly. On the other hand, the reaction force of the leaf springs 72a and 72b is easily differentiated according to the difference in the thickness of the leaf springs 72a and 72b. On the other hand, for the auxiliary spring 78, it is possible to use a spring that can easily adjust the magnitude of the reaction force without considering the function of restricting the moving direction of the electronic component holding portion 50. Therefore, according to the above-mentioned structure in which the holding position variable portion 70 further includes the auxiliary spring 78, the reaction force imparted by the holding position variable portion 70 to the electronic component holding portion 50 can be adjusted with higher accuracy.

The winding portion 20 may further have a restricting portion 34 that restricts the movement of the auxiliary spring 78 to the electronic component holding portion 50 in the direction in which the electronic component holding portion 50 is pressed. In this case, by abutting the electronic component holding portion 50 against the restricting portion 34, the rigidity of the connecting portion between the electronic component holding portion 50 and the winding portion 20 is increased. In addition, the rigidity can be appropriately adjusted by the magnitude of the reaction force of the auxiliary spring 78. Thereby, the vibration of the electronic component holding part 50 corresponding to the rotation and stop of the winding part 20 can be suppressed, so the rotation speed of the winding part 20 can be easily increased. Increasing the rotation speed of the winding part 20 can further improve the processing efficiency of the electronic component W.

The point of application P2 of the force from the auxiliary spring 78 to the electronic component holding portion 50 and the point of application P1 of the force from the displacement driving portion 80 to the electronic component holding portion 50 may be different in the direction orthogonal to the displacement direction. In this case, the posture maintaining function of the electronic component holding portion 50 by the two leaf springs 72a and 72b can be utilized to achieve space saving.

The electronic component holding portion 50 may also have an expansion portion 56 protruding toward the winding portion 20. The winding portion 20 may also have an expansion portion 28 which protrudes toward the electronic component holding portion 50 at a position where at least two leaf springs 72 a and 72 b are sandwiched between the expansion portion 56. The auxiliary spring 78 may penetrate a leaf spring located between the expansion portion 56 and the expansion portion 28 among the two leaf springs 72 a and 72 b to contact the expansion portion 56 and the expansion portion 28. In this case, a part between the two leaf springs 72a and 72b can be used as an arrangement space for the auxiliary spring 78, thereby achieving further space saving.

One of the expansion part 56 and the expansion part 28 is arranged between the two leaf springs 72a and 72b, and the other orientation of the expansion part 56 and the expansion part 28 may be outside the two leaf springs 72a and 72b. In this case, the space between the two leaf springs 72a and 72b can be used as an arrangement space for the expansion portion 56 or the expansion portion 28, thereby achieving further space saving.

Among the two leaf springs 72a and 72b, the leaf spring located between the expansion portion 28 and the expansion portion 56 has an opening for the auxiliary spring 78 to pass through, and the leaf spring located between the expansion portion 28 and the expansion portion 56 may not be provided. It also has the same opening as the above-mentioned opening. In this case, the leaf spring through which the auxiliary spring 78 is not penetrated is also provided with the same opening as the leaf spring through which the auxiliary spring is penetrated, so that both space saving and positioning accuracy can be surely achieved.

The electronic component holding portion 50 may also have a guide hole 58 penetrating the expansion portion 56. The winding portion 20 may also have a guide pin 32 that protrudes from the expansion portion 28 toward the expansion portion 56 and penetrates the guide hole 58 to guide the auxiliary spring 78. The gap between the guide hole 58 and the guide pin 32 may be set to be larger than the displacement amount of the electronic component holding portion 50 in the direction perpendicular to the displacement direction. In this case, the displacement of the electronic component holding portion 50 based on the deformation of the two leaf springs 72a and 72b is not hindered by the contact between the guide hole 58 and the guide pin 32, and the auxiliary spring 78 can be guided. Thereby, the reaction force imparted by the holding position variable portion 70 to the electronic component holding portion 50 can be adjusted with higher accuracy.

The reaction force of the auxiliary spring 78 to the displacement of the electronic component holding part 50 caused by the displacement driving part 80 may be greater than the sum of the reaction forces of the two leaf springs 72a and 72b to the displacement. In this case, the reaction force imparted by the holding position variable portion to the electronic component holding portion can be adjusted with higher accuracy.

Although the embodiments have been described above, the present invention is not necessarily limited to the above-mentioned embodiments, and various modifications can be made within a range that does not deviate from the gist.

l: processing device 20: Spiral part 28: Expansion 32: guide pin 34: Restricted Department 56: Expansion 60: Swivel drive 70: Keep the position variable part 72a, 72b: leaf spring 78: auxiliary spring 80: Displacement drive unit 90: fixed plate AR: configuration area CR: Circulating track Ax: central axis

[Fig. 1] A plan view schematically showing an example of a processing device. [Fig. 2] A side view schematically showing the processing device shown in Fig. 1. [Fig. 3] A side view showing an enlarged part of the processing device. [Fig. 4] A plan view schematically showing a part of the processing device. [Figure 5] A schematic diagram for explaining the displacement of the electronic component holding portion.

16: Processing Department

22: Rotating platform

24: Connection part

24a: outside

28: Expansion

28a: above

32: guide pin

34: Restricted Department

50: Multiple electronic component holding parts

52: Nozzle

54: Nozzle holder

55: connection block

55a: inside

55b: Above

56: Expansion

56a: Above

56b: below

58: Through guide hole

70: Keep the position variable part

72a, 72b: leaf spring

76a, 76b: opening

78: auxiliary spring

80: Displacement drive unit

82: putter

W: Electronic parts

Wa, Wb: Surround the main surface

Wc: outer peripheral surface

Claims (6)

A processing device for electronic parts, comprising: a winding part, which can be wound around the central axis of a circulation track for conveyance passing through a predetermined arrangement area; An electronic component holding part, which is arranged in the aforementioned winding part so as to be located on the aforementioned conveying circulating track; A holding position variable part, which can displace the aforementioned electronic component holding part with respect to the aforementioned spiral part in a predetermined displacement direction; A revolving drive portion that revolves the revolving portion around the central axis in such a manner that the electronic component holding portion holding the electronic component is arranged in the arrangement area; and A displacement driving part is provided in the arrangement area, and moves the electronic component holding part arranged in the arrangement area to one side of the displacement direction, The holding position variable part has a plurality of parallel leaf springs that are staggered with the displacement direction and connect the electronic component holding part and the spiral part. The electronic component processing device according to claim 1, wherein: The aforementioned displacement drive unit has: The body part, which is fixed in the aforementioned configuration area so as not to revolve together with the aforementioned revolving part; A push rod is provided on the main body part to be displaceable along the displacement direction, and presses the electronic component holding part toward one side of the displacement direction; and The driving part moves the push rod along the displacement direction. An electronic component processing device according to claim 1 or 2, comprising: a plurality of electronic component holding portions including the aforementioned electronic component holding portion; and A plurality of holding position variable parts including the aforementioned holding position variable parts, The plurality of holding position variable parts can each displace the plurality of electronic component holding parts with respect to the winding part, The winding driving part is configured to wind the winding part so that each of the plurality of electronic component holding parts is sequentially arranged in the arrangement area. The electronic component processing device according to claim 1 or 2, wherein: The displacement driving part is configured to press the electronic component holding part toward one side of the displacement direction, The holding position variable part further has an auxiliary spring for pressing the electronic component holding part toward the other side of the displacement direction. The electronic component processing device according to claim 4, wherein the winding portion further has a restricting portion that restricts the movement of the auxiliary spring to the electronic component holding portion in a direction to press the electronic component holding portion. The electronic component processing device according to claim 4, wherein the point of application of the force of the auxiliary spring to the electronic component holding portion and the point of application of the force of the displacement driving portion on the electronic component holding portion are at It is different in the direction orthogonal to the aforementioned displacement direction.

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