MY159459A - Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith - Google Patents

Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith

Info

Publication number
MY159459A
MY159459A MYPI2013700893A MYPI2013700893A MY159459A MY 159459 A MY159459 A MY 159459A MY PI2013700893 A MYPI2013700893 A MY PI2013700893A MY PI2013700893 A MYPI2013700893 A MY PI2013700893A MY 159459 A MY159459 A MY 159459A
Authority
MY
Malaysia
Prior art keywords
electronic component
provided therewith
device provided
suction nozzle
holding device
Prior art date
Application number
MYPI2013700893A
Other languages
English (en)
Inventor
Takayuki Masuda
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY159459A publication Critical patent/MY159459A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Operations Research (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Specific Conveyance Elements (AREA)
MYPI2013700893A 2010-11-30 2010-11-30 Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith MY159459A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/006991 WO2012073282A1 (ja) 2010-11-30 2010-11-30 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置

Publications (1)

Publication Number Publication Date
MY159459A true MY159459A (en) 2017-01-13

Family

ID=46171274

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013700893A MY159459A (en) 2010-11-30 2010-11-30 Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device provided therewith

Country Status (5)

Country Link
JP (1) JP5252516B2 (zh)
CN (1) CN103229610B (zh)
HK (1) HK1183400A1 (zh)
MY (1) MY159459A (zh)
WO (1) WO2012073282A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201404990XA (en) * 2012-02-28 2014-11-27 Ueno Seiki Co Ltd Abnormal contact detecting method, electronic component holding apparatus, and electronic component carrying apparatus
WO2014087548A1 (ja) * 2012-12-04 2014-06-12 上野精機株式会社 保持手段の移動方法、電子部品保持装置、及び電子部品搬送装置
CN105008941B (zh) * 2012-12-19 2018-12-04 伊斯梅卡半导体控股公司 用于限制力的装置和方法
TWI478792B (zh) * 2012-12-27 2015-04-01 Ueno Seiki Co Ltd A method of moving the holding means, an electronic component holding means, and an electronic component handling means
JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
KR101543949B1 (ko) 2014-01-29 2015-08-11 세메스 주식회사 다이 본딩 헤드 및 이를 이용한 다이 본딩 방법
JP6329622B2 (ja) * 2014-03-24 2018-05-23 株式会社Ｆｕｊｉ ダイ実装システム及びダイ実装方法
JP5755361B1 (ja) 2014-07-02 2015-07-29 株式会社新川 実装装置
JP6164624B1 (ja) * 2016-10-18 2017-07-19 上野精機株式会社 電子部品移動装置及び電子部品搬送装置
JP6543686B1 (ja) * 2017-12-26 2019-07-10 ミネベアミツミ株式会社 荷重センサおよび荷重センサ一体型多軸アクチュエータ
CN108428653B (zh) * 2018-05-23 2023-12-08 重庆市嘉凌新科技有限公司 功率器件封装设备
JP6716654B2 (ja) * 2018-09-26 2020-07-01 Ntn株式会社 塗布部材、塗布装置および塗布方法
CN110299312A (zh) * 2019-07-04 2019-10-01 深圳市诺泰自动化设备有限公司 一种转塔式固晶机
JP6817648B1 (ja) * 2019-09-20 2021-01-20 上野精機株式会社 電子部品の処理装置
CN111589728A (zh) * 2020-06-24 2020-08-28 金动力智能科技（深圳）有限公司 一种5g网分组件的智能测试组件
JP6842732B1 (ja) * 2020-09-24 2021-03-17 上野精機株式会社 電子部品の処理装置
JPWO2022195693A1 (zh) * 2021-03-16 2022-09-22

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3848893B2 (ja) * 2002-04-02 2006-11-22 松下電器産業株式会社 部品の基板への部品押圧接合装置及び接合方法
JP2007317995A (ja) * 2006-05-29 2007-12-06 I-Pulse Co Ltd 表面実装機
JP5372423B2 (ja) * 2008-07-25 2013-12-18 Ｊｕｋｉ株式会社 電子部品搭載ヘッド
JP5459820B2 (ja) * 2008-12-02 2014-04-02 上野精機株式会社 表裏反転装置、表裏反転装置を備えたテストハンドラ
JP2010131680A (ja) * 2008-12-02 2010-06-17 Ueno Seiki Kk 保持手段駆動装置
MY159061A (en) * 2009-05-27 2016-12-15 Ueno Seiki Co Ltd Classification apparatus
CN102473665B (zh) * 2009-07-17 2014-11-19 上野精机株式会社 重新粘贴装置以及分类重新粘贴方法

Also Published As

Publication number Publication date
CN103229610A (zh) 2013-07-31
HK1183400A1 (zh) 2013-12-20
JP5252516B2 (ja) 2013-07-31
WO2012073282A1 (ja) 2012-06-07
CN103229610B (zh) 2016-01-20
JPWO2012073282A1 (ja) 2014-05-19

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