JP5248627B2 - 半導体のマイクロパッド形成方法 - Google Patents

半導体のマイクロパッド形成方法 Download PDF

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JP5248627B2
JP5248627B2 JP2010541477A JP2010541477A JP5248627B2 JP 5248627 B2 JP5248627 B2 JP 5248627B2 JP 2010541477 A JP2010541477 A JP 2010541477A JP 2010541477 A JP2010541477 A JP 2010541477A JP 5248627 B2 JP5248627 B2 JP 5248627B2
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copper
tin
stud
micropad
semiconductor element
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JP2011508983A (ja
JP2011508983A5 (enExample
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マシュー、バルギース
アコスタ、エディ
チャタジー、リトウィック
エス． ガルシア、サム
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NXP USA Inc
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NXP USA Inc
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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US11/969,368 US7807572B2 (en) 2008-01-04 2008-01-04 Micropad formation for a semiconductor
PCT/US2008/086920 WO2009088659A2 (en) 2008-01-04 2008-12-16 Micropad formation for a semiconductor

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CN101911292A (zh) 2010-12-08
US20090176366A1 (en) 2009-07-09
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WO2009088659A2 (en) 2009-07-16
TWI442476B (zh) 2014-06-21
JP2011508983A (ja) 2011-03-17
US7807572B2 (en) 2010-10-05
CN101911292B (zh) 2012-06-20

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