CN101911292B - 半导体的微焊盘形成 - Google Patents

半导体的微焊盘形成 Download PDF

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Publication number
CN101911292B
CN101911292B CN2008801238236A CN200880123823A CN101911292B CN 101911292 B CN101911292 B CN 101911292B CN 2008801238236 A CN2008801238236 A CN 2008801238236A CN 200880123823 A CN200880123823 A CN 200880123823A CN 101911292 B CN101911292 B CN 101911292B
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semiconductor device
copper
tin
forms
layer
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CN101911292A (zh
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V·马修
E·阿科斯塔
R·查特杰
S·S·加西亚
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NXP USA Inc
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Freescale Semiconductor Inc
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    • H01L2924/14—Integrated circuits

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WO2009088659A2 (en) 2009-07-16
TWI442476B (zh) 2014-06-21
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JP5248627B2 (ja) 2013-07-31
US7807572B2 (en) 2010-10-05

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