JP5238157B2 - 硬化性シリコーン組成物および電子部品 - Google Patents

硬化性シリコーン組成物および電子部品 Download PDF

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Publication number
JP5238157B2
JP5238157B2 JP2006346865A JP2006346865A JP5238157B2 JP 5238157 B2 JP5238157 B2 JP 5238157B2 JP 2006346865 A JP2006346865 A JP 2006346865A JP 2006346865 A JP2006346865 A JP 2006346865A JP 5238157 B2 JP5238157 B2 JP 5238157B2
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JP
Japan
Prior art keywords
group
component
curable silicone
silicone composition
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006346865A
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English (en)
Japanese (ja)
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JP2008156474A (ja
JP2008156474A5 (https=
Inventor
好次 森田
智子 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2006346865A priority Critical patent/JP5238157B2/ja
Priority to TW096146566A priority patent/TWI426106B/zh
Priority to KR1020097013185A priority patent/KR101410337B1/ko
Priority to US12/520,899 priority patent/US7994246B2/en
Priority to PCT/JP2007/074607 priority patent/WO2008078663A1/en
Priority to EP07851014A priority patent/EP2099867B1/en
Priority to MYPI20092673A priority patent/MY148111A/en
Priority to CN2007800469756A priority patent/CN101563425B/zh
Priority to AT07851014T priority patent/ATE466903T1/de
Priority to DE602007006345T priority patent/DE602007006345D1/de
Publication of JP2008156474A publication Critical patent/JP2008156474A/ja
Publication of JP2008156474A5 publication Critical patent/JP2008156474A5/ja
Application granted granted Critical
Publication of JP5238157B2 publication Critical patent/JP5238157B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
JP2006346865A 2006-12-25 2006-12-25 硬化性シリコーン組成物および電子部品 Expired - Fee Related JP5238157B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2006346865A JP5238157B2 (ja) 2006-12-25 2006-12-25 硬化性シリコーン組成物および電子部品
TW096146566A TWI426106B (zh) 2006-12-25 2007-12-06 可固化之聚矽氧組合物及電子組件
DE602007006345T DE602007006345D1 (de) 2006-12-25 2007-12-14 Härtbare silikonzusammensetzung und elektronikbauteil
PCT/JP2007/074607 WO2008078663A1 (en) 2006-12-25 2007-12-14 Curable silicone composition and electronic component
EP07851014A EP2099867B1 (en) 2006-12-25 2007-12-14 Curable silicone composition and electronic component
MYPI20092673A MY148111A (en) 2006-12-25 2007-12-14 Curable silicone composition and electronic component
KR1020097013185A KR101410337B1 (ko) 2006-12-25 2007-12-14 경화성 실리콘 조성물 및 전자 부품
AT07851014T ATE466903T1 (de) 2006-12-25 2007-12-14 Härtbare silikonzusammensetzung und elektronikbauteil
US12/520,899 US7994246B2 (en) 2006-12-25 2007-12-14 Curable silicone composition and electronic component
CN2007800469756A CN101563425B (zh) 2006-12-25 2007-12-14 可固化的硅氧烷组合物和电子组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006346865A JP5238157B2 (ja) 2006-12-25 2006-12-25 硬化性シリコーン組成物および電子部品

Publications (3)

Publication Number Publication Date
JP2008156474A JP2008156474A (ja) 2008-07-10
JP2008156474A5 JP2008156474A5 (https=) 2011-02-17
JP5238157B2 true JP5238157B2 (ja) 2013-07-17

Family

ID=39135290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006346865A Expired - Fee Related JP5238157B2 (ja) 2006-12-25 2006-12-25 硬化性シリコーン組成物および電子部品

Country Status (10)

Country Link
US (1) US7994246B2 (https=)
EP (1) EP2099867B1 (https=)
JP (1) JP5238157B2 (https=)
KR (1) KR101410337B1 (https=)
CN (1) CN101563425B (https=)
AT (1) ATE466903T1 (https=)
DE (1) DE602007006345D1 (https=)
MY (1) MY148111A (https=)
TW (1) TWI426106B (https=)
WO (1) WO2008078663A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
KR101195674B1 (ko) * 2009-01-29 2012-10-30 야마하 가부시키가이샤 열교환 유닛
US20130338265A1 (en) * 2010-12-27 2013-12-19 Dow Corning Toray Co., Ltd. Curable Epoxy Resin Composition
KR101518104B1 (ko) 2011-06-17 2015-05-06 주식회사 엘지화학 경화성 조성물
CN104981517B (zh) 2012-12-07 2017-09-15 第一毛织株式会社 用于光学仪器的可固化的聚硅氧烷组合物、封装材料及光学器件
KR101556274B1 (ko) 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
CN107109064A (zh) * 2015-01-21 2017-08-29 信越化学工业株式会社 室温固化性有机聚硅氧烷组合物
US9659844B2 (en) * 2015-08-31 2017-05-23 Texas Instruments Incorporated Semiconductor die substrate with integral heat sink
TWI871377B (zh) * 2019-12-18 2025-02-01 美商陶氏有機矽公司 可固化聚矽氧組成物及其固化產物
JP7321081B2 (ja) * 2019-12-26 2023-08-04 株式会社藤商事 遊技機
JP7774044B2 (ja) 2020-09-25 2025-11-20 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物及びその硬化物
CN115602646A (zh) * 2021-07-08 2023-01-13 碁达科技股份有限公司（Tw） 热介面组成物、热介面材料及其制备方法
US12302491B2 (en) 2022-03-31 2025-05-13 University Of Massachusetts Electrical system with hook-and-loop busbars

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3251655B2 (ja) 1992-08-05 2002-01-28 東レ・ダウコーニング・シリコーン株式会社 ジオルガノポリシロキサンおよびその製造方法
JP4719976B2 (ja) * 1999-03-11 2011-07-06 東レ株式会社 エポキシ樹脂組成物及び繊維強化複合材料用エポキシ樹脂組成物並びにそれを有してなる繊維強化複合材料
JP3796648B2 (ja) 1999-04-15 2006-07-12 信越化学工業株式会社 エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP2005146104A (ja) * 2003-11-14 2005-06-09 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2006316250A (ja) * 2005-04-12 2006-11-24 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP4017645B2 (ja) * 2005-12-22 2007-12-05 横浜ゴム株式会社 湿気硬化性樹脂組成物

Also Published As

Publication number Publication date
US20100063185A1 (en) 2010-03-11
EP2099867B1 (en) 2010-05-05
TWI426106B (zh) 2014-02-11
TW200835749A (en) 2008-09-01
CN101563425A (zh) 2009-10-21
DE602007006345D1 (de) 2010-06-17
MY148111A (en) 2013-02-28
JP2008156474A (ja) 2008-07-10
CN101563425B (zh) 2012-07-04
ATE466903T1 (de) 2010-05-15
EP2099867A1 (en) 2009-09-16
US7994246B2 (en) 2011-08-09
WO2008078663A1 (en) 2008-07-03
KR20090099060A (ko) 2009-09-21
KR101410337B1 (ko) 2014-06-23

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