KR101410337B1 - 경화성 실리콘 조성물 및 전자 부품 - Google Patents

경화성 실리콘 조성물 및 전자 부품 Download PDF

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Publication number
KR101410337B1
KR101410337B1 KR1020097013185A KR20097013185A KR101410337B1 KR 101410337 B1 KR101410337 B1 KR 101410337B1 KR 1020097013185 A KR1020097013185 A KR 1020097013185A KR 20097013185 A KR20097013185 A KR 20097013185A KR 101410337 B1 KR101410337 B1 KR 101410337B1
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South Korea
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component
curable silicone
silicone composition
group
formula
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English (en)
Korean (ko)
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KR20090099060A (ko
Inventor
요시쓰구 모리타
도모코 가토
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다우 코닝 도레이 캄파니 리미티드
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Publication of KR20090099060A publication Critical patent/KR20090099060A/ko
Application granted granted Critical
Publication of KR101410337B1 publication Critical patent/KR101410337B1/ko
Assigned to 다우 도레이 캄파니 리미티드 reassignment 다우 도레이 캄파니 리미티드 권리의 전부이전등록 Assignors: 다우 코닝 도레이 캄파니 리미티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
KR1020097013185A 2006-12-25 2007-12-14 경화성 실리콘 조성물 및 전자 부품 Expired - Fee Related KR101410337B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2006-346865 2006-12-25
JP2006346865A JP5238157B2 (ja) 2006-12-25 2006-12-25 硬化性シリコーン組成物および電子部品
PCT/JP2007/074607 WO2008078663A1 (en) 2006-12-25 2007-12-14 Curable silicone composition and electronic component

Publications (2)

Publication Number Publication Date
KR20090099060A KR20090099060A (ko) 2009-09-21
KR101410337B1 true KR101410337B1 (ko) 2014-06-23

Family

ID=39135290

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097013185A Expired - Fee Related KR101410337B1 (ko) 2006-12-25 2007-12-14 경화성 실리콘 조성물 및 전자 부품

Country Status (10)

Country Link
US (1) US7994246B2 (https=)
EP (1) EP2099867B1 (https=)
JP (1) JP5238157B2 (https=)
KR (1) KR101410337B1 (https=)
CN (1) CN101563425B (https=)
AT (1) ATE466903T1 (https=)
DE (1) DE602007006345D1 (https=)
MY (1) MY148111A (https=)
TW (1) TWI426106B (https=)
WO (1) WO2008078663A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
KR101195674B1 (ko) * 2009-01-29 2012-10-30 야마하 가부시키가이샤 열교환 유닛
US20130338265A1 (en) * 2010-12-27 2013-12-19 Dow Corning Toray Co., Ltd. Curable Epoxy Resin Composition
KR101518104B1 (ko) 2011-06-17 2015-05-06 주식회사 엘지화학 경화성 조성물
CN104981517B (zh) 2012-12-07 2017-09-15 第一毛织株式会社 用于光学仪器的可固化的聚硅氧烷组合物、封装材料及光学器件
KR101556274B1 (ko) 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
CN107109064A (zh) * 2015-01-21 2017-08-29 信越化学工业株式会社 室温固化性有机聚硅氧烷组合物
US9659844B2 (en) * 2015-08-31 2017-05-23 Texas Instruments Incorporated Semiconductor die substrate with integral heat sink
TWI871377B (zh) * 2019-12-18 2025-02-01 美商陶氏有機矽公司 可固化聚矽氧組成物及其固化產物
JP7321081B2 (ja) * 2019-12-26 2023-08-04 株式会社藤商事 遊技機
JP7774044B2 (ja) 2020-09-25 2025-11-20 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物及びその硬化物
CN115602646A (zh) * 2021-07-08 2023-01-13 碁达科技股份有限公司（Tw） 热介面组成物、热介面材料及其制备方法
US12302491B2 (en) 2022-03-31 2025-05-13 University Of Massachusetts Electrical system with hook-and-loop busbars

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000355622A (ja) 1999-04-15 2000-12-26 Shin Etsu Chem Co Ltd エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
JP2006306953A (ja) 2005-04-27 2006-11-09 Dow Corning Toray Co Ltd 硬化性シリコーン組成物およびその硬化物
WO2006118335A1 (en) 2005-04-27 2006-11-09 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic components

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3251655B2 (ja) 1992-08-05 2002-01-28 東レ・ダウコーニング・シリコーン株式会社 ジオルガノポリシロキサンおよびその製造方法
JP4719976B2 (ja) * 1999-03-11 2011-07-06 東レ株式会社 エポキシ樹脂組成物及び繊維強化複合材料用エポキシ樹脂組成物並びにそれを有してなる繊維強化複合材料
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP2005146104A (ja) * 2003-11-14 2005-06-09 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2006316250A (ja) * 2005-04-12 2006-11-24 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP4017645B2 (ja) * 2005-12-22 2007-12-05 横浜ゴム株式会社 湿気硬化性樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000355622A (ja) 1999-04-15 2000-12-26 Shin Etsu Chem Co Ltd エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
JP2006306953A (ja) 2005-04-27 2006-11-09 Dow Corning Toray Co Ltd 硬化性シリコーン組成物およびその硬化物
WO2006118335A1 (en) 2005-04-27 2006-11-09 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic components

Also Published As

Publication number Publication date
US20100063185A1 (en) 2010-03-11
EP2099867B1 (en) 2010-05-05
TWI426106B (zh) 2014-02-11
TW200835749A (en) 2008-09-01
CN101563425A (zh) 2009-10-21
DE602007006345D1 (de) 2010-06-17
MY148111A (en) 2013-02-28
JP2008156474A (ja) 2008-07-10
CN101563425B (zh) 2012-07-04
JP5238157B2 (ja) 2013-07-17
ATE466903T1 (de) 2010-05-15
EP2099867A1 (en) 2009-09-16
US7994246B2 (en) 2011-08-09
WO2008078663A1 (en) 2008-07-03
KR20090099060A (ko) 2009-09-21

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