JP5228291B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 278
- 238000004519 manufacturing process Methods 0.000 title claims description 47
- 125000005842 heteroatom Chemical group 0.000 claims description 186
- 239000000463 material Substances 0.000 claims description 68
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- 230000003647 oxidation Effects 0.000 claims description 36
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 28
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 27
- 238000001312 dry etching Methods 0.000 claims description 19
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- 230000001590 oxidative effect Effects 0.000 claims description 11
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000002772 conduction electron Substances 0.000 description 7
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 7
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- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
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- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 229910000078 germane Inorganic materials 0.000 description 1
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
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- 238000011084 recovery Methods 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Description
図1を参照して、本発明の第1の実施の形態に係わる半導体装置の構成を説明する。図1は、構造単位セルが2つ対面した断面図である。第1の実施の形態においては、炭化珪素を基板材料とした半導体装置の例を説明する。半導体装置は、第1導電型(N型)の半導体基体(1,2)と、半導体基体(1,2)の一主面においてヘテロ接合を形成するヘテロ半導体領域3と、ヘテロ接合に隣接して配置されたゲート絶縁膜4と、ゲート絶縁膜の上に配置されたゲート電極5と、ヘテロ半導体領域3と接続されたソース電極6と、半導体基体(1,2)と接続されたドレイン電極7とを有する。
図2(a)〜図3(b)で示した製造方法では、マスク材9の開口から表出した第1のヘテロ半導体層3をドライエッチングで所定厚みまでエッチングして膜厚制御部21を形成したが、図3〜図5に示す製造方法によって膜厚制御部21を形成しても構わない。
第1の実施の形態及び第1の変形例では、第1のヘテロ半導体層3をエッチングする時間を制御することにより膜厚制御部21の膜厚を制御する方法を説明した。しかし、本発明はこれに限定されるものではなく、以下に示すように、成膜工程における膜厚で制御することもできる。
図5(a)では開口から表出した第1のヘテロ半導体層3のみをエッチングした場合を示しているが、図6(a)〜図6(c)に示すように更に第1のヘテロ半導体層3の下のドリフト領域2まで掘り込んでも構わない。
図8を参照して、本発明の第2の実施の形態に係わる半導体装置の構成を説明する。なお、図1の半導体装置との相違点についてのみ説明する。
図8に示した半導体装置を、図10(a)〜図10(c)に示した製造方法によって製造することもできる。つまり、第1のヘテロ半導体層3の上に第2のヘテロ半導体層11を形成してヘテロ半導体領域3を形成しても構わない。
上記のように、本発明は、第1及び第2の実施の形態及びその変形例によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施の形態、実施例及び運用技術が明らかとなろう。
2 ドリフト領域
3 ヘテロ半導体領域(第1のヘテロ半導体層)
4 ゲート絶縁膜
5 ゲート電極
6 ソース電極
7 ドレイン電極
8 層関絶縁膜
9 マスク材
10 犠牲酸化膜
11 第2のヘテロ半導体層
12 イオン注入ダメージ層
13 第2のヘテロ半導体領域
14 第1の電界緩和領域
15 第2の電界緩和領域
16 導通領域
Claims (10)
- 半導体材料からなる半導体基体と、前記半導体材料のバンドギャップとは異なるバンドギャップを有するヘテロ半導体材料からなり、前記半導体基体の表面の一部にヘテロ接合するヘテロ半導体領域と、前記ヘテロ半導体領域側部から前記半導体基体の前記ヘテロ半導体領域に覆われていない部分にまたがって配置されたゲート絶縁膜と、前記ゲート絶縁膜の上に配置されたゲート電極と、前記半導体基体に接続されたドレイン電極と、前記ヘテロ半導体領域に接続されたソース電極とを有する半導体装置の製造方法であって、
前記半導体基体を用意し、
前記ヘテロ半導体領域と前記半導体基体の界面にヘテロ接合を形成するように、前記半導体基体上に前記ヘテロ半導体領域を形成し、
前記ヘテロ半導体領域の一部に、膜厚が前記ヘテロ半導体領域の他の部分よりも薄い膜厚制御部を形成し、
前記ヘテロ半導体領域の少なくとも前記膜厚制御部の全域を酸化して、前記ゲート絶縁膜の前記半導体基体上の領域を形成し、
前記ゲート絶縁膜上にゲート電極を形成する
ことを特徴とする半導体装置の製造方法。 - 前記ヘテロ半導体領域を前記半導体基体上に形成することには、
前記半導体基体上に前記ヘテロ半導体材料からなる第1のヘテロ半導体層を成膜し、
前記第1のヘテロ半導体層の一部を前記膜厚制御部の膜厚だけ残るように選択的に除去する
ことが含まれることを特徴とする請求項1記載の半導体装置の製造方法。 - 前記第1のヘテロ半導体層の一部を前記膜厚制御部の膜厚だけ残るように選択的に除去することには、
前記第1のヘテロ半導体層の一部をドライエッチングにより除去し、
前記ドライエッチングにより結晶構造の規則性が乱れた前記第1のヘテロ半導体層の一部を酸化し、
前記酸化した第1のヘテロ半導体層をウエットエッチングにより除去する
ことが含まれることを特徴とする請求項1又は請求項2記載の半導体装置の製造方法。 - 前記ヘテロ半導体領域を前記半導体基体上に形成することには、
前記半導体基体上に前記ヘテロ半導体材料からなる第1のヘテロ半導体層を成膜し、
前記第1のヘテロ半導体層の一部を前記半導体基体が表出するように選択的に除去し、
少なくとも前記露出した半導体基体の上に前記ヘテロ半導体材料からなる第2のヘテロ半導体層を前記膜厚制御部の膜厚だけ成膜する
ことが含まれることを特徴とする請求項1乃至請求項3のうち、いずれか1項記載の半導体装置の製造方法。 - 第2のヘテロ半導体層を成膜する前に、前記第1のヘテロ半導体層の一部を選択的に除去することにより表出した前記半導体基体の一部を更に選択的に除去することを特徴とする請求項1乃至請求項4のうち、いずれか1項記載の半導体装置の製造方法。
- 前記ヘテロ半導体領域を前記半導体基体上に形成することには、前記膜厚制御部を除く前記ヘテロ半導体領域内に不純物を導入することが含まれ、
前記ゲート絶縁膜を形成する時に、前記不純物の導入により結晶構造の規則性が乱れた前記ヘテロ半導体領域の一部を酸化することを特徴とする請求項1乃至請求項5のうち、いずれか1項記載の半導体装置の製造方法。 - 前記不純物を導入する方法は、イオン注入法であることを特徴とする請求項6記載の半導体装置の製造方法。
- 前記ヘテロ半導体領域の一部を酸化する方法は、熱酸化法であることを特徴とする請求項1乃至請求項7のうち、いずれか1項記載の半導体装置の製造方法。
- 前記半導体基体は、炭化珪素、ダイヤモンド、窒化ガリウムのいずれかからなることを特徴とする請求項1乃至請求項8のうち、いずれか1項記載の半導体装置の製造方法。
- 前記ヘテロ半導体領域は、単結晶シリコン、多結晶シリコンもしくはアモルファスシリコンからなることを特徴とする請求項1乃至請求項9のうち、いずれか1項記載の半導体装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006186560A JP5228291B2 (ja) | 2006-07-06 | 2006-07-06 | 半導体装置の製造方法 |
EP07013139.6A EP1876638B1 (en) | 2006-07-06 | 2007-07-04 | Method of manufacturing a semiconductor device with a heterojunction |
KR1020070067472A KR100893995B1 (ko) | 2006-07-06 | 2007-07-05 | 반도체 장치 제조 방법 |
US11/773,649 US7902025B2 (en) | 2006-07-06 | 2007-07-05 | Method of manufacturing semiconductor device |
CN2007101228848A CN101101879B (zh) | 2006-07-06 | 2007-07-06 | 半导体装置的制造方法 |
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JP4046140B1 (ja) * | 2006-11-29 | 2008-02-13 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
IT1401755B1 (it) | 2010-08-30 | 2013-08-02 | St Microelectronics Srl | Dispositivo elettronico integrato a conduzione verticale e relativo metodo di fabbricazione. |
IT1401756B1 (it) | 2010-08-30 | 2013-08-02 | St Microelectronics Srl | Dispositivo elettronico integrato con struttura di terminazione di bordo e relativo metodo di fabbricazione. |
IT1401754B1 (it) | 2010-08-30 | 2013-08-02 | St Microelectronics Srl | Dispositivo elettronico integrato e relativo metodo di fabbricazione. |
JP5638151B2 (ja) * | 2010-12-23 | 2014-12-10 | パーデュー、ファーマ、リミテッド、パートナーシップ | 不正加工抵抗性の(tamperresistant)固形経口剤形 |
DE102011053641A1 (de) * | 2011-09-15 | 2013-03-21 | Infineon Technologies Ag | SiC-MOSFET mit hoher Kanalbeweglichkeit |
CN102386223B (zh) * | 2011-11-01 | 2013-08-14 | 中山大学 | GaN高阈值电压增强型MOSHFET器件及制备方法 |
EP3119413B1 (en) * | 2014-03-17 | 2021-05-12 | Mapi Pharma Limited | Sublingual delivery of glatiramer acetate |
CN104992926B (zh) * | 2015-07-24 | 2018-03-13 | 深圳市华星光电技术有限公司 | Ltps阵列基板及其制造方法 |
JP6623772B2 (ja) * | 2016-01-13 | 2019-12-25 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
CN107093623B (zh) * | 2017-03-16 | 2020-05-01 | 西安电子科技大学 | 一种具有宽带隙衬底材料的垂直双扩散金属氧化物半导体场效应管 |
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CN107123684B (zh) * | 2017-03-16 | 2020-05-01 | 西安电子科技大学 | 一种具有宽带隙材料与硅材料复合垂直双扩散金属氧化物半导体场效应管 |
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JP3620513B2 (ja) | 2002-04-26 | 2005-02-16 | 日産自動車株式会社 | 炭化珪素半導体装置 |
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CN101101879B (zh) | 2010-12-01 |
KR100893995B1 (ko) | 2009-04-20 |
KR20080005100A (ko) | 2008-01-10 |
US7902025B2 (en) | 2011-03-08 |
US20080009089A1 (en) | 2008-01-10 |
EP1876638A3 (en) | 2008-10-22 |
JP2008016650A (ja) | 2008-01-24 |
US20110117699A1 (en) | 2011-05-19 |
US7989295B2 (en) | 2011-08-02 |
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