JP5223383B2 - 水晶振動子、水晶振動子パッケージ、電子部品、電子機器、電子部品の実装方法 - Google Patents

水晶振動子、水晶振動子パッケージ、電子部品、電子機器、電子部品の実装方法 Download PDF

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Publication number
JP5223383B2
JP5223383B2 JP2008054746A JP2008054746A JP5223383B2 JP 5223383 B2 JP5223383 B2 JP 5223383B2 JP 2008054746 A JP2008054746 A JP 2008054746A JP 2008054746 A JP2008054746 A JP 2008054746A JP 5223383 B2 JP5223383 B2 JP 5223383B2
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Japan
Prior art keywords
electrode
resin
substrate
bump electrode
connection electrode
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Expired - Fee Related
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JP2008054746A
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English (en)
Japanese (ja)
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JP2009212906A (ja
JP2009212906A5 (https=
Inventor
伸晃 橋元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Priority to JP2008054746A priority Critical patent/JP5223383B2/ja
Publication of JP2009212906A publication Critical patent/JP2009212906A/ja
Publication of JP2009212906A5 publication Critical patent/JP2009212906A5/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2008054746A 2008-03-05 2008-03-05 水晶振動子、水晶振動子パッケージ、電子部品、電子機器、電子部品の実装方法 Expired - Fee Related JP5223383B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008054746A JP5223383B2 (ja) 2008-03-05 2008-03-05 水晶振動子、水晶振動子パッケージ、電子部品、電子機器、電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008054746A JP5223383B2 (ja) 2008-03-05 2008-03-05 水晶振動子、水晶振動子パッケージ、電子部品、電子機器、電子部品の実装方法

Publications (3)

Publication Number Publication Date
JP2009212906A JP2009212906A (ja) 2009-09-17
JP2009212906A5 JP2009212906A5 (https=) 2011-04-21
JP5223383B2 true JP5223383B2 (ja) 2013-06-26

Family

ID=41185616

Family Applications (1)

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JP2008054746A Expired - Fee Related JP5223383B2 (ja) 2008-03-05 2008-03-05 水晶振動子、水晶振動子パッケージ、電子部品、電子機器、電子部品の実装方法

Country Status (1)

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JP (1) JP5223383B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2952314B1 (fr) * 2009-11-12 2012-02-10 Sagem Defense Securite Procede de brasage, gyroscope et piece brasee
JP2011182155A (ja) * 2010-03-01 2011-09-15 Seiko Epson Corp 圧電デバイスと圧電デバイスの製造方法
JP6551010B2 (ja) * 2015-07-28 2019-07-31 セイコーエプソン株式会社 圧電デバイス、液体噴射ヘッド、及び圧電デバイスの製造方法
CN109945852B (zh) * 2019-03-22 2021-05-28 中国科学院微电子研究所 陀螺仪的封装结构及制作方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5985117A (ja) * 1982-11-05 1984-05-17 Seikosha Co Ltd 厚みすべり圧電振動子
JPH04116428U (ja) * 1991-03-29 1992-10-19 京セラ株式会社 チツプ型圧電共振子
JPH09172346A (ja) * 1995-12-21 1997-06-30 Matsushita Electric Ind Co Ltd 圧電共振部品およびその製造方法
JPH11251863A (ja) * 1998-03-04 1999-09-17 Toyo Commun Equip Co Ltd 圧電振動子
US6628048B2 (en) * 2000-11-29 2003-09-30 Samsung Electro-Mechanics Co., Ltd. Crystal oscillator with improved shock resistance
JP2002353766A (ja) * 2001-03-19 2002-12-06 Seiko Epson Corp 圧電デバイス
JP3894542B2 (ja) * 2002-02-28 2007-03-22 京セラキンセキ株式会社 圧電部品の気密容器
JP2003347885A (ja) * 2002-05-29 2003-12-05 Seiko Epson Corp 圧電振動片、圧電振動片の製造方法および圧電デバイス
JP2005101527A (ja) * 2003-08-21 2005-04-14 Seiko Epson Corp 電子部品の実装構造、電気光学装置、電子機器及び電子部品の実装方法
JP2005143042A (ja) * 2003-11-10 2005-06-02 Seiko Epson Corp 圧電デバイス
JP2007013444A (ja) * 2005-06-29 2007-01-18 Daishinku Corp 圧電振動デバイス及びその製造方法
JP4656311B2 (ja) * 2005-07-11 2011-03-23 セイコーエプソン株式会社 電子モジュール
JP2007019410A (ja) * 2005-07-11 2007-01-25 Seiko Epson Corp 半導体装置、及び、電子モジュールの製造方法
JP2007096528A (ja) * 2005-09-27 2007-04-12 Epson Toyocom Corp 圧電振動素子の支持構造、表面実装用圧電振動子、表面実装用圧電発振器、及び圧電振動素子の搭載方法
JP4815976B2 (ja) * 2005-09-29 2011-11-16 株式会社大真空 水晶振動デバイスの製造方法
JP4784304B2 (ja) * 2005-12-27 2011-10-05 セイコーエプソン株式会社 電子部品、電子部品の製造方法、回路基板及び電子機器
JP2007214164A (ja) * 2006-02-07 2007-08-23 Epson Imaging Devices Corp 電気光学装置、半導体装置、電気光学装置の製造方法及び電子機器
JP4453763B2 (ja) * 2007-10-19 2010-04-21 セイコーエプソン株式会社 電子部品とその実装構造及び実装方法

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JP2009212906A (ja) 2009-09-17

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