JP5220147B2 - 冷却装置および加熱装置 - Google Patents

冷却装置および加熱装置 Download PDF

Info

Publication number
JP5220147B2
JP5220147B2 JP2011045872A JP2011045872A JP5220147B2 JP 5220147 B2 JP5220147 B2 JP 5220147B2 JP 2011045872 A JP2011045872 A JP 2011045872A JP 2011045872 A JP2011045872 A JP 2011045872A JP 5220147 B2 JP5220147 B2 JP 5220147B2
Authority
JP
Japan
Prior art keywords
cooling
substrate
unit
enclosure
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011045872A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012031504A (ja
JP2012031504A5 (enrdf_load_stackoverflow
Inventor
秀和 西村
和之 馬島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2011045872A priority Critical patent/JP5220147B2/ja
Publication of JP2012031504A publication Critical patent/JP2012031504A/ja
Publication of JP2012031504A5 publication Critical patent/JP2012031504A5/ja
Application granted granted Critical
Publication of JP5220147B2 publication Critical patent/JP5220147B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28C—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
    • F28C3/00—Other direct-contact heat-exchange apparatus
    • F28C3/005—Other direct-contact heat-exchange apparatus one heat-exchange medium being a solid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011045872A 2010-06-29 2011-03-03 冷却装置および加熱装置 Active JP5220147B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011045872A JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010147748 2010-06-29
JP2010147748 2010-06-29
JP2011045872A JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Publications (3)

Publication Number Publication Date
JP2012031504A JP2012031504A (ja) 2012-02-16
JP2012031504A5 JP2012031504A5 (enrdf_load_stackoverflow) 2012-11-29
JP5220147B2 true JP5220147B2 (ja) 2013-06-26

Family

ID=45351410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011045872A Active JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Country Status (2)

Country Link
US (1) US20110315346A1 (enrdf_load_stackoverflow)
JP (1) JP5220147B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101988014B1 (ko) * 2012-04-18 2019-06-13 삼성디스플레이 주식회사 어레이 기판의 제조 방법 및 이에 사용되는 제조 장치
KR101358805B1 (ko) * 2012-08-22 2014-02-07 에이피시스템 주식회사 냉각수 처리 장치, 방법 및 이를 적용한 기판 처리 장치
JP5849934B2 (ja) * 2012-11-16 2016-02-03 住友金属鉱山株式会社 真空成膜装置と真空成膜方法
US20140151360A1 (en) * 2012-11-30 2014-06-05 Wd Media, Inc. Heater assembly for disk processing system
JP6231399B2 (ja) * 2014-02-17 2017-11-15 キヤノンアネルバ株式会社 処理装置
JP7027057B2 (ja) * 2017-07-18 2022-03-01 株式会社アルバック 基板搬送装置
CN108203812B (zh) * 2018-01-25 2020-02-07 京东方科技集团股份有限公司 一种基板固定载具、蒸镀设备及蒸镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3021016B2 (ja) * 1990-10-04 2000-03-15 日本真空技術株式会社 基板冷却機構
US5181556A (en) * 1991-09-20 1993-01-26 Intevac, Inc. System for substrate cooling in an evacuated environment
JP3793273B2 (ja) * 1996-02-19 2006-07-05 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US5753092A (en) * 1996-08-26 1998-05-19 Velocidata, Inc. Cylindrical carriage sputtering system
JP2953395B2 (ja) * 1996-09-05 1999-09-27 日本電気株式会社 スパッタリング装置
US20060179848A1 (en) * 2005-02-14 2006-08-17 Asia Vital Component Co., Ltd. Radiator unit
US20070283709A1 (en) * 2006-06-09 2007-12-13 Veeco Instruments Inc. Apparatus and methods for managing the temperature of a substrate in a high vacuum processing system
JP2010093293A (ja) * 2010-01-14 2010-04-22 Canon Anelva Corp 絶縁膜エッチング装置

Also Published As

Publication number Publication date
JP2012031504A (ja) 2012-02-16
US20110315346A1 (en) 2011-12-29

Similar Documents

Publication Publication Date Title
JP5220147B2 (ja) 冷却装置および加熱装置
JP5462272B2 (ja) 基板冷却装置、スパッタリング装置および電子デバイスの製造方法
KR100886023B1 (ko) 가열처리장치
US7812285B2 (en) Apparatus and method for heating substrate and coating and developing system
CN103943537B (zh) 用于半导体衬底的快速加热和冷却的装置
KR101704159B1 (ko) 상부 기판 지지 어셈블리를 갖는 열 처리 챔버
JP2010126789A (ja) スパッタ成膜装置
KR20120092057A (ko) 열처리 장치 및 열처리 방법
US10425990B2 (en) Vacuum processing device
KR102397849B1 (ko) 기판 처리 장치
JP2010242113A (ja) 磁場中熱処理装置、及び、磁場中熱処理方法
JP3210415U (ja) 薄膜封入マスクの予熱及び基板のバッファチャンバ
JP2011184751A (ja) 冷却機構
JPH11176910A (ja) 基板搬送装置およびそれを備えた基板処理装置
JP2023069172A (ja) 基板の搬送を行う装置、及び基板を搬送する方法
JP4334486B2 (ja) 加熱処理装置
JP2010199355A (ja) 基板処理装置及び基板処理方法
JP7116558B2 (ja) 基板処理装置及び基板処理システム
JP4079596B2 (ja) 加熱処理装置
JPH10214772A (ja) 基板熱処理装置
JP2006049489A (ja) 基板処理装置
JP4302646B2 (ja) 加熱処理装置
JP2001230172A (ja) 基板処理装置
US11823880B2 (en) Target structure and film forming apparatus
JPH11219887A (ja) 熱処理装置

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20120713

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121015

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121015

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20121015

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20121203

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130201

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130221

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130305

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160315

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5220147

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250