JP2012031504A5 - - Google Patents

Download PDF

Info

Publication number
JP2012031504A5
JP2012031504A5 JP2011045872A JP2011045872A JP2012031504A5 JP 2012031504 A5 JP2012031504 A5 JP 2012031504A5 JP 2011045872 A JP2011045872 A JP 2011045872A JP 2011045872 A JP2011045872 A JP 2011045872A JP 2012031504 A5 JP2012031504 A5 JP 2012031504A5
Authority
JP
Japan
Prior art keywords
cooling
unit
enclosure
substrate
cooling means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011045872A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012031504A (ja
JP5220147B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011045872A priority Critical patent/JP5220147B2/ja
Priority claimed from JP2011045872A external-priority patent/JP5220147B2/ja
Publication of JP2012031504A publication Critical patent/JP2012031504A/ja
Publication of JP2012031504A5 publication Critical patent/JP2012031504A5/ja
Application granted granted Critical
Publication of JP5220147B2 publication Critical patent/JP5220147B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011045872A 2010-06-29 2011-03-03 冷却装置および加熱装置 Active JP5220147B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011045872A JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010147748 2010-06-29
JP2010147748 2010-06-29
JP2011045872A JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Publications (3)

Publication Number Publication Date
JP2012031504A JP2012031504A (ja) 2012-02-16
JP2012031504A5 true JP2012031504A5 (enrdf_load_stackoverflow) 2012-11-29
JP5220147B2 JP5220147B2 (ja) 2013-06-26

Family

ID=45351410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011045872A Active JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Country Status (2)

Country Link
US (1) US20110315346A1 (enrdf_load_stackoverflow)
JP (1) JP5220147B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101988014B1 (ko) * 2012-04-18 2019-06-13 삼성디스플레이 주식회사 어레이 기판의 제조 방법 및 이에 사용되는 제조 장치
KR101358805B1 (ko) * 2012-08-22 2014-02-07 에이피시스템 주식회사 냉각수 처리 장치, 방법 및 이를 적용한 기판 처리 장치
JP5849934B2 (ja) * 2012-11-16 2016-02-03 住友金属鉱山株式会社 真空成膜装置と真空成膜方法
US20140151360A1 (en) * 2012-11-30 2014-06-05 Wd Media, Inc. Heater assembly for disk processing system
JP6231399B2 (ja) * 2014-02-17 2017-11-15 キヤノンアネルバ株式会社 処理装置
JP7027057B2 (ja) * 2017-07-18 2022-03-01 株式会社アルバック 基板搬送装置
CN108203812B (zh) * 2018-01-25 2020-02-07 京东方科技集团股份有限公司 一种基板固定载具、蒸镀设备及蒸镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3021016B2 (ja) * 1990-10-04 2000-03-15 日本真空技術株式会社 基板冷却機構
US5181556A (en) * 1991-09-20 1993-01-26 Intevac, Inc. System for substrate cooling in an evacuated environment
JP3793273B2 (ja) * 1996-02-19 2006-07-05 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US5753092A (en) * 1996-08-26 1998-05-19 Velocidata, Inc. Cylindrical carriage sputtering system
JP2953395B2 (ja) * 1996-09-05 1999-09-27 日本電気株式会社 スパッタリング装置
US20060179848A1 (en) * 2005-02-14 2006-08-17 Asia Vital Component Co., Ltd. Radiator unit
US20070283709A1 (en) * 2006-06-09 2007-12-13 Veeco Instruments Inc. Apparatus and methods for managing the temperature of a substrate in a high vacuum processing system
JP2010093293A (ja) * 2010-01-14 2010-04-22 Canon Anelva Corp 絶縁膜エッチング装置

Similar Documents

Publication Publication Date Title
JP2012031504A5 (enrdf_load_stackoverflow)
JP2013045989A5 (enrdf_load_stackoverflow)
JP5550602B2 (ja) 静電チャックおよびこれを備えるドライエッチング装置
IN2012DN02784A (enrdf_load_stackoverflow)
JP2011071497A5 (ja) プラズマｃｖｄ装置
WO2011094100A3 (en) Adjustable process spacing, centering, and improved gas conductance
KR101444039B1 (ko) 기판 처리 장치 및 가열 장치
TW200733295A (en) Wafer holder, and wafer prober provided therewith
TW201612953A (en) Substrate support with more uniform edge purge
JP2011258965A5 (ja) 露光装置
WO2012067215A8 (ja) サイレンサ、エキゾーストバルブ、バルブ装置、エアドライヤ、車両用圧縮空気供給装置及び圧縮空気供給システム
WO2012047035A3 (ko) 대칭형 유입구 및 유출구를 통해 반응가스를 공급하는 기판 처리 장치
JP2013254723A5 (enrdf_load_stackoverflow)
WO2008126390A1 (ja) 空気調和機の電装品箱とそれを備えた空気調和機
RU2013156683A (ru) Наружный блок охлаждающего устройства
JP2010080614A5 (enrdf_load_stackoverflow)
WO2012036499A3 (ko) 박막 증착 장치
JP2012104579A5 (enrdf_load_stackoverflow)
JP2015015430A5 (enrdf_load_stackoverflow)
WO2014167615A1 (ja) スパッタリング装置
AR099253A1 (es) Fuente de recubrimiento o blanco para proveer material para recubrimiento por deposición física de vapor (pvd)
JP2015069968A5 (enrdf_load_stackoverflow)
MY184581A (en) Grinding apparatus
SG164332A1 (en) A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate
JP2006319201A5 (enrdf_load_stackoverflow)