IN2012DN02784A - - Google Patents
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- Publication number
- IN2012DN02784A IN2012DN02784A IN2784DEN2012A IN2012DN02784A IN 2012DN02784 A IN2012DN02784 A IN 2012DN02784A IN 2784DEN2012 A IN2784DEN2012 A IN 2784DEN2012A IN 2012DN02784 A IN2012DN02784 A IN 2012DN02784A
- Authority
- IN
- India
- Prior art keywords
- nozzle
- substrate
- disposed
- chamber
- active cooling
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 5
- 238000001816 cooling Methods 0.000 abstract 3
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000012159 carrier gas Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23965609P | 2009-09-03 | 2009-09-03 | |
| US12/870,125 US20110097495A1 (en) | 2009-09-03 | 2010-08-27 | Organic vapor jet printing with chiller plate |
| PCT/US2010/047625 WO2011028867A1 (en) | 2009-09-03 | 2010-09-02 | Organic vapor jet printing device with a chiller plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DN02784A true IN2012DN02784A (enrdf_load_stackoverflow) | 2015-09-18 |
Family
ID=43014428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2784DEN2012 IN2012DN02784A (enrdf_load_stackoverflow) | 2009-09-03 | 2010-09-02 |
Country Status (6)
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101626646B1 (ko) * | 2010-07-22 | 2016-06-01 | 유니버셜 디스플레이 코포레이션 | 유기 증기 제트 인쇄 |
| US20130273239A1 (en) * | 2012-03-13 | 2013-10-17 | Universal Display Corporation | Nozzle design for organic vapor jet printing |
| US8728858B2 (en) | 2012-08-27 | 2014-05-20 | Universal Display Corporation | Multi-nozzle organic vapor jet printing |
| CN103972392A (zh) * | 2013-02-01 | 2014-08-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | 有机薄膜场效应晶体管的制备方法 |
| CN103972095B (zh) * | 2013-02-01 | 2017-06-13 | 中国科学院苏州纳米技术与纳米仿生研究所 | 金属氧化物薄膜场效应晶体管的制备方法 |
| US11267012B2 (en) | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
| US11220737B2 (en) | 2014-06-25 | 2022-01-11 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| EP2960059B1 (en) | 2014-06-25 | 2018-10-24 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| US9583707B2 (en) | 2014-09-19 | 2017-02-28 | Universal Display Corporation | Micro-nozzle and micro-nozzle array for OVJP and method of manufacturing the same |
| US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
| US10704144B2 (en) * | 2015-10-12 | 2020-07-07 | Universal Display Corporation | Apparatus and method for printing multilayer organic thin films from vapor phase in an ultra-pure gas ambient |
| US10170701B2 (en) | 2016-03-04 | 2019-01-01 | Universal Display Corporation | Controlled deposition of materials using a differential pressure regime |
| KR102369676B1 (ko) | 2017-04-10 | 2022-03-04 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| KR20200138391A (ko) * | 2018-06-15 | 2020-12-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 증착 영역을 냉각시키기 위한 냉각 시스템, 증착 영역에서 재료를 증착하기 위한 어레인지먼트, 및 증착 영역에서 기판 상에 증착하는 방법 |
| US20190386256A1 (en) | 2018-06-18 | 2019-12-19 | Universal Display Corporation | Sequential material sources for thermally challenged OLED materials |
| CN108909184A (zh) * | 2018-07-17 | 2018-11-30 | 深圳市华星光电技术有限公司 | 具有温度调节功能的打印喷头、打印装置 |
| EP4380800A4 (en) | 2021-08-05 | 2025-06-18 | Sekisui Kydex, LLC | MULTI-STATION DYE SUBLIMATION DEVICE TO PREHEAT AND FACILITATE SIMULTANEOUS SUBLIMATION CYCLES |
| US20230363244A1 (en) * | 2022-05-09 | 2023-11-09 | Universal Display Corporation | Organic vapor jet printing system |
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|---|---|---|---|---|
| US3468308A (en) | 1966-01-17 | 1969-09-23 | Howard R Bierman | Pressure infusion device for ambulatory patients with pressure control means |
| JPS621870A (ja) * | 1985-06-25 | 1987-01-07 | Nec Corp | 蒸着装置 |
| JPH0682642B2 (ja) * | 1985-08-09 | 1994-10-19 | 株式会社日立製作所 | 表面処理装置 |
| GB8909011D0 (en) * | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
| JPH0382020A (ja) * | 1989-08-24 | 1991-04-08 | Mitsubishi Electric Corp | 化学気相成長装置 |
| KR920003424A (ko) * | 1990-07-13 | 1992-02-29 | 미다 가쓰시게 | 표면처리 장치, 표면처리방법 및 반도체장치의 제조방법 |
| JP2951769B2 (ja) * | 1991-05-07 | 1999-09-20 | 株式会社富士電機総合研究所 | 気相成長装置 |
| US5421883A (en) * | 1994-03-15 | 1995-06-06 | Bowden Industries, Inc. | Industrial parts cleaning method and system |
| US6200389B1 (en) * | 1994-07-18 | 2001-03-13 | Silicon Valley Group Thermal Systems Llc | Single body injector and deposition chamber |
| US5703436A (en) * | 1994-12-13 | 1997-12-30 | The Trustees Of Princeton University | Transparent contacts for organic devices |
| US5707745A (en) * | 1994-12-13 | 1998-01-13 | The Trustees Of Princeton University | Multicolor organic light emitting devices |
| AU681934B2 (en) * | 1995-03-14 | 1997-09-11 | Kalford Pty Ltd | A hinge |
| US5844363A (en) | 1997-01-23 | 1998-12-01 | The Trustees Of Princeton Univ. | Vacuum deposited, non-polymeric flexible organic light emitting devices |
| US6013982A (en) * | 1996-12-23 | 2000-01-11 | The Trustees Of Princeton University | Multicolor display devices |
| US5834893A (en) * | 1996-12-23 | 1998-11-10 | The Trustees Of Princeton University | High efficiency organic light emitting devices with light directing structures |
| US6091195A (en) * | 1997-02-03 | 2000-07-18 | The Trustees Of Princeton University | Displays having mesa pixel configuration |
| US6303238B1 (en) * | 1997-12-01 | 2001-10-16 | The Trustees Of Princeton University | OLEDs doped with phosphorescent compounds |
| US6337102B1 (en) * | 1997-11-17 | 2002-01-08 | The Trustees Of Princeton University | Low pressure vapor phase deposition of organic thin films |
| US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
| JPH11273557A (ja) * | 1998-03-19 | 1999-10-08 | Mitsubishi Electric Corp | プラズマディスプレイパネルの製造方法及びその製造に用いられるインクジェットプリンタ装置 |
| US6108937A (en) * | 1998-09-10 | 2000-08-29 | Asm America, Inc. | Method of cooling wafers |
| US6097147A (en) * | 1998-09-14 | 2000-08-01 | The Trustees Of Princeton University | Structure for high efficiency electroluminescent device |
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| KR100470986B1 (ko) * | 2000-03-14 | 2005-03-07 | 주성엔지니어링(주) | 반도체소자 제조용 고진공 장치 및 이를 이용한 에피택셜막 형성방법 |
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| US7744957B2 (en) * | 2003-10-23 | 2010-06-29 | The Trustees Of Princeton University | Method and apparatus for depositing material |
| CN1287002C (zh) * | 2001-09-04 | 2006-11-29 | 普林斯顿大学理事会 | 喷射沉积有机物蒸汽的方法和装置 |
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| US7267723B2 (en) * | 2003-05-13 | 2007-09-11 | Dainippon Screen Mfg. Co., Ltd. | Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle |
| AU2004266934B2 (en) * | 2003-08-22 | 2010-03-11 | Tokuyama Corporation | Silicon manufacturing apparatus |
| US7279704B2 (en) * | 2004-05-18 | 2007-10-09 | The University Of Southern California | Complexes with tridentate ligands |
| US20060242967A1 (en) * | 2005-04-28 | 2006-11-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Termoelectric heating and cooling apparatus for semiconductor processing |
| JP4894193B2 (ja) * | 2005-08-09 | 2012-03-14 | ソニー株式会社 | 蒸着装置、および表示装置の製造システム |
| US20070178225A1 (en) * | 2005-12-14 | 2007-08-02 | Keiji Takanosu | Vapor deposition crucible, thin-film forming apparatus comprising the same, and method of producing display device |
| US7879401B2 (en) | 2006-12-22 | 2011-02-01 | The Regents Of The University Of Michigan | Organic vapor jet deposition using an exhaust |
| JP5207433B2 (ja) * | 2007-02-21 | 2013-06-12 | ヤマハ発動機株式会社 | 船外機 |
| US8375890B2 (en) * | 2007-03-19 | 2013-02-19 | Micron Technology, Inc. | Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers |
| US8241457B2 (en) * | 2007-03-30 | 2012-08-14 | Tokyo Electron Limited | Plasma processing system, plasma measurement system, plasma measurement method, and plasma control system |
| EP2187709B1 (en) * | 2007-09-10 | 2018-03-21 | Ulvac, Inc. | Vapor emission device, organic thin-film vapor deposition apparatus and method of organic thin-film vapor deposition |
| JP5201932B2 (ja) * | 2007-09-10 | 2013-06-05 | 株式会社アルバック | 供給装置、及び有機蒸着装置 |
| JP5527933B2 (ja) * | 2007-11-30 | 2014-06-25 | 東京エレクトロン株式会社 | 成膜装置の制御方法、成膜方法、成膜装置、有機el電子デバイスおよびその制御プログラムを格納した記憶媒体 |
| CN102414863B (zh) * | 2009-05-01 | 2015-06-03 | 卡帝瓦公司 | 用于有机蒸汽印刷的方法和设备 |
-
2010
- 2010-08-27 US US12/870,125 patent/US20110097495A1/en not_active Abandoned
- 2010-09-02 EP EP10760155.1A patent/EP2473646B1/en active Active
- 2010-09-02 CN CN201080049000.0A patent/CN102597299B/zh active Active
- 2010-09-02 WO PCT/US2010/047625 patent/WO2011028867A1/en active Application Filing
- 2010-09-02 KR KR1020127008157A patent/KR101940328B1/ko active Active
- 2010-09-02 IN IN2784DEN2012 patent/IN2012DN02784A/en unknown
- 2010-09-02 KR KR1020167032350A patent/KR20160136469A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120058591A (ko) | 2012-06-07 |
| CN102597299B (zh) | 2015-05-13 |
| EP2473646B1 (en) | 2018-12-05 |
| US20110097495A1 (en) | 2011-04-28 |
| EP2473646A1 (en) | 2012-07-11 |
| KR101940328B1 (ko) | 2019-01-18 |
| KR20160136469A (ko) | 2016-11-29 |
| WO2011028867A1 (en) | 2011-03-10 |
| CN102597299A (zh) | 2012-07-18 |
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