JP2012031504A5

JP2012031504A5 -

Info

Publication number: JP2012031504A5
Application number: JP2011045872A
Authority: JP
Filing date: 2011-03-03
Publication date: 2012-11-29
Anticipated expiration: 2031-03-03

Description

本発明の冷却装置は、チャンバと、前記チャンバ内に設けられ、基板を冷却するように構成された第１冷却手段と、前記チャンバ内において前記第１冷却手段と対向配置され、前記基板を冷却するように構成された第２冷却手段と、前記第１冷却手段と前記第２冷却手段との間の配置領域に、基板を保持している基板保持部を配置するように構成された配置手段と、前記第１冷却手段および第２冷却手段のうち少なくとも一方に設けられ、基板冷却に寄与するガスを放出するガス放出口と、前記ガス放出口に前記ガスを供給するガス供給手段と、前記配置領域に配置された前記基板保持部に近接するように、前記第１冷却手段及び第２冷却手段を移動する移動手段と、前記移動手段により、前記第１冷却手段と第２冷却手段とが前記基板に接近した際、前記基板を囲む空間を形成する囲い部とを備えることを特徴とする。 The cooling device of the present invention is provided with a chamber, a first cooling means provided in the chamber and configured to cool the substrate, and disposed opposite to the first cooling means in the chamber to cool the substrate. A second cooling unit configured to perform the arrangement, and an arrangement unit configured to arrange a substrate holding unit that holds the substrate in an arrangement region between the first cooling unit and the second cooling unit. A gas outlet that is provided in at least one of the first cooling means and the second cooling means and discharges a gas that contributes to substrate cooling; a gas supply means that supplies the gas to the gas outlet; and so as to be close to the substrate holder, which is arranged in the arrangement region, and moving means for moving the first cooling means and the second cooling means, by said moving means and said first cooling means and the second cooling means In contact with the substrate When the, characterized in that it comprises a surrounding portion forming a space surrounding the substrate.

具体的には、上述の冷却装置の囲い部は、前記第１冷却手段を支持する支持部と前記第２冷却手段を支持する支持部との少なくとも一方に設けられ、自身が設けられた支持部に支持された冷却手段の周囲を囲み、かつ対向する冷却手段の方に延在し、さらに前記自身が設けられた支持部に支持された冷却手段と前記対向する冷却手段とを連通させるように開口されていると好適である。Specifically, the enclosure of the cooling device described above is provided on at least one of the support part that supports the first cooling means and the support part that supports the second cooling means, and the support part provided with the enclosure. Surrounding the cooling means supported by and extending toward the opposing cooling means, and further, the cooling means supported by the support portion provided with the cooling means and the opposing cooling means are communicated with each other It is preferable that it is opened.

Claims

A chamber;
First cooling means provided in the chamber and configured to cool the substrate;
A second cooling means disposed opposite to the first cooling means in the chamber and configured to cool the substrate;
An arrangement unit configured to arrange a substrate holding unit holding a substrate in an arrangement region between the first cooling unit and the second cooling unit;
A gas discharge port that is provided in at least one of the first cooling unit and the second cooling unit and discharges a gas that contributes to substrate cooling;
Gas supply means for supplying the gas to the gas discharge port;
Moving means for moving the first cooling means and the second cooling means so as to be close to the substrate holding part arranged in the arrangement region;
A cooling device comprising: an enclosure that forms a space surrounding the substrate when the first cooling unit and the second cooling unit approach the substrate by the moving unit .

The enclosure is, around the at least one the disposed et the first support portion supporting portion for supporting the cooling means and supporting said second cooling means is a cooling means supported by the supporting portion itself is provided the surrounding and extending towards the opposite cooling means, and characterized in that it is opened to allow further communication between the cooling means for the facing and supported cooling means supporting portion to which the own provided The cooling device according to claim 1.

The enclosure is provided around the first cooling unit, and includes a first enclosure that surrounds at least a part of a space between the first cooling unit and the second cooling unit, and the second cooling unit. A second enclosure that surrounds at least a portion of the space between the second cooling means and the first cooling means ,
When the first cooling unit and the second cooling unit approach the substrate holding unit arranged in the arrangement region by the moving unit, the first enclosure unit and the second enclosure unit The cooling device according to claim 1, wherein a region between the second enclosure and the second enclosure is configured to have a labyrinth shape.

The arrangement means holds a substrate having a center opening,
The gas discharge port discharges the gas to the center opening of the substrate held by the arrangement means,
When the first cooling unit and the second cooling unit approach the substrate holding unit arranged in the arrangement region by the moving unit, the first enclosure unit and the second enclosure unit The cooling device according to claim 3, wherein a space for confining the substrate is formed in a region between the second enclosure and the second enclosure.

2. The cooling device according to claim 1, wherein the first cooling unit and the second cooling unit further include a Peltier element and an air pipe for introducing air for cooling the Peltier element.