JP5197263B2 - 端子取付け構造及び端子取付け方法 - Google Patents

端子取付け構造及び端子取付け方法 Download PDF

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Publication number
JP5197263B2
JP5197263B2 JP2008236868A JP2008236868A JP5197263B2 JP 5197263 B2 JP5197263 B2 JP 5197263B2 JP 2008236868 A JP2008236868 A JP 2008236868A JP 2008236868 A JP2008236868 A JP 2008236868A JP 5197263 B2 JP5197263 B2 JP 5197263B2
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JP
Japan
Prior art keywords
terminal
substrate
conductor
elastic
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008236868A
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English (en)
Japanese (ja)
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JP2009105036A (ja
JP2009105036A5 (enExample
Inventor
未来 米山
恒一郎 川手
研爾 桑原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008236868A priority Critical patent/JP5197263B2/ja
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to PCT/US2009/031879 priority patent/WO2010033259A1/en
Priority to CA2737276A priority patent/CA2737276A1/en
Priority to EP09814919A priority patent/EP2340587A1/en
Priority to US13/063,843 priority patent/US20110163569A1/en
Priority to CN2009801364286A priority patent/CN102160240A/zh
Publication of JP2009105036A publication Critical patent/JP2009105036A/ja
Publication of JP2009105036A5 publication Critical patent/JP2009105036A5/ja
Application granted granted Critical
Publication of JP5197263B2 publication Critical patent/JP5197263B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2008236868A 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法 Expired - Fee Related JP5197263B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008236868A JP5197263B2 (ja) 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法
CA2737276A CA2737276A1 (en) 2008-09-16 2009-01-23 Terminal mounting structure and method
EP09814919A EP2340587A1 (en) 2008-09-16 2009-01-23 Terminal mounting structure and method
US13/063,843 US20110163569A1 (en) 2007-10-01 2009-01-23 Terminal mounting structure and method
PCT/US2009/031879 WO2010033259A1 (en) 2008-09-16 2009-01-23 Terminal mounting structure and method
CN2009801364286A CN102160240A (zh) 2008-09-16 2009-01-23 端子安装结构和方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007257681 2007-10-01
JP2007257681 2007-10-01
JP2008236868A JP5197263B2 (ja) 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法

Publications (3)

Publication Number Publication Date
JP2009105036A JP2009105036A (ja) 2009-05-14
JP2009105036A5 JP2009105036A5 (enExample) 2011-11-04
JP5197263B2 true JP5197263B2 (ja) 2013-05-15

Family

ID=40706486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008236868A Expired - Fee Related JP5197263B2 (ja) 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法

Country Status (2)

Country Link
US (1) US20110163569A1 (enExample)
JP (1) JP5197263B2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5208816B2 (ja) * 2009-03-06 2013-06-12 日本板硝子株式会社 端子付ガラス及び端子付ガラス搭載車両
JP2012248425A (ja) 2011-05-27 2012-12-13 Three M Innovative Properties Co 端子
JP2012248419A (ja) 2011-05-27 2012-12-13 Three M Innovative Properties Co 端子
JP5764447B2 (ja) * 2011-09-26 2015-08-19 ミネベア株式会社 インナーロータ型ブラシレスモータ
WO2014024980A1 (ja) * 2012-08-10 2014-02-13 旭硝子株式会社 電気接続構造及びそれを有する端子付きガラス板、並びに端子付きガラス板の製造方法
JP6079088B2 (ja) * 2012-09-21 2017-02-15 Smk株式会社 コネクタの端子構造
JP2014072101A (ja) * 2012-09-28 2014-04-21 3M Innovative Properties Co 端子および端子構造体
US9338915B1 (en) 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
US9521748B1 (en) 2013-12-09 2016-12-13 Multek Technologies, Ltd. Mechanical measures to limit stress and strain in deformable electronics
WO2015128625A1 (en) * 2014-02-25 2015-09-03 Pilkington Group Limited Method of making a window assembly having an electrically heated portion and the window assembly made thereby
JP6417764B2 (ja) * 2014-07-24 2018-11-07 セイコーエプソン株式会社 電子部品、電子部品の製造方法、電子機器、および移動体
US10154583B1 (en) 2015-03-27 2018-12-11 Flex Ltd Mechanical strain reduction on flexible and rigid-flexible circuits
JP6753414B2 (ja) * 2015-11-05 2020-09-09 Ａｇｃ株式会社 電気接続構造、端子付きガラス板、及び端子付きガラス板の製造方法
US9992880B2 (en) 2015-11-12 2018-06-05 Multek Technologies Limited Rigid-bend printed circuit board fabrication
US20170194721A1 (en) * 2016-01-06 2017-07-06 Chih-Peng Fan Electrical Connector and Method of Making It
DE112018007110B4 (de) * 2018-02-19 2025-08-07 Mitsubishi Electric Corporation Leitungsstruktur
DE102018203523B4 (de) * 2018-03-08 2023-11-16 Magna Car Top Systems Gmbh Heckscheibe mit Heckscheibenheizung für ein Kraftfahrzeug, insbesondere ein Cabriolet-Fahrzeug und deren Herstellungsverfahren
GB201817357D0 (en) * 2018-10-25 2018-12-12 Strip Tinning Ltd Flexible connector
LU101059B1 (en) * 2018-12-17 2020-06-17 Iee Sa Flexible Multilayer Encapsulation of Electrical Connections
US20220013938A1 (en) 2018-11-07 2022-01-13 Iee International Electronics & Engineering S.A. Flexible multilayer encapsulation of electrical connections
DE102020004282A1 (de) * 2019-07-24 2021-01-28 AGC lnc. Elektrische verbindungsstruktur
JP2022544498A (ja) * 2019-08-13 2022-10-19 サン－ゴバン グラス フランス ガラス基材上の銀ワイヤの腐食低減
KR102847235B1 (ko) * 2020-06-17 2025-08-14 주식회사 엘지에너지솔루션 버스바와 전압 센싱부재의 연결구조로서 비용접 방식 구조가 적용된 배터리 모듈
CN114130610A (zh) * 2021-11-24 2022-03-04 福建省睿步智能装备有限公司 一种旅行箱饰件自动涂胶保压固化设备
US12424807B2 (en) 2022-07-08 2025-09-23 Agc Automotive Americas Co. Method of manufacturing a window assembly with a solderless electrical connector

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810970Y2 (ja) * 1990-09-18 1996-03-29 日本板硝子株式会社 シート状アンテナとフィーダ線との接続構造
JP2002111346A (ja) * 2000-10-02 2002-04-12 Fujikura Ltd フィルムセンサ
JP2004079527A (ja) * 2002-08-01 2004-03-11 Fuji Name Plate Kk 面状ヒータ用電源供給端子及び該面状ヒータ用電源供給端子を備えた面状ヒータ
JP2005347172A (ja) * 2004-06-04 2005-12-15 Asahi Glass Co Ltd ガラス板の電気接続構造
JP2007018981A (ja) * 2005-07-11 2007-01-25 Nippon Sheet Glass Co Ltd 窓ガラスへの端子取付け構造

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JP2009105036A (ja) 2009-05-14
US20110163569A1 (en) 2011-07-07

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