JP5191484B2 - 表面検査装置 - Google Patents

表面検査装置 Download PDF

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Publication number
JP5191484B2
JP5191484B2 JP2009512994A JP2009512994A JP5191484B2 JP 5191484 B2 JP5191484 B2 JP 5191484B2 JP 2009512994 A JP2009512994 A JP 2009512994A JP 2009512994 A JP2009512994 A JP 2009512994A JP 5191484 B2 JP5191484 B2 JP 5191484B2
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Japan
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outer peripheral
image
imaging
irradiation
plate
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English (en)
Japanese (ja)
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JPWO2008136432A1 (ja
Inventor
義典 林
征雄 川村
秀樹 森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2009512994A priority Critical patent/JP5191484B2/ja
Publication of JPWO2008136432A1 publication Critical patent/JPWO2008136432A1/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2009512994A 2007-04-27 2008-04-25 表面検査装置 Expired - Fee Related JP5191484B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009512994A JP5191484B2 (ja) 2007-04-27 2008-04-25 表面検査装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007120174 2007-04-27
JP2007120174 2007-04-27
JP2009512994A JP5191484B2 (ja) 2007-04-27 2008-04-25 表面検査装置
PCT/JP2008/058124 WO2008136432A1 (ja) 2007-04-27 2008-04-25 表面検査装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012251312A Division JP5489186B2 (ja) 2007-04-27 2012-11-15 表面検査装置

Publications (2)

Publication Number Publication Date
JPWO2008136432A1 JPWO2008136432A1 (ja) 2010-07-29
JP5191484B2 true JP5191484B2 (ja) 2013-05-08

Family

ID=39943539

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009512994A Expired - Fee Related JP5191484B2 (ja) 2007-04-27 2008-04-25 表面検査装置
JP2012251312A Expired - Fee Related JP5489186B2 (ja) 2007-04-27 2012-11-15 表面検査装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012251312A Expired - Fee Related JP5489186B2 (ja) 2007-04-27 2012-11-15 表面検査装置

Country Status (5)

Country Link
US (1) US8023111B2 (enExample)
JP (2) JP5191484B2 (enExample)
KR (1) KR101120226B1 (enExample)
DE (1) DE112008001114B4 (enExample)
WO (1) WO2008136432A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5636166B2 (ja) * 2009-04-22 2014-12-03 株式会社レイテックス 表面検査用照明装置
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
US11026361B2 (en) * 2013-03-15 2021-06-01 John S. Youngquist Linear/angular correction of pick-and-place held component and related optical subsystem
KR20160040044A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 패널 검사장치 및 검사방법
EP3926330A1 (en) 2014-12-05 2021-12-22 Kla-Tencor Corporation Apparatus and method for defect detection in work pieces
KR102402392B1 (ko) 2015-03-13 2022-05-27 코닝 인코포레이티드 연부 강도 테스팅 방법 및 장치
CN107026095A (zh) * 2016-02-01 2017-08-08 易发精机股份有限公司 晶圆边缘量测模组
JP7161905B2 (ja) * 2018-10-15 2022-10-27 アルテミラ株式会社 缶蓋検査機並びにカメラ位置調整方法
KR102734714B1 (ko) * 2021-12-08 2024-11-27 주식회사 앤비젼 다면 이미징 광학 장치
CN114322773A (zh) * 2021-12-31 2022-04-12 杭州电子科技大学 一种用于长条薄片零件视觉检测的装置及其检测方法
KR102571868B1 (ko) * 2022-09-20 2023-08-30 주식회사 아이엠반도체 웨이퍼 엣지 검사용 광원 모듈 및 웨이퍼 엣지 검사 장치
CN115931903B (zh) * 2023-02-02 2023-05-26 苏州高视半导体技术有限公司 边缘检测镜头及系统
JP2024158608A (ja) * 2023-04-28 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 撮像装置、基板観察装置、基板処理装置および撮像方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01233571A (ja) * 1988-03-15 1989-09-19 Fujitsu Ltd ピングリッドアレイ型部品のピン曲り検出装置
JPH04215045A (ja) * 1990-12-12 1992-08-05 Mitsubishi Rayon Co Ltd レーザ検査装置
JP2999712B2 (ja) 1996-03-29 2000-01-17 住友金属工業株式会社 端部欠陥検査方法とその装置
JP2002310924A (ja) * 2001-04-17 2002-10-23 Toray Ind Inc シートの欠陥検査装置及びシートの製造方法
JP4078050B2 (ja) * 2001-08-24 2008-04-23 京都電機器株式会社 Ｌｅｄ照明装置
JP2004191214A (ja) * 2002-12-12 2004-07-08 Kokusai Gijutsu Kaihatsu Co Ltd ライン照明装置及びライン照明装置を用いた検査装置
JP4244305B2 (ja) * 2003-08-27 2009-03-25 株式会社トプコン 照明光学系及びこれを用いたパターン欠陥検査装置
JP4454356B2 (ja) * 2004-03-25 2010-04-21 シーシーエス株式会社 光照射装置及び光照射装置用ヘッド
JP2006017685A (ja) * 2004-06-30 2006-01-19 Nippon Electro Sensari Device Kk 表面欠陥検査装置
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus
JP4990630B2 (ja) * 2004-11-30 2012-08-01 コバレントマテリアル株式会社 表面検査装置及び表面検査方法

Also Published As

Publication number Publication date
JP5489186B2 (ja) 2014-05-14
DE112008001114T5 (de) 2010-06-10
US8023111B2 (en) 2011-09-20
DE112008001114B4 (de) 2014-02-27
WO2008136432A1 (ja) 2008-11-13
US20100066998A1 (en) 2010-03-18
KR101120226B1 (ko) 2012-03-20
JP2013033068A (ja) 2013-02-14
KR20090118105A (ko) 2009-11-17
JPWO2008136432A1 (ja) 2010-07-29

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