KR101120226B1 - 표면 검사 장치 - Google Patents

표면 검사 장치 Download PDF

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Publication number
KR101120226B1
KR101120226B1 KR1020097020908A KR20097020908A KR101120226B1 KR 101120226 B1 KR101120226 B1 KR 101120226B1 KR 1020097020908 A KR1020097020908 A KR 1020097020908A KR 20097020908 A KR20097020908 A KR 20097020908A KR 101120226 B1 KR101120226 B1 KR 101120226B1
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KR
South Korea
Prior art keywords
outer circumferential
image
imaging
semiconductor wafer
light
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Expired - Fee Related
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KR1020097020908A
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English (en)
Korean (ko)
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KR20090118105A (ko
Inventor
요시노리 하야시
마사오 가와무라
히데키 모리
Original Assignee
시바우라 메카트로닉스 가부시키가이샤
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Publication of KR20090118105A publication Critical patent/KR20090118105A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020097020908A 2007-04-27 2008-04-25 표면 검사 장치 Expired - Fee Related KR101120226B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-120174 2007-04-27
JP2007120174 2007-04-27
PCT/JP2008/058124 WO2008136432A1 (ja) 2007-04-27 2008-04-25 表面検査装置

Publications (2)

Publication Number Publication Date
KR20090118105A KR20090118105A (ko) 2009-11-17
KR101120226B1 true KR101120226B1 (ko) 2012-03-20

Family

ID=39943539

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097020908A Expired - Fee Related KR101120226B1 (ko) 2007-04-27 2008-04-25 표면 검사 장치

Country Status (5)

Country Link
US (1) US8023111B2 (enExample)
JP (2) JP5191484B2 (enExample)
KR (1) KR101120226B1 (enExample)
DE (1) DE112008001114B4 (enExample)
WO (1) WO2008136432A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5636166B2 (ja) * 2009-04-22 2014-12-03 株式会社レイテックス 表面検査用照明装置
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
US11026361B2 (en) * 2013-03-15 2021-06-01 John S. Youngquist Linear/angular correction of pick-and-place held component and related optical subsystem
KR20160040044A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 패널 검사장치 및 검사방법
EP3926330A1 (en) 2014-12-05 2021-12-22 Kla-Tencor Corporation Apparatus and method for defect detection in work pieces
JP6875285B2 (ja) 2015-03-13 2021-05-19 コーニング インコーポレイテッド エッジ強度試験方法および装置
CN107026095A (zh) * 2016-02-01 2017-08-08 易发精机股份有限公司 晶圆边缘量测模组
JP7161905B2 (ja) * 2018-10-15 2022-10-27 アルテミラ株式会社 缶蓋検査機並びにカメラ位置調整方法
KR102734714B1 (ko) * 2021-12-08 2024-11-27 주식회사 앤비젼 다면 이미징 광학 장치
CN114322773A (zh) * 2021-12-31 2022-04-12 杭州电子科技大学 一种用于长条薄片零件视觉检测的装置及其检测方法
KR102571868B1 (ko) * 2022-09-20 2023-08-30 주식회사 아이엠반도체 웨이퍼 엣지 검사용 광원 모듈 및 웨이퍼 엣지 검사 장치
CN115931903B (zh) * 2023-02-02 2023-05-26 苏州高视半导体技术有限公司 边缘检测镜头及系统
JP2024158608A (ja) * 2023-04-28 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 撮像装置、基板観察装置、基板処理装置および撮像方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002310924A (ja) * 2001-04-17 2002-10-23 Toray Ind Inc シートの欠陥検査装置及びシートの製造方法
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01233571A (ja) * 1988-03-15 1989-09-19 Fujitsu Ltd ピングリッドアレイ型部品のピン曲り検出装置
JPH04215045A (ja) * 1990-12-12 1992-08-05 Mitsubishi Rayon Co Ltd レーザ検査装置
JP2999712B2 (ja) * 1996-03-29 2000-01-17 住友金属工業株式会社 端部欠陥検査方法とその装置
JP4078050B2 (ja) 2001-08-24 2008-04-23 京都電機器株式会社 Ｌｅｄ照明装置
JP2004191214A (ja) * 2002-12-12 2004-07-08 Kokusai Gijutsu Kaihatsu Co Ltd ライン照明装置及びライン照明装置を用いた検査装置
JP4244305B2 (ja) * 2003-08-27 2009-03-25 株式会社トプコン 照明光学系及びこれを用いたパターン欠陥検査装置
JP4454356B2 (ja) * 2004-03-25 2010-04-21 シーシーエス株式会社 光照射装置及び光照射装置用ヘッド
JP2006017685A (ja) * 2004-06-30 2006-01-19 Nippon Electro Sensari Device Kk 表面欠陥検査装置
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002310924A (ja) * 2001-04-17 2002-10-23 Toray Ind Inc シートの欠陥検査装置及びシートの製造方法
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Also Published As

Publication number Publication date
WO2008136432A1 (ja) 2008-11-13
JP5489186B2 (ja) 2014-05-14
JPWO2008136432A1 (ja) 2010-07-29
JP2013033068A (ja) 2013-02-14
KR20090118105A (ko) 2009-11-17
US8023111B2 (en) 2011-09-20
DE112008001114B4 (de) 2014-02-27
US20100066998A1 (en) 2010-03-18
JP5191484B2 (ja) 2013-05-08
DE112008001114T5 (de) 2010-06-10

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