DE112008001114B4 - Vorrichtung für die Oberflächenprüfung - Google Patents

Vorrichtung für die Oberflächenprüfung Download PDF

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Publication number
DE112008001114B4
DE112008001114B4 DE112008001114.1T DE112008001114T DE112008001114B4 DE 112008001114 B4 DE112008001114 B4 DE 112008001114B4 DE 112008001114 T DE112008001114 T DE 112008001114T DE 112008001114 B4 DE112008001114 B4 DE 112008001114B4
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DE
Germany
Prior art keywords
outer peripheral
light
slope surface
plate
camera lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112008001114.1T
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German (de)
English (en)
Other versions
DE112008001114T5 (de
Inventor
Yoshinori Hayashi
Masao Kawamura
Hideki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of DE112008001114T5 publication Critical patent/DE112008001114T5/de
Application granted granted Critical
Publication of DE112008001114B4 publication Critical patent/DE112008001114B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE112008001114.1T 2007-04-27 2008-04-25 Vorrichtung für die Oberflächenprüfung Expired - Fee Related DE112008001114B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007120174 2007-04-27
JP2007-120174 2007-04-27
PCT/JP2008/058124 WO2008136432A1 (ja) 2007-04-27 2008-04-25 表面検査装置

Publications (2)

Publication Number Publication Date
DE112008001114T5 DE112008001114T5 (de) 2010-06-10
DE112008001114B4 true DE112008001114B4 (de) 2014-02-27

Family

ID=39943539

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112008001114.1T Expired - Fee Related DE112008001114B4 (de) 2007-04-27 2008-04-25 Vorrichtung für die Oberflächenprüfung

Country Status (5)

Country Link
US (1) US8023111B2 (enExample)
JP (2) JP5191484B2 (enExample)
KR (1) KR101120226B1 (enExample)
DE (1) DE112008001114B4 (enExample)
WO (1) WO2008136432A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5636166B2 (ja) * 2009-04-22 2014-12-03 株式会社レイテックス 表面検査用照明装置
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
US11026361B2 (en) * 2013-03-15 2021-06-01 John S. Youngquist Linear/angular correction of pick-and-place held component and related optical subsystem
KR20160040044A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 패널 검사장치 및 검사방법
KR102386192B1 (ko) 2014-12-05 2022-04-12 케이엘에이 코포레이션 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR102402392B1 (ko) 2015-03-13 2022-05-27 코닝 인코포레이티드 연부 강도 테스팅 방법 및 장치
CN107026095A (zh) * 2016-02-01 2017-08-08 易发精机股份有限公司 晶圆边缘量测模组
JP7161905B2 (ja) * 2018-10-15 2022-10-27 アルテミラ株式会社 缶蓋検査機並びにカメラ位置調整方法
KR102734714B1 (ko) * 2021-12-08 2024-11-27 주식회사 앤비젼 다면 이미징 광학 장치
CN114322773A (zh) * 2021-12-31 2022-04-12 杭州电子科技大学 一种用于长条薄片零件视觉检测的装置及其检测方法
KR102571868B1 (ko) * 2022-09-20 2023-08-30 주식회사 아이엠반도체 웨이퍼 엣지 검사용 광원 모듈 및 웨이퍼 엣지 검사 장치
CN115931903B (zh) * 2023-02-02 2023-05-26 苏州高视半导体技术有限公司 边缘检测镜头及系统
JP2024158608A (ja) * 2023-04-28 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 撮像装置、基板観察装置、基板処理装置および撮像方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003065960A (ja) * 2001-08-24 2003-03-05 Kyoto Denkiki Kk Ｌｅｄ照明装置
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01233571A (ja) * 1988-03-15 1989-09-19 Fujitsu Ltd ピングリッドアレイ型部品のピン曲り検出装置
JPH04215045A (ja) * 1990-12-12 1992-08-05 Mitsubishi Rayon Co Ltd レーザ検査装置
JP2999712B2 (ja) * 1996-03-29 2000-01-17 住友金属工業株式会社 端部欠陥検査方法とその装置
JP2002310924A (ja) * 2001-04-17 2002-10-23 Toray Ind Inc シートの欠陥検査装置及びシートの製造方法
JP2004191214A (ja) * 2002-12-12 2004-07-08 Kokusai Gijutsu Kaihatsu Co Ltd ライン照明装置及びライン照明装置を用いた検査装置
JP4244305B2 (ja) * 2003-08-27 2009-03-25 株式会社トプコン 照明光学系及びこれを用いたパターン欠陥検査装置
JP4454356B2 (ja) * 2004-03-25 2010-04-21 シーシーエス株式会社 光照射装置及び光照射装置用ヘッド
JP2006017685A (ja) * 2004-06-30 2006-01-19 Nippon Electro Sensari Device Kk 表面欠陥検査装置
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003065960A (ja) * 2001-08-24 2003-03-05 Kyoto Denkiki Kk Ｌｅｄ照明装置
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Also Published As

Publication number Publication date
KR101120226B1 (ko) 2012-03-20
JP2013033068A (ja) 2013-02-14
JPWO2008136432A1 (ja) 2010-07-29
JP5489186B2 (ja) 2014-05-14
US8023111B2 (en) 2011-09-20
WO2008136432A1 (ja) 2008-11-13
DE112008001114T5 (de) 2010-06-10
US20100066998A1 (en) 2010-03-18
JP5191484B2 (ja) 2013-05-08
KR20090118105A (ko) 2009-11-17

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