JP5185062B2 - 積層型半導体装置及び電子機器 - Google Patents

積層型半導体装置及び電子機器 Download PDF

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Publication number
JP5185062B2
JP5185062B2 JP2008270414A JP2008270414A JP5185062B2 JP 5185062 B2 JP5185062 B2 JP 5185062B2 JP 2008270414 A JP2008270414 A JP 2008270414A JP 2008270414 A JP2008270414 A JP 2008270414A JP 5185062 B2 JP5185062 B2 JP 5185062B2
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semiconductor device
semiconductor chip
stacked
metal
metal post
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Japanese (ja)
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JP2010103129A5 (enExample
JP2010103129A (ja
Inventor
貴寿 大隅
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2008270414A priority Critical patent/JP5185062B2/ja
Priority to PCT/JP2009/003134 priority patent/WO2010047014A1/ja
Publication of JP2010103129A publication Critical patent/JP2010103129A/ja
Publication of JP2010103129A5 publication Critical patent/JP2010103129A5/ja
Priority to US13/008,579 priority patent/US8269335B2/en
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Publication of JP5185062B2 publication Critical patent/JP5185062B2/ja
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    • H10W90/701—
    • H10W90/00—
    • H10W70/60—
    • H10W74/15—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

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  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008270414A 2008-10-21 2008-10-21 積層型半導体装置及び電子機器 Active JP5185062B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008270414A JP5185062B2 (ja) 2008-10-21 2008-10-21 積層型半導体装置及び電子機器
PCT/JP2009/003134 WO2010047014A1 (ja) 2008-10-21 2009-07-06 積層型半導体装置及び電子機器
US13/008,579 US8269335B2 (en) 2008-10-21 2011-01-18 Multilayer semiconductor device and electronic equipment

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JP2008270414A JP5185062B2 (ja) 2008-10-21 2008-10-21 積層型半導体装置及び電子機器

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JP2010103129A JP2010103129A (ja) 2010-05-06
JP2010103129A5 JP2010103129A5 (enExample) 2010-12-24
JP5185062B2 true JP5185062B2 (ja) 2013-04-17

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JP (1) JP5185062B2 (enExample)
WO (1) WO2010047014A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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US20220148950A1 (en) * 2019-07-30 2022-05-12 Huawei Technologies Co., Ltd. Packaging device and manufacturing method therefor, and electronic device

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US8269335B2 (en) 2012-09-18
JP2010103129A (ja) 2010-05-06
WO2010047014A1 (ja) 2010-04-29
US20110115081A1 (en) 2011-05-19

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