JP5178648B2 - パッケージの製造方法、及び半導体装置 - Google Patents

パッケージの製造方法、及び半導体装置 Download PDF

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Publication number
JP5178648B2
JP5178648B2 JP2009156325A JP2009156325A JP5178648B2 JP 5178648 B2 JP5178648 B2 JP 5178648B2 JP 2009156325 A JP2009156325 A JP 2009156325A JP 2009156325 A JP2009156325 A JP 2009156325A JP 5178648 B2 JP5178648 B2 JP 5178648B2
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Japan
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resin
region
lead
lead portions
portions
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Expired - Fee Related
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JP2009156325A
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English (en)
Japanese (ja)
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JP2011014661A5 (https=
JP2011014661A (ja
Inventor
光司 小野
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Canon Inc
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Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2009156325A priority Critical patent/JP5178648B2/ja
Priority to US12/793,751 priority patent/US8450153B2/en
Priority to CN2010102151737A priority patent/CN101937850B/zh
Publication of JP2011014661A publication Critical patent/JP2011014661A/ja
Publication of JP2011014661A5 publication Critical patent/JP2011014661A5/ja
Priority to US13/799,803 priority patent/US8847379B2/en
Application granted granted Critical
Publication of JP5178648B2 publication Critical patent/JP5178648B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2009156325A 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置 Expired - Fee Related JP5178648B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009156325A JP5178648B2 (ja) 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置
US12/793,751 US8450153B2 (en) 2009-06-30 2010-06-04 Package manufacturing method and semiconductor device
CN2010102151737A CN101937850B (zh) 2009-06-30 2010-06-25 封装制造方法和半导体装置
US13/799,803 US8847379B2 (en) 2009-06-30 2013-03-13 Package manufacturing method and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009156325A JP5178648B2 (ja) 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置

Publications (3)

Publication Number Publication Date
JP2011014661A JP2011014661A (ja) 2011-01-20
JP2011014661A5 JP2011014661A5 (https=) 2012-08-09
JP5178648B2 true JP5178648B2 (ja) 2013-04-10

Family

ID=43379782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009156325A Expired - Fee Related JP5178648B2 (ja) 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置

Country Status (3)

Country Link
US (2) US8450153B2 (https=)
JP (1) JP5178648B2 (https=)
CN (1) CN101937850B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106686888A (zh) * 2015-11-11 2017-05-17 旭景科技股份有限公司 形成增强型生物传感模块的印刷电路板元件及其制造方法
US9978675B2 (en) * 2015-11-20 2018-05-22 Canon Kabushiki Kaisha Package, electronic component, and electronic apparatus
CN106024823B (zh) * 2016-07-29 2020-04-21 格科微电子（上海）有限公司 Cmos图像传感器的封装方法
KR102847046B1 (ko) * 2019-05-08 2025-08-18 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3921880B2 (ja) 1999-07-09 2007-05-30 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
US6720207B2 (en) * 2001-02-14 2004-04-13 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
JP3500361B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 リードフレーム及びその製造方法
JP2003234425A (ja) * 2002-02-07 2003-08-22 Mitsui Chemicals Inc 半導体素子装着用中空パッケージ
EP1357605A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package with castellation
JP4779614B2 (ja) * 2005-12-08 2011-09-28 ヤマハ株式会社 半導体装置
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations
JP2008098478A (ja) * 2006-10-13 2008-04-24 Renesas Technology Corp 半導体装置及びその製造方法
WO2008057770A2 (en) * 2006-10-27 2008-05-15 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
KR101187903B1 (ko) * 2007-07-09 2012-10-05 삼성테크윈 주식회사 리드 프레임 및 이를 구비한 반도체 패키지

Also Published As

Publication number Publication date
CN101937850A (zh) 2011-01-05
US8450153B2 (en) 2013-05-28
US20100327428A1 (en) 2010-12-30
CN101937850B (zh) 2012-08-22
US8847379B2 (en) 2014-09-30
US20130200505A1 (en) 2013-08-08
JP2011014661A (ja) 2011-01-20

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