JP5167278B2 - 所定間隔に配列された半田ボールの接合方法及び接合装置 - Google Patents
所定間隔に配列された半田ボールの接合方法及び接合装置 Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims description 173
- 238000000034 method Methods 0.000 title claims description 27
- 239000013307 optical fiber Substances 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 7
- 230000006837 decompression Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/322—Bonding taking account of the properties of the material involved involving coated metal parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1302—Disposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
- H01L2224/16105—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting bonding areas being not aligned with respect to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
すなわち請求項1の特徴は、「複数のコンタクト口金を配列してなるコンタクト口金配列群を用いて、多数の半田ボールが不規則に分散する半田ボール溜めから、前記コンタクト口金配列群によって複数の半田ボールを取り出し(以下取り出された複数の半田ボールを半田ボール配列群という)、前記コンタクト口金による接触保持状態を維持したまま、該コンタクト口金を利用して前記半田ボールの接合部に移載し、該コンタクト口金は、前記半田ボールを接合部に配置した後に、該半田ボールと該接合部で構成される接合部を中心として回転し、次に前記コンタクト口金によって前記半田ボールにレーザーエネルギーを照射して接合点で熱接合させることを特徴とする半田ボール配列群の接合方法」にある。
また、請求項7の特徴は、「複数のコンタクト口金によるコンタクト口金配列群と多数の半田ボールが集積される半田ボール溜めを備えた半田ボール配列群の接合装置において、
前記コンタクト口金配列群は、前記半田ボール溜めから半田ボールを取り出して接合部に半田ボールを移載可能に構成すると共に、該半田ボールにレーザーエネルギーを照射して接合部で熱接合させるレーザー導光路を具え、前記コンタクト口金配列群はさらに、前記半田ボールを接合部に配置した状態で、該半田ボールと該接合部で構成される接合部を中心として回転可能に、前記接合装置に取り付けられていることを特徴とする半田ボール配列群の接合装置。」にある。
Claims (16)
- 複数のコンタクト口金(22)を配列してなるコンタクト口金(22)配列群を用いて、多数の半田ボール(27)が不規則に分散する半田ボール溜め(26)から、前記コンタクト口金配列群によって複数の半田ボール(29)を取り出し(以下取り出された複数の半田ボールを半田ボール配列群という)、前記コンタクト口金による接触保持状態を維持したまま、該コンタクト口金を利用して前記半田ボールの接合部(41)に移載し、
該コンタクト口金(22)は、前記半田ボール(27)を接合部(41)に配置した後に、該半田ボールと該接合部(41)で構成される接合部を中心として回転し、
次に前記コンタクト口金によって前記半田ボールにレーザーエネルギー(40)を照射して接合点で熱接合させることを特徴とする半田ボール配列群(29)の接合方法。 - 前記コンタクト口金(22)は、前記半田ボール溜め(26)から半田ボール(27)を取り出す際に減圧して吸引保持されることを特徴とする請求項1に記載の方法。
- 前記半田ボール溜め(26)は、前記半田ボール(27)を該半田ボール溜めから取り出す時に超音波振動が付与されることを特徴とする請求項1又は2に記載の方法。
- 前記コンタクト口金(22)は、前記半田ボール(27)の接触保持圧を維持しながら前記接合部に対して回転することを特徴とする請求項3に記載の方法。
- 前記半田ボール(27)は、半田ボール溜め(26)から取り出されてから接合部(41)に移載されるまでの移動経路上で流体コーティングが施されることを特徴とする請求項1〜4のいずれか1項に記載の方法。
- 前記流体コーティング(31)は、前記半田ボール(27)の少なくとも1部を液溜め(30)に浸すことによって実施されることを特徴とする請求項5に記載の方法。
- 複数のコンタクト口金(22)によるコンタクト口金配列群と多数の半田ボール(27)が集積される半田ボール溜め(26)を備えた半田ボール配列群(29)の接合装置において、
前記コンタクト口金配列群は、前記半田ボール溜めから半田ボールを取り出して接合部(41)に半田ボールを移載可能に構成すると共に、該半田ボールにレーザーエネルギー(40)を照射して接合部で熱接合させるレーザー導光路を具え、
前記コンタクト口金(22)配列群はさらに、前記半田ボール(27)を接合部(41)に配置した状態で、該半田ボールと該接合部(41)で構成される接合部を中心として回転可能に、前記接合装置(20)に取り付けられていることを特徴とする半田ボール配列群(29)の接合装置。 - 前記半田ボール(27)を減圧下におくために、減圧通路(34)が前記コンタクト口金内に配置されることを特徴とする請求項7に記載の装置。
- 前記半田ボール溜め(26)には、超音波振動を付与する手段が備えられることを特徴とする請求項7又は8に記載の装置。
- 前記コンタクト口金(22)は前記接合装置(20)の搬送体(21)に取り付けられることを特徴とする請求項7〜9のいずれか1項に記載の装置。
- 前記コンタクト口金(22)は前記接合装置(20)に、列状又はマトリクス状に配設されていることを特徴とする請求項7〜10のいずれか1項に記載の装置。
- 前記接合装置(20)におけるコンタクト口金(22)同士の相対位置は可変とすることを特徴とする請求項7〜11のいずれか1項に記載の装置。
- 前記コンタクト口金(22)は、前記減圧通路(34)に光導波体が挿通されており、該光導波体を介して前記半田ボール(27)にレーザーエネルギー(40)を照射することを特徴とする請求項7〜12のいずれか1項に記載の装置。
- 前記光導波体は光ファイバー(35)で構成されることを特徴とする請求項13に記載の装置。
- 複数のコンタクト口金(22)の前記光ファイバー(35)は1つのレーザー光源と連結されていることを特徴とする請求項14に記載の装置。
- 前記複数のコンタクト口金(22)の光ファイバー(35)は複数の異なる光ファイバーグループに分けられ、該複数の光ファイバーグループの少なくとも一部がそれぞれ異なるレーザー光源に連結されることを特徴とする請求項14又は15に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102007004543 | 2007-01-24 | ||
DE102007004543.5 | 2007-01-24 | ||
PCT/DE2008/000128 WO2008089743A1 (de) | 2007-01-24 | 2008-01-24 | Verfahren und vorrichtung zur kontaktierung, platzierung und beaufschlagung mittels laserenergie eines lotkugelverbands |
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JP2010517276A JP2010517276A (ja) | 2010-05-20 |
JP5167278B2 true JP5167278B2 (ja) | 2013-03-21 |
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JP2009546649A Active JP5167278B2 (ja) | 2007-01-24 | 2008-01-24 | 所定間隔に配列された半田ボールの接合方法及び接合装置 |
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US (1) | US9327360B2 (ja) |
EP (1) | EP2114608B1 (ja) |
JP (1) | JP5167278B2 (ja) |
KR (1) | KR101522434B1 (ja) |
DE (1) | DE112008000913A5 (ja) |
WO (1) | WO2008089743A1 (ja) |
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CN101857188B (zh) * | 2010-07-09 | 2012-05-23 | 哈尔滨工业大学 | 面向mems立体封装和组装的锡球凸点键合及质量检测方法 |
EP2710630A4 (en) * | 2011-05-20 | 2014-11-05 | Linde Ag | METHOD AND DEVICE FOR TRANSPORTING LOT BALLS |
CN109551069B (zh) * | 2018-12-26 | 2020-11-10 | 武汉凌云光电科技有限责任公司 | 一种自动化激光多通道锡球焊接装置及焊接方法 |
JP7260401B2 (ja) * | 2019-05-29 | 2023-04-18 | ファナック株式会社 | レーザー光にて半田付けを行う半田付け装置および半田付け装置を備えるロボット装置 |
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- 2008-01-24 JP JP2009546649A patent/JP5167278B2/ja active Active
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KR20090113826A (ko) | 2009-11-02 |
KR101522434B1 (ko) | 2015-05-21 |
JP2010517276A (ja) | 2010-05-20 |
US9327360B2 (en) | 2016-05-03 |
US20100051589A1 (en) | 2010-03-04 |
DE112008000913A5 (de) | 2010-01-07 |
EP2114608B1 (de) | 2013-03-06 |
EP2114608A1 (de) | 2009-11-11 |
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