JP4313814B2 - はんだボール搭載方法及びはんだボール搭載装置 - Google Patents
はんだボール搭載方法及びはんだボール搭載装置 Download PDFInfo
- Publication number
- JP4313814B2 JP4313814B2 JP2006301991A JP2006301991A JP4313814B2 JP 4313814 B2 JP4313814 B2 JP 4313814B2 JP 2006301991 A JP2006301991 A JP 2006301991A JP 2006301991 A JP2006301991 A JP 2006301991A JP 4313814 B2 JP4313814 B2 JP 4313814B2
- Authority
- JP
- Japan
- Prior art keywords
- ball
- solder
- ball mounting
- solder ball
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/0502—Disposition
- H01L2224/05022—Disposition the internal layer being at least partially embedded in the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
前記基板の電極上にフラックスを配設する工程と、
前記電極と対向する位置にボール振込み開口が形成されており、上層となるほど該ボール振込み開口の開口面積が大きくなるよう設定された複数のはんだボール搭載用マスクを前記基板に積層して配設する工程と、
積層された前記複数のはんだボール搭載用マスクの単数又は複数を前記基板の面方向に移動させつつ前記ボール振込み開口に前記はんだボールを振込むことにより、該はんだボールを前記電極に搭載する工程と、
前記はんだボール搭載用マスクを前記基板から取り外す工程と、
前記はんだボールを前記電極に接合する工程とを有することを特徴とするものである。
前記基板上に積層して配設されると共に前記電極と対向する位置にボール振込み開口が形成されており、上層となるほど該ボール振込み開口の開口面積が大きくなるよう設定された複数のはんだボール搭載用マスクと、
前記ボール振込み開口に前記はんだボールを振込む際、積層された前記複数のはんだボール搭載用マスクの単数又は複数を前記基板の面方向に移動させる移動手段とを有することを特徴とするものである。
前記はんだボール搭載用マスクを保持するクランパと、
前記クランパを支持するアームと、
該アームを駆動することにより前記クランパに保持された前記はんだボール搭載用マスクを前記基板の面方向に移動させる駆動装置とを有する構成としてもよい。
この構成とされたボール搭載用マスク110のボール振込み開口112内にはんだボール115が振込まれるためには、はんだボール115の重心(図中、Oで示している)がボール振込み開口112の内側に位置する必要がある。従って、はんだボール115がボール振込み開口112に振込まれる範囲は、はんだボール115の重心Oがボール振込み開口112の内側にある位置、即ち図4(B)に矢印L1で示される直径(これを振込み直径という)を有する面積範囲内となる(尚、L1<DAとなっている)。
2 基板本体
3 電極
4 ソルダーレジスト
6 開口部
8 フラックス用マスク
9 フラックス
10A,10B,10C ボール搭載用マスク
12A,12B,12C ボール振込み開口
15 はんだボール
20 はんだボール搭載装置
30 第1の移動装置
40 第2の移動装置
43 駆動装置
50 ステージ
Claims (4)
- 基板に形成された電極にはんだボールを搭載するはんだボール搭載方法において、
前記基板の電極上にフラックスを配設する工程と、
前記電極と対向する位置に第1のボール振込み開口が形成された第1のはんだボール搭載用マスクを前記基板上に配設する工程と、
前記第1のボール振込み開口の直径よりも大きい直径とされた第2のボール振込み開口が形成された第2のはんだボール搭載用マスクを準備した後、前記第1及び2のボール振込み開口が同心円状に配置されるように、前記第1のはんだボール搭載用マスク上に、第2のはんだボール搭載用マスクを積層する工程と、
前記第2のボール振込み開口が前記第1のボール振込み開口を露出した状態で、前記第2のはんだボール搭載用マスクを円移動、又は楕円移動、或いは直線往復移動させることで、前記第1及び第2のボール振込み開口に前記はんだボールを振込むことにより、該はんだボールを前記電極に搭載する工程と、
前記はんだボールを前記電極に搭載後、前記第1及び第2のはんだボール搭載用マスクを前記基板から取り外す工程と、
前記はんだボールを前記電極に接合する工程と、
を有することを特徴とするはんだボール搭載方法。 - 前記フラックスを配設する工程の前に、前記基板に、前記電極を露出する開口部を有したソルダーレジストを形成する工程を設けたことを特徴とする請求項1記載のはんだボール搭載方法。
- 基板に形成された電極にはんだボールを搭載するはんだボール搭載装置において、
前記基板上に配設され、前記電極と対向する位置に第1のボール振込み開口が形成された第1のはんだボール搭載用マスクと、
前記第1のはんだボール搭載用マスク上に積層され、前記第1のボール振込み開口の直径よりも大きい直径とされた第2のボール振込み開口が形成された第2のはんだボール搭載用マスクと、
前記第1及び第2のボール振込み開口にはんだボールを振込む際、前記第2のボール振込み開口が前記第1のボール振込み開口を露出した状態で、前記第2のはんだボール搭載用マスクを円移動、又は楕円移動、或いは直線往復移動させる移動手段と、を有し、
前記移動手段により前記第2のはんだボール搭載用マスクが移動させられた際、前記第1のはんだボール搭載用マスクは、前記基板上で静止した状態を維持することを特徴とするはんだボール搭載装置。 - 前記移動手段は、
前記はんだボール搭載用マスクを保持するクランパと、
前記クランパを支持するアームと、
該アームを駆動することにより前記クランパに保持された前記はんだボール搭載用マスクを前記基板の面方向に移動させる駆動装置と、を有することを特徴とする請求項3記載のはんだボール搭載装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006301991A JP4313814B2 (ja) | 2006-11-07 | 2006-11-07 | はんだボール搭載方法及びはんだボール搭載装置 |
US11/926,742 US7644856B2 (en) | 2006-11-07 | 2007-10-29 | Solder ball mounting method and solder ball mounting apparatus |
KR1020070112464A KR20080041579A (ko) | 2006-11-07 | 2007-11-06 | 솔더 볼 탑재 방법 및 솔더 볼 탑재 장치 |
TW096141787A TW200822256A (en) | 2006-11-07 | 2007-11-06 | Solder ball mounting method and solder ball mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006301991A JP4313814B2 (ja) | 2006-11-07 | 2006-11-07 | はんだボール搭載方法及びはんだボール搭載装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008118051A JP2008118051A (ja) | 2008-05-22 |
JP4313814B2 true JP4313814B2 (ja) | 2009-08-12 |
Family
ID=39358910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006301991A Expired - Fee Related JP4313814B2 (ja) | 2006-11-07 | 2006-11-07 | はんだボール搭載方法及びはんだボール搭載装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7644856B2 (ja) |
JP (1) | JP4313814B2 (ja) |
KR (1) | KR20080041579A (ja) |
TW (1) | TW200822256A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5279529B2 (ja) * | 2009-01-28 | 2013-09-04 | 株式会社ボンマーク | ボール搭載マスク及びその製造方法 |
KR101044135B1 (ko) * | 2009-11-30 | 2011-06-28 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
US9950393B2 (en) * | 2011-12-23 | 2018-04-24 | Intel Corporation | Hybrid low metal loading flux |
KR101414483B1 (ko) * | 2012-01-13 | 2014-08-06 | 주식회사 고려반도체시스템 | 솔더볼 어태치 방법 및 그 장치 |
KR20140026127A (ko) * | 2012-08-24 | 2014-03-05 | 삼성전기주식회사 | 인쇄회로기판 제조 방법 |
US9905525B1 (en) * | 2016-08-18 | 2018-02-27 | Semiconductor Components Industries, Llc | Semiconductor wafer and method of ball drop on thin wafer with edge support ring |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08236916A (ja) | 1995-03-01 | 1996-09-13 | Fujitsu Ltd | 半田ボール搭載方法及び装置 |
JPH10308412A (ja) * | 1997-05-02 | 1998-11-17 | Ricoh Co Ltd | 粒子配列装置およびこれを用いた粒子配列方法 |
US6253992B1 (en) * | 1998-03-18 | 2001-07-03 | Tessera, Inc. | Solder ball placement fixtures and methods |
US6268275B1 (en) * | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
JP2002141366A (ja) | 2000-11-02 | 2002-05-17 | Toshiba Corp | 導電性ボールの搭載方法 |
JP2003347343A (ja) | 2002-05-30 | 2003-12-05 | Tamura Seisakusho Co Ltd | 積層マスク及びその製造方法 |
JP4348696B2 (ja) | 2004-06-21 | 2009-10-21 | 日立金属株式会社 | 導電性ボールの配列用マスクおよびそれを用いた配列装置 |
JP4118286B2 (ja) | 2004-08-04 | 2008-07-16 | イビデン株式会社 | 半田ボール搭載方法 |
-
2006
- 2006-11-07 JP JP2006301991A patent/JP4313814B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-29 US US11/926,742 patent/US7644856B2/en not_active Expired - Fee Related
- 2007-11-06 TW TW096141787A patent/TW200822256A/zh unknown
- 2007-11-06 KR KR1020070112464A patent/KR20080041579A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2008118051A (ja) | 2008-05-22 |
US20080105734A1 (en) | 2008-05-08 |
US7644856B2 (en) | 2010-01-12 |
TW200822256A (en) | 2008-05-16 |
KR20080041579A (ko) | 2008-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1281107C (zh) | 柔性印刷电路板的转移载体及向该板安装电子元件的方法 | |
JP4219951B2 (ja) | はんだボール搭載方法及びはんだボール搭載基板の製造方法 | |
JP4393538B2 (ja) | 磁性はんだボールの配列装置および配列方法 | |
JP4647007B2 (ja) | 半田ボール搭載装置 | |
JP4313814B2 (ja) | はんだボール搭載方法及びはんだボール搭載装置 | |
WO2009144846A1 (ja) | 半田ボール搭載方法 | |
JP2009032719A (ja) | 導電性ボールの搭載装置および搭載方法 | |
JP2005026648A (ja) | 実装基板の製造方法 | |
TWI247365B (en) | Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method | |
JP2008192818A (ja) | マイクロボール搭載装置およびその搭載方法 | |
JP2010177253A (ja) | はんだボール搭載方法 | |
JP2005251978A (ja) | 電子部品装着装置および電子部品の装着方法 | |
JP2010205957A (ja) | ハンダ除去装置及びハンダ除去方法 | |
JP2004327944A (ja) | 配線基板の実装方法 | |
JP2008124076A (ja) | はんだボール搭載方法及びはんだボール搭載装置 | |
KR102150528B1 (ko) | 주상 부재 탑재 장치 및 주상 부재 탑재 방법 | |
JP5121621B2 (ja) | 基板の製造方法 | |
TWI661523B (zh) | 柱狀構件搭載裝置以及柱狀構件搭載方法 | |
JP4013860B2 (ja) | スクリーン印刷装置およびスクリーン印刷方法 | |
JP4505783B2 (ja) | 半田バンプの製造方法及び製造装置 | |
JP2006043882A (ja) | マウントヘッド | |
JP2009004724A (ja) | 基板の製造方法及び基板の製造装置 | |
JP2009111263A (ja) | 電子部品のリワーク方法 | |
JP2015012056A (ja) | 半田ボール搭載方法 | |
JP2006302973A (ja) | ボール搭載装置のボール配列ヘッド |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080711 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081202 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090122 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090512 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090515 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120522 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4313814 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120522 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130522 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130522 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140522 Year of fee payment: 5 |
|
LAPS | Cancellation because of no payment of annual fees |