JP5852770B2 - 電子部品を取り付ける方法及び装置 - Google Patents
電子部品を取り付ける方法及び装置 Download PDFInfo
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- JP5852770B2 JP5852770B2 JP2009089327A JP2009089327A JP5852770B2 JP 5852770 B2 JP5852770 B2 JP 5852770B2 JP 2009089327 A JP2009089327 A JP 2009089327A JP 2009089327 A JP2009089327 A JP 2009089327A JP 5852770 B2 JP5852770 B2 JP 5852770B2
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- 238000000034 method Methods 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 30
- 230000005855 radiation Effects 0.000 description 8
- 230000004308 accommodation Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49822—Disassembling by applying force
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53274—Means to disassemble electrical device
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
Description
Claims (14)
- 端子面(34、35)を備える電子部品(24)を、端子面(31、32)を備える基板(33)に取り付ける方法であって、
取付け装置(27、48、66、76)の接触ノズル(28、47、65、79)の部品収容区域(29、49)内に前記部品を収容し、前記部品を吸引した状態で供給装置(20)から移動し、次いで、
前記部品の接点側(37)から部品裏側(38)まで延びる部品端子面と基板端子面とが重なり合う位置になるように、前記取付け装置により前記部品を前記基板上に位置決めし、次いで、
前記装置の接触ノズル内で、前記接触ノズルに設けられた2つの放出ウィンドウ(59、60、68、69)を通して、前記電子部品(24)の前記部品裏側(38)の前記部品端子面のみにレーザーエネルギーを直接的に与えて、前記部品端子面に熱を発生させ;
前記部品端子面にはんだ材料を供給して、前記はんだ材料を前記熱によって溶融させ、前記部品端子面と前記基板端子面との間に電気的な接合を確立する
ことを含む方法。 - 前記部品(24)の移動及び位置決め中に、前記部品を吸引することを特徴とする、請求項1に記載の方法。
- 少なくともある段階において、前記部品端子面(34、35)へのレーザーエネルギーの付与は、前記部品の吸引と同時に行われることを特徴とする、請求項1又は2に記載の方法。
- 前記部品の前記移動及び/又は前記位置決め中に、前記部品(24)にレーザーエネルギーを与えることを特徴とする、請求項1から3の何れか1つに記載の方法。
- 前記基板(33)からの前記部品の移動を、前記部品(24)を吸引し、そして、同時にレーザーエネルギーを前記部品端子面(34、35)に与えることによって行うことを特徴とする、請求項3に記載の方法。
- 前記レーザーの付与中に、前記取付け装置(27、48、66、76)にトルクを与えることを特徴とする、請求項5に記載の方法。
- 前記部品(24)を前記基板(33)上に位置決めするに先立って、はんだ装置(41)によって、前記基板の前記端子面(31、32)にはんだ材料(42)を付着させ、そして、前記端子面で溶融することを特徴とする、請求項の1から6の何れか1つに記載の方法。
- 前記はんだ物(42)を、前記はんだ装置(41)により、先ず、前記はんだ装置内で少なくとも部分的に液状にし、次いで、加圧によって前記基板(33)の前記端子面(31、32)に対して付着させることを特徴とする、請求項7に記載の方法。
- 端子面(34、35)を備える電子部品(24)を、端子面(31、32)を備える基板(33)に取り付ける装置(27、48、66、76)であって、
前記装置(27、48、66、76)は、接触ノズル(28、47、65、79)を備えており、
前記接触ノズルは、位置を固定するために前記部品を収容する部品収容区域(29、49)内に、前記部品を吸引する吸引ダクト(53)に接続された吸引開口部と、レーザー放射線を前記部品に与える放出開口部とを有しており、
前記放出開口部は、2つの放出ウィンドウ(59、60、68、69)を有しており、前記2つの放出ウィンドウは、前記部品を支持する部品接触面(50、67)によって相互に隔てて配置され、その各々が、前記部品収容区域(29、49)内に収容された前記電子部品(24)の部品裏側(38)の部品端子面(34、35)のみに前記接触ノズル内でレーザーエネルギーを直接的に与えて、前記部品端子面に熱を発生させることを可能にすることを特徴とする取付け装置。 - 前記放出ウィンドウ(59、60、68、69)は、前記吸引開口部の部分的な区域によって形成されていることを特徴とする、請求項9に記載の取付け装置。
- 前記部品接触面(67)は、中央支持ダクト(71)の前面(70)によって形成されていることを特徴とする、請求項9又は10に記載の取付け装置。
- 前記部品接触面(50)は、前記吸引ダクト(53)内に設けられ、互いに対して反対側に位置するように配置される2つの支持棒(54、55)の2つの前面(51、52)によって形成されることを特徴とする、請求項9又は10による取付け装置。
- 前記放出ウィンドウ(59、60、68、69)は、前記収容区域(29、49)内に収容された部品(24)内の前記部品端子面の側に放出間隙(63、64、74、75)が形成されるように、前記部品端子面(34、35)より大きく設けられていることを特徴とする、請求項9から12の何れか1つに記載の取付け装置。
- 前記接触ノズル(79)は取付け器本体(78)に設けられ、前記取付け器本体(78)は、レンズ装置(81)の下方の吸引室(85)を区切る壁内に、前記取付け器本体の長手方向の軸線に対して直角に延びる加圧空気供給装置(82)と、前記加圧空気供給装置の反対側に位置する加圧空気消散装置(83)とを備えることを特徴とする、請求項9から13の何れか1つに記載の取付け装置。
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DE102008017180.8A DE102008017180B4 (de) | 2008-04-02 | 2008-04-02 | Vorrichtung zur Applikation eines elektronischen Bauelements |
DE102008017180.8 | 2008-04-02 |
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JP2010004017A JP2010004017A (ja) | 2010-01-07 |
JP5852770B2 true JP5852770B2 (ja) | 2016-02-03 |
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US (1) | US8205325B2 (ja) |
JP (1) | JP5852770B2 (ja) |
KR (2) | KR101594178B1 (ja) |
DE (1) | DE102008017180B4 (ja) |
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DE102008017180B4 (de) * | 2008-04-02 | 2020-07-02 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung zur Applikation eines elektronischen Bauelements |
DE102015114129A1 (de) * | 2015-08-26 | 2017-03-02 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung zur Entfernung eines Prüfkontakts einer Prüfkontaktanordnung |
DE102017114771B4 (de) * | 2017-06-29 | 2022-01-27 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zur Herstellung einer Drahtverbindung sowie Bauelementanordnung mit Drahtverbindung |
KR102167268B1 (ko) * | 2019-02-11 | 2020-10-19 | (주)에스티아이 | 불량 led 제거 장치 |
CN113000974A (zh) * | 2021-03-09 | 2021-06-22 | 沈倩友 | 一种激光锡球焊机喷嘴 |
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KR20090105863A (ko) | 2009-10-07 |
US8205325B2 (en) | 2012-06-26 |
KR101594178B1 (ko) | 2016-02-15 |
JP2010004017A (ja) | 2010-01-07 |
DE102008017180A1 (de) | 2009-10-08 |
KR101650669B1 (ko) | 2016-08-23 |
DE102008017180B4 (de) | 2020-07-02 |
KR20150140605A (ko) | 2015-12-16 |
US20090249620A1 (en) | 2009-10-08 |
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