JP2006100454A - 半田を用いた接合装置 - Google Patents
半田を用いた接合装置 Download PDFInfo
- Publication number
- JP2006100454A JP2006100454A JP2004282924A JP2004282924A JP2006100454A JP 2006100454 A JP2006100454 A JP 2006100454A JP 2004282924 A JP2004282924 A JP 2004282924A JP 2004282924 A JP2004282924 A JP 2004282924A JP 2006100454 A JP2006100454 A JP 2006100454A
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- JP
- Japan
- Prior art keywords
- solder
- nozzle
- joining
- electrode
- solder ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
【解決手段】 半田を保持し且つ搬送する部材に対し、当該部材における半田と接触する領域及びその近傍に対して、半田との濡れ性が低い、例えばDLC膜を所定厚さコーティングすることとする。
【選択図】 図1
Description
Claims (5)
- 電極に対して半田を供給し、前記半田に対してレーザ光を照射して前記半田を溶融し、前記電極に対して前記半田を接合する接合装置であって、
前記半田を保持し、前記電極上における前記半田の接合位置に前記半田を載置可能なノズルと、
前記接合位置に配置された前記半田に対して前記レーザ光を照射するレーザ照射装置とを有し、
前記ノズルにおいて前記半田と接触する領域には絶縁性を有し且つ前記半田との濡れ性が低く溶融半田が付着困難な膜がコーティングされていることを特徴とする半田を用いた接合装置。 - 前記膜がダイヤモンド状炭素膜(DLC膜)からなることを特徴とする請求項1記載の半田を用いた接合装置。
- 前記ノズルは、通気可能であって前記ノズルに設けられた開口部に連通する内部空間を有し、前記半田は前記開口部を介して保持されることを特徴とする請求項1記載の半田を用いた接合装置。
- 前記レーザ照射装置は前記ノズルと所定の位置関係を有して配置可能であり、前記レーザ光は前記ノズルが有する前記内部空間及び前記開口部の少なくとも何れかを介して前記半田に対して照射されることを特徴とする請求項3記載の半田を用いた接合装置。
- 前記半田は、前記ノズルにおける前記開口部を介して、吸着保持されることを特徴とする請求項4記載の接合装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004282924A JP2006100454A (ja) | 2004-09-29 | 2004-09-29 | 半田を用いた接合装置 |
US11/234,191 US20060065642A1 (en) | 2004-09-29 | 2005-09-26 | Bonding apparatus using conductive material |
CN2005101051410A CN1780533B (zh) | 2004-09-29 | 2005-09-28 | 利用导电材料的接合装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004282924A JP2006100454A (ja) | 2004-09-29 | 2004-09-29 | 半田を用いた接合装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006100454A true JP2006100454A (ja) | 2006-04-13 |
Family
ID=36097846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004282924A Pending JP2006100454A (ja) | 2004-09-29 | 2004-09-29 | 半田を用いた接合装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060065642A1 (ja) |
JP (1) | JP2006100454A (ja) |
CN (1) | CN1780533B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235471A (ja) * | 2007-03-19 | 2008-10-02 | Nippon Steel Materials Co Ltd | 搭載不良半田ボールの修復方法、バンプ形成方法及び搭載不良半田ボールの修復装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008089743A1 (de) * | 2007-01-24 | 2008-07-31 | Pac Tech - Packaging Technologies Gmbh | Verfahren und vorrichtung zur kontaktierung, platzierung und beaufschlagung mittels laserenergie eines lotkugelverbands |
JP2009028781A (ja) * | 2007-06-26 | 2009-02-12 | Tdk Corp | 接合方法及び接合装置 |
CN100522443C (zh) * | 2007-09-18 | 2009-08-05 | 南京航空航天大学 | 镍基钎料激光钎焊金刚石磨粒的制造方法 |
DE102008051853B4 (de) * | 2008-10-17 | 2010-07-15 | Pac Tech-Packaging Technologies Gmbh | Vorrichtung zur Platzierung und Kontaktierung von Prüfkontakten |
US20130256281A1 (en) * | 2012-03-30 | 2013-10-03 | Tatsumi Tsuchiya | Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive |
DE102014218968B4 (de) * | 2014-09-22 | 2016-12-15 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zum Aufschweißen einer Kugel auf ein erstes Bauteil, Verfahren zum Verbinden zweier Bauteile, entsprechend hergestelltes Bauteil und Bauteilverbindung |
DE102017104097A1 (de) * | 2017-02-28 | 2018-08-30 | Pac Tech-Packaging Technologies Gmbh | Verfahren und Laseranordnung zum Aufschmelzen eines Lotmaterialdepots mittels Laserenergie |
JP7260401B2 (ja) * | 2019-05-29 | 2023-04-18 | ファナック株式会社 | レーザー光にて半田付けを行う半田付け装置および半田付け装置を備えるロボット装置 |
CN110137091B (zh) * | 2019-05-31 | 2021-02-26 | 河南机电职业学院 | 一种锡球喷嘴及其制备方法 |
US11626133B1 (en) * | 2022-03-30 | 2023-04-11 | Sae Magnetics (H.K.) Ltd. | Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive |
CN114918505B (zh) * | 2022-04-29 | 2023-07-04 | 中国电子科技集团公司第三十八研究所 | 一种电连接器的焊膏点涂方法 |
CN116553475B (zh) * | 2023-03-23 | 2024-01-30 | 清华大学 | 基于激光的单颗粒微电极制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0276928B1 (en) * | 1987-01-26 | 1994-10-26 | Hitachi, Ltd. | Wire Bonding |
US5477026A (en) * | 1994-01-27 | 1995-12-19 | Chromalloy Gas Turbine Corporation | Laser/powdered metal cladding nozzle |
US6270898B1 (en) * | 1996-05-27 | 2001-08-07 | Sumitomo Electric Industries, Ltd. | Tool tip and bonding tool comprising the tool tip and control method for the bonding tool |
US6336581B1 (en) * | 2000-06-19 | 2002-01-08 | International Business Machines Corporation | Solder ball connection device and capillary tube thereof |
JP2002025025A (ja) * | 2000-06-23 | 2002-01-25 | Internatl Business Mach Corp <Ibm> | はんだボール接合装置及びはんだボール接合方法 |
US6742594B2 (en) * | 2002-02-06 | 2004-06-01 | Abb Vetco Gray Inc. | Flowline jumper for subsea well |
-
2004
- 2004-09-29 JP JP2004282924A patent/JP2006100454A/ja active Pending
-
2005
- 2005-09-26 US US11/234,191 patent/US20060065642A1/en not_active Abandoned
- 2005-09-28 CN CN2005101051410A patent/CN1780533B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235471A (ja) * | 2007-03-19 | 2008-10-02 | Nippon Steel Materials Co Ltd | 搭載不良半田ボールの修復方法、バンプ形成方法及び搭載不良半田ボールの修復装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1780533B (zh) | 2010-05-12 |
CN1780533A (zh) | 2006-05-31 |
US20060065642A1 (en) | 2006-03-30 |
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