JP5158088B2 - エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 - Google Patents
エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 Download PDFInfo
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- JP5158088B2 JP5158088B2 JP2009533162A JP2009533162A JP5158088B2 JP 5158088 B2 JP5158088 B2 JP 5158088B2 JP 2009533162 A JP2009533162 A JP 2009533162A JP 2009533162 A JP2009533162 A JP 2009533162A JP 5158088 B2 JP5158088 B2 JP 5158088B2
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- Prior art keywords
- epoxy resin
- curing agent
- microcapsule
- latent curing
- type latent
- Prior art date
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- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- KYCGURZGBKFEQB-UHFFFAOYSA-N n',n'-dibutylpropane-1,3-diamine Chemical compound CCCCN(CCCC)CCCN KYCGURZGBKFEQB-UHFFFAOYSA-N 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- GZUCMODGDIGMBI-UHFFFAOYSA-N n',n'-dipropylpropane-1,3-diamine Chemical compound CCCN(CCC)CCCN GZUCMODGDIGMBI-UHFFFAOYSA-N 0.000 description 1
- PVYBFVZRZWESQN-UHFFFAOYSA-N n,n-diethyl-2-piperazin-1-ylethanamine Chemical compound CCN(CC)CCN1CCNCC1 PVYBFVZRZWESQN-UHFFFAOYSA-N 0.000 description 1
- 229940078490 n,n-dimethylglycine Drugs 0.000 description 1
- PXSXRABJBXYMFT-UHFFFAOYSA-N n-hexylhexan-1-amine Chemical compound CCCCCCNCCCCCC PXSXRABJBXYMFT-UHFFFAOYSA-N 0.000 description 1
- JACMPVXHEARCBO-UHFFFAOYSA-N n-pentylpentan-1-amine Chemical compound CCCCCNCCCCC JACMPVXHEARCBO-UHFFFAOYSA-N 0.000 description 1
- 229960003512 nicotinic acid Drugs 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- JKXONPYJVWEAEL-UHFFFAOYSA-N oxiran-2-ylmethyl acetate Chemical compound CC(=O)OCC1CO1 JKXONPYJVWEAEL-UHFFFAOYSA-N 0.000 description 1
- XRQKARZTFMEBBY-UHFFFAOYSA-N oxiran-2-ylmethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1CO1 XRQKARZTFMEBBY-UHFFFAOYSA-N 0.000 description 1
- YLNSNVGRSIOCEU-UHFFFAOYSA-N oxiran-2-ylmethyl butanoate Chemical compound CCCC(=O)OCC1CO1 YLNSNVGRSIOCEU-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229940081066 picolinic acid Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 description 1
- KFUSANSHCADHNJ-UHFFFAOYSA-N pyridine-3-carbohydrazide Chemical compound NNC(=O)C1=CC=CN=C1 KFUSANSHCADHNJ-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 210000003660 reticulum Anatomy 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RYYWUUFWQRZTIU-UHFFFAOYSA-K thiophosphate Chemical compound [O-]P([O-])([O-])=S RYYWUUFWQRZTIU-UHFFFAOYSA-K 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- JIVZKJJQOZQXQB-UHFFFAOYSA-N tolazoline Chemical compound C=1C=CC=CC=1CC1=NCCN1 JIVZKJJQOZQXQB-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- DIHAURBCYGTGCV-UHFFFAOYSA-N xi-4,5-Dihydro-2,4(5)-dimethyl-1H-imidazole Chemical compound CC1CN=C(C)N1 DIHAURBCYGTGCV-UHFFFAOYSA-N 0.000 description 1
- JLYXXMFPNIAWKQ-UHFFFAOYSA-N γ Benzene hexachloride Chemical compound ClC1C(Cl)C(Cl)C(Cl)C(Cl)C1Cl JLYXXMFPNIAWKQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Epoxy Resins (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009533162A JP5158088B2 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007243851 | 2007-09-20 | ||
| JP2007243852 | 2007-09-20 | ||
| JP2007243851 | 2007-09-20 | ||
| JP2007243852 | 2007-09-20 | ||
| JP2008043346 | 2008-02-25 | ||
| JP2008043346 | 2008-02-25 | ||
| JP2008166246 | 2008-06-25 | ||
| JP2008166246 | 2008-06-25 | ||
| JP2009533162A JP5158088B2 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
| PCT/JP2008/066774 WO2009038097A1 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2009038097A1 JPWO2009038097A1 (ja) | 2011-01-06 |
| JP5158088B2 true JP5158088B2 (ja) | 2013-03-06 |
Family
ID=40467907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009533162A Expired - Fee Related JP5158088B2 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5158088B2 (zh) |
| KR (2) | KR20100072030A (zh) |
| CN (2) | CN102936331A (zh) |
| TW (2) | TW201244814A (zh) |
| WO (1) | WO2009038097A1 (zh) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101086701B1 (ko) * | 2009-06-10 | 2011-11-25 | 한국과학기술연구원 | 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법 |
| KR102270461B1 (ko) * | 2016-03-10 | 2021-06-29 | 한국전자기술연구원 | 점접착제 조성물 및 그의 제조방법 |
| KR101870777B1 (ko) * | 2017-03-28 | 2018-06-26 | 한국신발피혁연구원 | 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제 |
| KR102095115B1 (ko) * | 2018-07-27 | 2020-03-30 | 한국전력공사 | 자가치유 실리콘 절연체 및 그 제조방법 |
| CN111087576A (zh) * | 2019-12-31 | 2020-05-01 | 芜湖天道绿色新材料有限公司 | 一种可降解微胶囊固化剂的制备及应用 |
| CN111171285B (zh) * | 2020-02-15 | 2022-04-26 | 常州大学 | 一种以聚氨酯为壳材的环氧树脂固化剂微胶囊及其制备方法 |
| CN111518500B (zh) * | 2020-04-22 | 2023-04-11 | 湖北回天新材料股份有限公司 | 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法 |
| CN111389317B (zh) * | 2020-04-28 | 2022-04-12 | 西北工业大学 | 基于巯基-异氰酸酯点击反应和油包油界面聚合的咪唑微胶囊的制备方法 |
| WO2023286499A1 (ja) * | 2021-07-12 | 2023-01-19 | 旭化成株式会社 | エポキシ樹脂組成物、フィルム、フィルムの製造方法、及び硬化物 |
| CN114230767B (zh) * | 2021-12-13 | 2024-03-19 | 江苏钛得新材料技术有限公司 | 胶粘剂用咪唑类衍生物微胶囊型潜伏固化剂及其制备方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11199655A (ja) * | 1998-01-12 | 1999-07-27 | Hitachi Ltd | マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物 |
| JP2005344046A (ja) * | 2004-06-04 | 2005-12-15 | Asahi Kasei Chemicals Corp | 潜在性硬化剤および組成物 |
| WO2007037378A1 (ja) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物 |
| JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| JP2007091900A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| JP2007091901A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| WO2007088889A1 (ja) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品 |
| JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| JP2007204670A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
-
2008
- 2008-09-17 CN CN2012104288004A patent/CN102936331A/zh active Pending
- 2008-09-17 CN CN200880107917A patent/CN101802050A/zh active Pending
- 2008-09-17 WO PCT/JP2008/066774 patent/WO2009038097A1/ja active Application Filing
- 2008-09-17 JP JP2009533162A patent/JP5158088B2/ja not_active Expired - Fee Related
- 2008-09-17 KR KR1020107008435A patent/KR20100072030A/ko not_active Application Discontinuation
- 2008-09-17 KR KR1020127000991A patent/KR101243511B1/ko not_active IP Right Cessation
- 2008-09-19 TW TW101126619A patent/TW201244814A/zh unknown
- 2008-09-19 TW TW097136142A patent/TW201008971A/zh unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11199655A (ja) * | 1998-01-12 | 1999-07-27 | Hitachi Ltd | マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物 |
| JP2005344046A (ja) * | 2004-06-04 | 2005-12-15 | Asahi Kasei Chemicals Corp | 潜在性硬化剤および組成物 |
| WO2007037378A1 (ja) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物 |
| JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| JP2007091900A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| JP2007091901A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| WO2007088889A1 (ja) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品 |
| JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
| JP2007204670A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009038097A1 (ja) | 2009-03-26 |
| CN102936331A (zh) | 2013-02-20 |
| KR101243511B1 (ko) | 2013-03-20 |
| CN101802050A (zh) | 2010-08-11 |
| JPWO2009038097A1 (ja) | 2011-01-06 |
| KR20120024963A (ko) | 2012-03-14 |
| TW201008971A (en) | 2010-03-01 |
| KR20100072030A (ko) | 2010-06-29 |
| TW201244814A (en) | 2012-11-16 |
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