JP5158088B2 - エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 - Google Patents

エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 Download PDF

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Publication number
JP5158088B2
JP5158088B2 JP2009533162A JP2009533162A JP5158088B2 JP 5158088 B2 JP5158088 B2 JP 5158088B2 JP 2009533162 A JP2009533162 A JP 2009533162A JP 2009533162 A JP2009533162 A JP 2009533162A JP 5158088 B2 JP5158088 B2 JP 5158088B2
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Japan
Prior art keywords
epoxy resin
curing agent
microcapsule
latent curing
type latent
Prior art date
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JP2009533162A
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English (en)
Japanese (ja)
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JPWO2009038097A1 (ja
Inventor
重昭 舟生
穣 岡田
芳伊 森下
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2009533162A 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 Expired - Fee Related JP5158088B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009533162A JP5158088B2 (ja) 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2007243852 2007-09-20
JP2007243852 2007-09-20
JP2007243851 2007-09-20
JP2007243851 2007-09-20
JP2008043346 2008-02-25
JP2008043346 2008-02-25
JP2008166246 2008-06-25
JP2008166246 2008-06-25
PCT/JP2008/066774 WO2009038097A1 (ja) 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物
JP2009533162A JP5158088B2 (ja) 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物

Publications (2)

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JPWO2009038097A1 JPWO2009038097A1 (ja) 2011-01-06
JP5158088B2 true JP5158088B2 (ja) 2013-03-06

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JP2009533162A Expired - Fee Related JP5158088B2 (ja) 2007-09-20 2008-09-17 エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物

Country Status (5)

Country Link
JP (1) JP5158088B2 (ko)
KR (2) KR101243511B1 (ko)
CN (2) CN101802050A (ko)
TW (2) TW201008971A (ko)
WO (1) WO2009038097A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086701B1 (ko) * 2009-06-10 2011-11-25 한국과학기술연구원 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법
KR102270461B1 (ko) * 2016-03-10 2021-06-29 한국전자기술연구원 점접착제 조성물 및 그의 제조방법
KR101870777B1 (ko) * 2017-03-28 2018-06-26 한국신발피혁연구원 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제
KR102095115B1 (ko) * 2018-07-27 2020-03-30 한국전력공사 자가치유 실리콘 절연체 및 그 제조방법
CN111087576A (zh) * 2019-12-31 2020-05-01 芜湖天道绿色新材料有限公司 一种可降解微胶囊固化剂的制备及应用
CN111171285B (zh) * 2020-02-15 2022-04-26 常州大学 一种以聚氨酯为壳材的环氧树脂固化剂微胶囊及其制备方法
CN111518500B (zh) * 2020-04-22 2023-04-11 湖北回天新材料股份有限公司 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法
CN111389317B (zh) * 2020-04-28 2022-04-12 西北工业大学 基于巯基-异氰酸酯点击反应和油包油界面聚合的咪唑微胶囊的制备方法
CN116323837A (zh) * 2020-09-30 2023-06-23 旭化成株式会社 聚氨酯系固化剂及其应用
JPWO2023286499A1 (ko) * 2021-07-12 2023-01-19
CN114230767B (zh) * 2021-12-13 2024-03-19 江苏钛得新材料技术有限公司 胶粘剂用咪唑类衍生物微胶囊型潜伏固化剂及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199655A (ja) * 1998-01-12 1999-07-27 Hitachi Ltd マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物
JP2005344046A (ja) * 2004-06-04 2005-12-15 Asahi Kasei Chemicals Corp 潜在性硬化剤および組成物
WO2007037378A1 (ja) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2007091900A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091901A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
JP2007204670A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007204669A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199655A (ja) * 1998-01-12 1999-07-27 Hitachi Ltd マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物
JP2005344046A (ja) * 2004-06-04 2005-12-15 Asahi Kasei Chemicals Corp 潜在性硬化剤および組成物
WO2007037378A1 (ja) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2007091900A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091901A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
JP2007204670A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007204669A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物

Also Published As

Publication number Publication date
TW201008971A (en) 2010-03-01
KR20120024963A (ko) 2012-03-14
WO2009038097A1 (ja) 2009-03-26
JPWO2009038097A1 (ja) 2011-01-06
KR20100072030A (ko) 2010-06-29
KR101243511B1 (ko) 2013-03-20
CN101802050A (zh) 2010-08-11
TW201244814A (en) 2012-11-16
CN102936331A (zh) 2013-02-20

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