JP5157444B2 - 硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置 - Google Patents

硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置 Download PDF

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JP5157444B2
JP5157444B2 JP2007526859A JP2007526859A JP5157444B2 JP 5157444 B2 JP5157444 B2 JP 5157444B2 JP 2007526859 A JP2007526859 A JP 2007526859A JP 2007526859 A JP2007526859 A JP 2007526859A JP 5157444 B2 JP5157444 B2 JP 5157444B2
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compound
substituted
curing
carbon atoms
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JPWO2006112396A1 (ja
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真也 中村
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/395—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
JP2007526859A 2005-04-15 2006-04-14 硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置 Active JP5157444B2 (ja)

Priority Applications (1)

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JP2007526859A JP5157444B2 (ja) 2005-04-15 2006-04-14 硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置

Applications Claiming Priority (4)

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JP2005118190 2005-04-15
JP2005118190 2005-04-15
PCT/JP2006/307943 WO2006112396A1 (ja) 2005-04-15 2006-04-14 硬化促進性化合物－シリカ複合体、硬化促進性化合物－シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
JP2007526859A JP5157444B2 (ja) 2005-04-15 2006-04-14 硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置

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JPWO2006112396A1 JPWO2006112396A1 (ja) 2008-12-11
JP5157444B2 true JP5157444B2 (ja) 2013-03-06

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US (1) US8129467B2 (enExample)
JP (1) JP5157444B2 (enExample)
KR (1) KR101005994B1 (enExample)
CN (1) CN101155854B (enExample)
TW (1) TW200643100A (enExample)
WO (1) WO2006112396A1 (enExample)

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JP2010138372A (ja) * 2008-11-13 2010-06-24 Seiko Epson Corp 樹脂組成物
KR101095136B1 (ko) * 2009-04-23 2011-12-16 삼성전기주식회사 인쇄회로기판용 수지 조성물 및 이를 이용한 인쇄회로기판
EP2484715A4 (en) * 2009-09-28 2017-04-12 Mitsubishi Rayon Co., Ltd. Fiber-reinforced composite material
US9176259B2 (en) 2011-03-04 2015-11-03 Intermolecular, Inc. Sol-gel based antireflective (AR) coatings with controllable pore size using organic nanocrystals and dendrimers
US9441119B2 (en) * 2011-03-28 2016-09-13 Intermolecular, Inc. Sol-gel transition control of coatings by addition of solidifiers for conformal coatings on textured glass
EP2762511B1 (en) 2011-09-29 2016-11-16 Hitachi Chemical Co., Ltd. Epoxy resin composition and electronic component device
CN103865379A (zh) * 2012-12-11 2014-06-18 深圳富泰宏精密工业有限公司 聚二甲基硅氧烷溶胶，应用该聚二甲基硅氧烷溶胶对金属基体进行表面处理的方法及制品
US8753021B1 (en) * 2013-02-12 2014-06-17 Corning Cable Systems Llc Adhesives for securing optical fibers to ferrules of optical connectors and methods for use thereof
CN106397740A (zh) * 2015-07-30 2017-02-15 肯特催化材料股份有限公司 环氧树脂固化促进剂及其制备方法
WO2021048977A1 (ja) * 2019-09-12 2021-03-18 昭和電工マテリアルズ株式会社 圧縮成形用封止材及び電子部品装置
WO2021207154A1 (en) * 2020-04-06 2021-10-14 Aspen Aerogels Inc. Improved aerogel compositions and methods

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JPS63223027A (ja) * 1987-03-12 1988-09-16 Taoka Chem Co Ltd 硬化性組成物
JPH02300229A (ja) * 1989-05-16 1990-12-12 Sumitomo Bakelite Co Ltd 一液型エポキシ樹脂組成物
JPH03122114A (ja) * 1989-10-06 1991-05-24 Somar Corp 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物
JPH0625470A (ja) * 1992-07-10 1994-02-01 Nippon Kayaku Co Ltd マイクロカプセル型硬化促進剤及びこれを含む樹脂組成物
JPH06184283A (ja) * 1992-12-21 1994-07-05 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物
JPH06256746A (ja) * 1993-03-09 1994-09-13 Hitachi Chem Co Ltd 接着剤組成物および接着フィルム
JPH0977959A (ja) * 1995-09-14 1997-03-25 Toshiba Corp マイクロカプセル型硬化促進剤および樹脂組成物
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WO2003068840A1 (fr) * 2002-02-18 2003-08-21 Sony Chemicals Corporation Durcisseur latent, procede de production et adhesif contenant un durcisseur latent
JP2003525100A (ja) * 1998-08-13 2003-08-26 ゾル−ゲル テクノロジーズ エルティーディー． 機能性分子により充填されたオキシドマイクロカプセルの調製のための方法およびそれにより得られた生産物
JP2004149437A (ja) * 2002-10-30 2004-05-27 Sumikin Air Water Chemical Inc トリアリールホスホニオフェノラートの製造方法
JP2004156036A (ja) * 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP2004156035A (ja) * 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物及び電子部品装置
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JP2004300071A (ja) * 2003-03-31 2004-10-28 Air Water Chemical Inc ヒドロキシアリールトリアリールホスホニウムアイオダイド、その製法及びその誘導体の製造方法

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JPS5337799A (en) * 1976-09-18 1978-04-07 Merck Patent Gmbh Composite containing silicone dioxide and process for producing same
JPS63223027A (ja) * 1987-03-12 1988-09-16 Taoka Chem Co Ltd 硬化性組成物
JPH02300229A (ja) * 1989-05-16 1990-12-12 Sumitomo Bakelite Co Ltd 一液型エポキシ樹脂組成物
JPH03122114A (ja) * 1989-10-06 1991-05-24 Somar Corp 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物
JPH0625470A (ja) * 1992-07-10 1994-02-01 Nippon Kayaku Co Ltd マイクロカプセル型硬化促進剤及びこれを含む樹脂組成物
JPH06184283A (ja) * 1992-12-21 1994-07-05 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物
JPH06256746A (ja) * 1993-03-09 1994-09-13 Hitachi Chem Co Ltd 接着剤組成物および接着フィルム
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Also Published As

Publication number Publication date
TW200643100A (en) 2006-12-16
WO2006112396A1 (ja) 2006-10-26
US20090062460A1 (en) 2009-03-05
US8129467B2 (en) 2012-03-06
JPWO2006112396A1 (ja) 2008-12-11
KR20070120193A (ko) 2007-12-21
TWI325437B (enExample) 2010-06-01
CN101155854B (zh) 2011-09-07
CN101155854A (zh) 2008-04-02
KR101005994B1 (ko) 2011-01-05

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