JP5127278B2 - 熱型赤外線固体撮像素子及び赤外線カメラ - Google Patents

熱型赤外線固体撮像素子及び赤外線カメラ Download PDF

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JP5127278B2
JP5127278B2 JP2007099640A JP2007099640A JP5127278B2 JP 5127278 B2 JP5127278 B2 JP 5127278B2 JP 2007099640 A JP2007099640 A JP 2007099640A JP 2007099640 A JP2007099640 A JP 2007099640A JP 5127278 B2 JP5127278 B2 JP 5127278B2
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integration
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transistor
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JP2008258973A (ja
JP2008258973A5 (https=
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雅史 上野
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2007099640A 2007-04-05 2007-04-05 熱型赤外線固体撮像素子及び赤外線カメラ Active JP5127278B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007099640A JP5127278B2 (ja) 2007-04-05 2007-04-05 熱型赤外線固体撮像素子及び赤外線カメラ
US12/098,105 US7718966B2 (en) 2007-04-05 2008-04-04 Thermal infrared solid state imaging device and infrared camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007099640A JP5127278B2 (ja) 2007-04-05 2007-04-05 熱型赤外線固体撮像素子及び赤外線カメラ

Publications (3)

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JP2008258973A JP2008258973A (ja) 2008-10-23
JP2008258973A5 JP2008258973A5 (https=) 2010-03-04
JP5127278B2 true JP5127278B2 (ja) 2013-01-23

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US (1) US7718966B2 (https=)
JP (1) JP5127278B2 (https=)

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JP4685949B2 (ja) * 2009-03-17 2011-05-18 三菱電機株式会社 赤外線固体撮像素子
JP5251702B2 (ja) * 2009-04-24 2013-07-31 ソニー株式会社 Ｄａ変換装置、固体撮像素子、およびカメラシステム
JP2011123023A (ja) * 2009-12-14 2011-06-23 Kodenshi Corp 光センサ
JP5136544B2 (ja) * 2009-12-16 2013-02-06 三菱電機株式会社 半導体装置
JP2011187594A (ja) * 2010-03-08 2011-09-22 Hitachi Displays Ltd フォトセンサ装置
JP5143176B2 (ja) * 2010-03-31 2013-02-13 株式会社東芝 赤外線撮像素子およびその製造方法
JP5736784B2 (ja) * 2011-01-13 2015-06-17 セイコーエプソン株式会社 温度検出装置、電気光学装置および電子機器
JP5682395B2 (ja) * 2011-03-25 2015-03-11 富士通株式会社 赤外線検出装置
CN102564605B (zh) * 2011-11-09 2015-04-22 魏建明 高清热成像红外探测器
CN104471360B (zh) * 2012-06-18 2016-04-20 松下知识产权经营株式会社 红外线检测装置
US9462199B2 (en) * 2012-10-12 2016-10-04 Samsung Electronics Co., Ltd. Image sensors, image processing systems including same, and methods of operating the same
US8907284B2 (en) * 2012-12-03 2014-12-09 Stmicroelectronics S.A. Terahertz imager with global reset
US9628738B2 (en) 2013-01-31 2017-04-18 Nanyang Technological University Motion detection image sensors and methods for controlling a motion detection image sensor
JP6172522B2 (ja) * 2013-12-04 2017-08-02 ソニー株式会社 赤外線検出素子およびその検出方法、並びに電子機器
US10641660B2 (en) * 2014-05-30 2020-05-05 Panasonic Corporation Temperature sensor, device using same, and temperature measurement method
JP2016009879A (ja) * 2014-06-20 2016-01-18 キヤノン株式会社 撮像装置、撮像システム及び撮像方法
JP6026585B2 (ja) * 2015-03-26 2016-11-16 株式会社東芝 赤外線撮像装置
JP2017017467A (ja) * 2015-06-30 2017-01-19 株式会社東芝 積分器、ａｄ変換器、及び放射線検出装置
CN106372268B (zh) * 2015-07-20 2019-05-17 中国人民解放军92728部队 基于热模型的实时红外仿真方法
TWI581167B (zh) * 2016-03-29 2017-05-01 矽創電子股份有限公司 雜訊抑制電路
EP3447461B1 (en) * 2016-04-19 2020-04-01 Mitsubishi Electric Corporation Infrared imaging element and infrared camera
EP3282234A1 (en) 2016-08-09 2018-02-14 ams International AG Optical sensor arrangement and method for optical sensing
US10291865B2 (en) 2016-11-03 2019-05-14 Bae Systems Information And Electronic Systems Integration Inc. Method and apparatus for improving frame rate in infrared sensor systems
EP3570325B1 (en) * 2017-01-12 2020-10-28 Mitsubishi Electric Corporation Infrared sensor substrate and infrared sensor device
JP6737192B2 (ja) * 2017-01-25 2020-08-05 セイコーエプソン株式会社 固体撮像装置及び電子機器
US10574915B1 (en) * 2017-10-08 2020-02-25 Analog Value Ltd. Estimating a temperature of a pixel
CN110728945B (zh) * 2019-11-27 2023-05-30 京东方科技集团股份有限公司 移位寄存器单元及其驱动方法、栅极驱动电路和显示装置
CN115053113B (zh) 2020-02-10 2025-09-09 三菱电机株式会社 红外线检测元件
KR102449352B1 (ko) * 2020-12-24 2022-09-30 삼성전기주식회사 적외선 이미지 센서
CN113257184B (zh) * 2021-05-10 2022-10-25 京东方科技集团股份有限公司 采样电路及驱动方法、像素采样电路、显示装置
CN113382175B (zh) * 2021-06-09 2022-12-27 上海矽印科技有限公司 一种高增益像素设计方法
CN113395469B (zh) * 2021-06-10 2022-08-26 成都善思微科技有限公司 一种用于光电转换的积分电路
CN114566130A (zh) * 2022-03-14 2022-05-31 重庆惠科金渝光电科技有限公司 开关控制电路和显示装置
CN118921565B (zh) * 2024-10-09 2025-01-24 浙江大华技术股份有限公司 补光控制电路及图像采集设备

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USRE38527E1 (en) * 1996-04-19 2004-06-08 Nec Corporation Thermal-type infrared imaging device
JPH10122957A (ja) * 1996-10-22 1998-05-15 Nikon Corp 熱型赤外線イメージセンサ
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EP1043574B1 (en) 1998-10-19 2003-08-27 Mitsubishi Denki Kabushiki Kaisha Infrared sensor and infrared sensor array comprising the same
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JP3793033B2 (ja) 2001-03-29 2006-07-05 株式会社東芝 赤外線センサ及びその駆動方法
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JP2004233314A (ja) * 2003-02-03 2004-08-19 Mitsubishi Electric Corp 熱型赤外線固体撮像素子
JP4290034B2 (ja) * 2004-02-20 2009-07-01 三菱電機株式会社 赤外線固体撮像装置
JP3974902B2 (ja) * 2004-02-27 2007-09-12 三菱電機株式会社 熱型赤外線検出素子
JP4372097B2 (ja) * 2005-12-27 2009-11-25 株式会社東芝 赤外線センサ、赤外線カメラ、赤外線センサの駆動方法および赤外線カメラの駆動方法
FR2925159B1 (fr) * 2007-12-12 2012-04-27 Ulis Dispositif pour la detection d'un rayonnement infrarouge comportant un bolometre resistif d'imagerie, systeme comprenant une matrice de tels bolometres, et procede de lecture d'un bolometre d'imagerie integre dans un tel systeme

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US7718966B2 (en) 2010-05-18
US20080251721A1 (en) 2008-10-16

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