JP5125291B2 - 薄板処理装置及びクリーン薄板処理システム - Google Patents

薄板処理装置及びクリーン薄板処理システム Download PDF

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Publication number
JP5125291B2
JP5125291B2 JP2007196459A JP2007196459A JP5125291B2 JP 5125291 B2 JP5125291 B2 JP 5125291B2 JP 2007196459 A JP2007196459 A JP 2007196459A JP 2007196459 A JP2007196459 A JP 2007196459A JP 5125291 B2 JP5125291 B2 JP 5125291B2
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JP
Japan
Prior art keywords
clean
thin plate
clean room
plate processing
duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007196459A
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English (en)
Japanese (ja)
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JP2009030899A (ja
Inventor
賢輔 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
Original Assignee
IHI Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IHI Corp filed Critical IHI Corp
Priority to JP2007196459A priority Critical patent/JP5125291B2/ja
Priority to CN2008801000514A priority patent/CN101779085B/zh
Priority to PCT/JP2008/062090 priority patent/WO2009016919A1/ja
Priority to KR1020107002389A priority patent/KR101289367B1/ko
Priority to TW097128190A priority patent/TW200909751A/zh
Publication of JP2009030899A publication Critical patent/JP2009030899A/ja
Application granted granted Critical
Publication of JP5125291B2 publication Critical patent/JP5125291B2/ja
Active legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2221/00Details or features not otherwise provided for
    • F24F2221/40HVAC with raised floors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ventilation (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
JP2007196459A 2007-07-27 2007-07-27 薄板処理装置及びクリーン薄板処理システム Active JP5125291B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007196459A JP5125291B2 (ja) 2007-07-27 2007-07-27 薄板処理装置及びクリーン薄板処理システム
CN2008801000514A CN101779085B (zh) 2007-07-27 2008-07-03 处理装置及具有处理装置的洁净系统
PCT/JP2008/062090 WO2009016919A1 (ja) 2007-07-27 2008-07-03 処理装置および処理装置を含むクリーンシステム
KR1020107002389A KR101289367B1 (ko) 2007-07-27 2008-07-03 처리 장치 및 처리 장치를 포함하는 클린 시스템
TW097128190A TW200909751A (en) 2007-07-27 2008-07-24 Processing apparatus and clean system including processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007196459A JP5125291B2 (ja) 2007-07-27 2007-07-27 薄板処理装置及びクリーン薄板処理システム

Publications (2)

Publication Number Publication Date
JP2009030899A JP2009030899A (ja) 2009-02-12
JP5125291B2 true JP5125291B2 (ja) 2013-01-23

Family

ID=40304156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007196459A Active JP5125291B2 (ja) 2007-07-27 2007-07-27 薄板処理装置及びクリーン薄板処理システム

Country Status (5)

Country Link
JP (1) JP5125291B2 (ko)
KR (1) KR101289367B1 (ko)
CN (1) CN101779085B (ko)
TW (1) TW200909751A (ko)
WO (1) WO2009016919A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106839245A (zh) * 2017-01-20 2017-06-13 温州弘大市政园林建设有限公司 一种室内绿色建筑装饰工程结构
CN109227605B (zh) * 2018-10-24 2021-08-10 上海稻黄电子设备技术有限公司 一种工业机器人精密组装车间
CN113488413B (zh) * 2021-07-06 2022-08-16 华海清科股份有限公司 晶圆后处理设备及其应用的具有导流功能的通风系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157436A (ja) * 1986-12-22 1988-06-30 Hitachi Electronics Eng Co Ltd ウエハカセツト収納ボツクス
JPH11141939A (ja) * 1997-11-13 1999-05-28 Toyota Autom Loom Works Ltd 電源装置
JPH11337115A (ja) * 1998-05-27 1999-12-10 Fuji Denki Sosetsu Co Ltd クリーンルームの局所空調システム
JP3884570B2 (ja) * 1998-05-29 2007-02-21 大日本スクリーン製造株式会社 基板処理装置
US6426303B1 (en) * 1999-07-16 2002-07-30 Tokyo Electron Limited Processing system
JP4294837B2 (ja) * 1999-07-16 2009-07-15 東京エレクトロン株式会社 処理システム
JP2002039583A (ja) * 2000-07-24 2002-02-06 Ricoh Elemex Corp 空気清浄システム
JP2002174441A (ja) * 2000-12-08 2002-06-21 Mitsubishi Electric Corp 空気清浄システム及び空気清浄ハウジング
JP2003194390A (ja) * 2001-12-27 2003-07-09 Mitsubishi Electric Corp 空気調和システム
JP4715088B2 (ja) * 2003-11-27 2011-07-06 株式会社Ihi 基板搬送装置及び基板保管搬送装置

Also Published As

Publication number Publication date
TWI362476B (ko) 2012-04-21
CN101779085A (zh) 2010-07-14
KR20100037617A (ko) 2010-04-09
WO2009016919A1 (ja) 2009-02-05
JP2009030899A (ja) 2009-02-12
CN101779085B (zh) 2012-10-03
TW200909751A (en) 2009-03-01
KR101289367B1 (ko) 2013-07-29

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