JP5118110B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5118110B2
JP5118110B2 JP2009211855A JP2009211855A JP5118110B2 JP 5118110 B2 JP5118110 B2 JP 5118110B2 JP 2009211855 A JP2009211855 A JP 2009211855A JP 2009211855 A JP2009211855 A JP 2009211855A JP 5118110 B2 JP5118110 B2 JP 5118110B2
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JP
Japan
Prior art keywords
light emitting
emitting device
wiring pattern
substrate
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009211855A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009290244A5 (https=
JP2009290244A (ja
Inventor
正宏 小西
誠 英賀谷
俊雄 幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=41459082&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5118110(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2009211855A priority Critical patent/JP5118110B2/ja
Publication of JP2009290244A publication Critical patent/JP2009290244A/ja
Publication of JP2009290244A5 publication Critical patent/JP2009290244A5/ja
Application granted granted Critical
Publication of JP5118110B2 publication Critical patent/JP5118110B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2009211855A 2009-09-14 2009-09-14 発光装置 Active JP5118110B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009211855A JP5118110B2 (ja) 2009-09-14 2009-09-14 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009211855A JP5118110B2 (ja) 2009-09-14 2009-09-14 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007067362A Division JP4753904B2 (ja) 2007-03-15 2007-03-15 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010129024A Division JP5442534B2 (ja) 2010-06-04 2010-06-04 発光装置

Publications (3)

Publication Number Publication Date
JP2009290244A JP2009290244A (ja) 2009-12-10
JP2009290244A5 JP2009290244A5 (https=) 2010-03-18
JP5118110B2 true JP5118110B2 (ja) 2013-01-16

Family

ID=41459082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009211855A Active JP5118110B2 (ja) 2009-09-14 2009-09-14 発光装置

Country Status (1)

Country Link
JP (1) JP5118110B2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4753904B2 (ja) 2007-03-15 2011-08-24 シャープ株式会社 発光装置
JP5263658B2 (ja) 2007-11-30 2013-08-14 東芝ライテック株式会社 照明装置
JP5157836B2 (ja) 2008-11-12 2013-03-06 東芝ライテック株式会社 照明器具
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
JP2011151268A (ja) 2010-01-22 2011-08-04 Sharp Corp 発光装置
CN102163602B (zh) 2010-02-16 2015-01-14 东芝照明技术株式会社 发光装置以及具备此发光装置的照明装置
JP5708983B2 (ja) 2010-03-29 2015-04-30 東芝ライテック株式会社 照明装置
JP5747546B2 (ja) 2010-03-29 2015-07-15 東芝ライテック株式会社 照明装置
JP5846408B2 (ja) 2010-05-26 2016-01-20 東芝ライテック株式会社 発光装置および照明装置
JP5459104B2 (ja) * 2010-06-28 2014-04-02 東芝ライテック株式会社 発光モジュール及びこれを備えた照明器具
JP6101629B2 (ja) 2011-10-31 2017-03-22 シャープ株式会社 発光装置、照明装置、及び、発光装置の製造方法
JP6072472B2 (ja) * 2012-08-27 2017-02-01 シチズン電子株式会社 Ｌｅｄ発光装置
JP6080053B2 (ja) * 2012-09-26 2017-02-15 パナソニックＩｐマネジメント株式会社 発光モジュール
JP5844317B2 (ja) * 2013-08-08 2016-01-13 シャープ株式会社 Ｌｅｄ電球
EP3591346B1 (de) * 2018-07-02 2020-11-11 Dr. Johannes Heidenhain GmbH Verfahren zur herstellung einer lichtquelle für eine sensoreinheit einer positionsmesseinrichtung sowie eine positionsmesseinrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
JP2004172577A (ja) * 2002-10-30 2004-06-17 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP5138145B2 (ja) * 2002-11-12 2013-02-06 日亜化学工業株式会社 蛍光体積層構造及びそれを用いる光源
JP4143043B2 (ja) * 2004-05-26 2008-09-03 京セラ株式会社 発光装置および照明装置
JP2006049715A (ja) * 2004-08-06 2006-02-16 Matsushita Electric Ind Co Ltd 発光光源、照明装置及び表示装置
JP2006222412A (ja) * 2005-01-17 2006-08-24 Citizen Electronics Co Ltd 発光装置
JP2006295084A (ja) * 2005-04-14 2006-10-26 Citizen Electronics Co Ltd 発光ダイオードのパッケージ構造
JP4241658B2 (ja) * 2005-04-14 2009-03-18 シチズン電子株式会社 発光ダイオード光源ユニット及びそれを用いて形成した発光ダイオード光源
JP4756682B2 (ja) * 2005-05-16 2011-08-24 シチズン電子株式会社 発光ダイオード光源ユニット及びバルブ型発光ダイオード光源
JP2006332234A (ja) * 2005-05-25 2006-12-07 Hitachi Aic Inc 反射機能を有するｌｅｄ装置
JP2006351708A (ja) * 2005-06-14 2006-12-28 Toyoda Gosei Co Ltd 発光ダイオードランプ及び光源装置
US20070023765A1 (en) * 2005-07-29 2007-02-01 Thomas Alan C Acicular ITO for LED array

Also Published As

Publication number Publication date
JP2009290244A (ja) 2009-12-10

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