JP5093991B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5093991B2 JP5093991B2 JP2005101822A JP2005101822A JP5093991B2 JP 5093991 B2 JP5093991 B2 JP 5093991B2 JP 2005101822 A JP2005101822 A JP 2005101822A JP 2005101822 A JP2005101822 A JP 2005101822A JP 5093991 B2 JP5093991 B2 JP 5093991B2
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- 239000004065 semiconductor Substances 0.000 title claims description 47
- 229910002704 AlGaN Inorganic materials 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 60
- 230000005533 two-dimensional electron gas Effects 0.000 description 24
- 230000010287 polarization Effects 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000015556 catabolic process Effects 0.000 description 12
- 230000005684 electric field Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000002269 spontaneous effect Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
Description
12 GaN電子走行層
13 2DEG
14 AlGaN電子供給層
16 GaN系半導体層
18 ゲート電極
20 ソース電極
22 ドレイン電極
28 凹部
30、32 フォトレジスト
31 第1の開口部
33 第2の開口部
34 第1のリセス部
36 ゲート埋込部
38 第2のリセス部
40、42、44、46、48,50 凹部
Claims (5)
- 基板と、
該基板上に電子走行層と電子供給層とが順に形成されたGaN系半導体層と、
前記電子供給層に形成されたゲート埋込部に埋め込まれ形成されたゲート電極と、
該ゲート電極の両側に形成されたソース電極およびドレイン電極と、
前記ゲート電極と前記ソース電極の間の前記電子供給層に形成された第1のリセス部と、
前記ゲート電極と前記ドレイン電極の間の前記電子供給層に形成された第2のリセス部と、を具備し、
前記第1のリセス部の深さが、前記第2のリセス部の深さよりも浅く、前記ゲート電極が埋め込まれた前記ゲート埋込部の深さは、前記第1のリセス部および前記第2のリセス部の深さよりも深く、
前記ゲート電極は、前記第1のリセス部、前記第2のリセス部および前記ゲート埋込部それぞれの表面に接して設けられていることを特徴とする半導体装置。 - 前記GaN系半導体層は、前記基板の(0001)面に形成されたことを特徴とする請求項1記載の半導体装置。
- 前記GaN系半導体層は、GaN、AlNおよびInNの少なくとも1つからなる結晶層または混晶層を含む層であることを特徴とする請求項1または2記載の半導体装置。
- 前記GaN系半導体層は、GaN電子走行層とAlGaN電子供給層を含むことを特徴とする請求項3記載の半導体装置。
- 前記第2のリセス部と前記ドレイン電極の間に前記GaN系半導体層の凹部を具備することを特徴とする請求項1から4のいずれか一項記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005101822A JP5093991B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
US11/392,516 US8044433B2 (en) | 2005-03-31 | 2006-03-30 | GaN-based high electron mobility transistor (HEMT) with an embedded gate electrode having a first recess portion and a second recess portion to improve drain breakdown voltage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005101822A JP5093991B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006286740A JP2006286740A (ja) | 2006-10-19 |
JP2006286740A5 JP2006286740A5 (ja) | 2008-05-01 |
JP5093991B2 true JP5093991B2 (ja) | 2012-12-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005101822A Expired - Fee Related JP5093991B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8044433B2 (ja) |
JP (1) | JP5093991B2 (ja) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007194588A (ja) * | 2005-12-20 | 2007-08-02 | Sony Corp | 電界効果トランジスタ及びこの電界効果トランジスタを備えた半導体装置並びに半導体装置の製造方法 |
EP2040299A1 (en) * | 2007-09-12 | 2009-03-25 | Forschungsverbund Berlin e.V. | Electrical devices having improved transfer characteristics and method for tailoring the transfer characteristics of such an electrical device |
JP5555985B2 (ja) * | 2008-06-23 | 2014-07-23 | サンケン電気株式会社 | 半導体装置 |
JP5564791B2 (ja) * | 2008-12-26 | 2014-08-06 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
JP5577681B2 (ja) | 2009-11-30 | 2014-08-27 | 住友電気工業株式会社 | 半導体装置 |
JP5506919B2 (ja) * | 2010-04-22 | 2014-05-28 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
DE102010016993A1 (de) * | 2010-05-18 | 2011-11-24 | United Monolithic Semiconductors Gmbh | Halbleiter-Bauelement |
JP5776143B2 (ja) | 2010-07-06 | 2015-09-09 | サンケン電気株式会社 | 半導体装置 |
JP5747245B2 (ja) * | 2010-10-14 | 2015-07-08 | 国立研究開発法人物質・材料研究機構 | 電界効果トランジスタ及びその製造方法 |
CN102064261B (zh) * | 2010-11-03 | 2012-09-05 | 中国科学院半导体研究所 | 栅极调制垂直结构GaN基发光二极管的器件结构及制备方法 |
JP2012109366A (ja) * | 2010-11-17 | 2012-06-07 | Sharp Corp | 窒化物半導体装置 |
JP5801560B2 (ja) * | 2011-01-21 | 2015-10-28 | 株式会社豊田中央研究所 | 半導体装置 |
JP5566937B2 (ja) * | 2011-03-28 | 2014-08-06 | 古河電気工業株式会社 | 窒化物系半導体デバイス及びその製造方法 |
US8884308B2 (en) * | 2011-11-29 | 2014-11-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | High electron mobility transistor structure with improved breakdown voltage performance |
JP5790461B2 (ja) * | 2011-12-07 | 2015-10-07 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
EP2608268B8 (en) | 2011-12-19 | 2017-06-21 | Nexperia B.V. | Semiconductor device |
JP5991000B2 (ja) * | 2012-04-23 | 2016-09-14 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US10700201B2 (en) | 2012-05-23 | 2020-06-30 | Hrl Laboratories, Llc | HEMT GaN device with a non-uniform lateral two dimensional electron gas profile and method of manufacturing the same |
EP2852979A4 (en) * | 2012-05-23 | 2015-11-18 | Hrl Lab Llc | FIELD EFFECT TRANSISTOR WITH HIGH ELECTRONIC MOBILITY AND METHOD FOR THE MANUFACTURE THEREOF |
US9000484B2 (en) | 2012-05-23 | 2015-04-07 | Hrl Laboratories, Llc | Non-uniform lateral profile of two-dimensional electron gas charge density in type III nitride HEMT devices using ion implantation through gray scale mask |
US8680536B2 (en) | 2012-05-23 | 2014-03-25 | Hrl Laboratories, Llc | Non-uniform two dimensional electron gas profile in III-Nitride HEMT devices |
US9379195B2 (en) * | 2012-05-23 | 2016-06-28 | Hrl Laboratories, Llc | HEMT GaN device with a non-uniform lateral two dimensional electron gas profile and method of manufacturing the same |
CN104412388B (zh) * | 2012-05-23 | 2020-03-06 | Hrl实验室有限责任公司 | Hemt器件及其制作方法 |
US8981528B2 (en) * | 2012-11-16 | 2015-03-17 | Vishay General Semiconductor Llc | GaN-based Schottky diode having partially recessed anode |
JP2016058681A (ja) * | 2014-09-12 | 2016-04-21 | 株式会社東芝 | 半導体装置 |
JP6332021B2 (ja) | 2014-12-26 | 2018-05-30 | 株式会社デンソー | 半導体装置 |
US10177061B2 (en) | 2015-02-12 | 2019-01-08 | Infineon Technologies Austria Ag | Semiconductor device |
JP6311668B2 (ja) | 2015-07-10 | 2018-04-18 | 株式会社デンソー | 半導体装置 |
ITUB20155536A1 (it) * | 2015-11-12 | 2017-05-12 | St Microelectronics Srl | Transistore hemt di tipo normalmente spento includente una trincea contenente una regione di gate e formante almeno un gradino, e relativo procedimento di fabbricazione |
WO2019090762A1 (zh) * | 2017-11-13 | 2019-05-16 | 吴展兴 | 半导体结构及其形成方法 |
US10680092B2 (en) | 2018-10-01 | 2020-06-09 | Semiconductor Components Industries, Llc | Electronic device including a transistor with a non-uniform 2DEG |
CN112133739B (zh) * | 2019-06-25 | 2024-05-07 | 联华电子股份有限公司 | 高电子迁移率晶体管和调整二维电子气体电子密度的方法 |
JP7332548B2 (ja) * | 2020-08-06 | 2023-08-23 | 株式会社東芝 | 半導体装置 |
US20230078017A1 (en) * | 2021-09-16 | 2023-03-16 | Wolfspeed, Inc. | Semiconductor device incorporating a substrate recess |
Family Cites Families (11)
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JP2615585B2 (ja) * | 1987-01-29 | 1997-05-28 | 日本電気株式会社 | 砒化ガリウムトランジスタ |
US5192987A (en) * | 1991-05-17 | 1993-03-09 | Apa Optics, Inc. | High electron mobility transistor with GaN/Alx Ga1-x N heterojunctions |
JPH10178024A (ja) * | 1996-12-18 | 1998-06-30 | Matsushita Electric Ind Co Ltd | 電界効果型トランジスタ及びその製造方法 |
JP3127874B2 (ja) * | 1998-02-12 | 2001-01-29 | 日本電気株式会社 | 電界効果トランジスタ及びその製造方法 |
JP3534624B2 (ja) * | 1998-05-01 | 2004-06-07 | 沖電気工業株式会社 | 半導体装置の製造方法 |
US6133593A (en) * | 1999-07-23 | 2000-10-17 | The United States Of America As Represented By The Secretary Of The Navy | Channel design to reduce impact ionization in heterostructure field-effect transistors |
US6639255B2 (en) * | 1999-12-08 | 2003-10-28 | Matsushita Electric Industrial Co., Ltd. | GaN-based HFET having a surface-leakage reducing cap layer |
DE20010743U1 (de) * | 2000-06-16 | 2000-10-12 | Westfalia Separator Food Tec G | Zentrifuge mit doppeltem Zulauf |
JP4186032B2 (ja) * | 2000-06-29 | 2008-11-26 | 日本電気株式会社 | 半導体装置 |
JP4022708B2 (ja) * | 2000-06-29 | 2007-12-19 | 日本電気株式会社 | 半導体装置 |
JP4220683B2 (ja) * | 2001-03-27 | 2009-02-04 | パナソニック株式会社 | 半導体装置 |
-
2005
- 2005-03-31 JP JP2005101822A patent/JP5093991B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 US US11/392,516 patent/US8044433B2/en not_active Expired - Fee Related
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US20060220065A1 (en) | 2006-10-05 |
US8044433B2 (en) | 2011-10-25 |
JP2006286740A (ja) | 2006-10-19 |
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