JP5082009B2 - ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法 - Google Patents

ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法 Download PDF

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Publication number
JP5082009B2
JP5082009B2 JP2011500565A JP2011500565A JP5082009B2 JP 5082009 B2 JP5082009 B2 JP 5082009B2 JP 2011500565 A JP2011500565 A JP 2011500565A JP 2011500565 A JP2011500565 A JP 2011500565A JP 5082009 B2 JP5082009 B2 JP 5082009B2
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Prior art keywords
tray
wafer
electrostatic chuck
spring
type terminal
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Japanese (ja)
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JPWO2010095540A1 (ja
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隆一郎 上村
一弘 渡邊
龍司 橋本
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Ulvac Inc
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Ulvac Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
JP2011500565A 2009-02-18 2010-02-09 ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法 Active JP5082009B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011500565A JP5082009B2 (ja) 2009-02-18 2010-02-09 ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009035713 2009-02-18
JP2009035713 2009-02-18
JP2011500565A JP5082009B2 (ja) 2009-02-18 2010-02-09 ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法
PCT/JP2010/051894 WO2010095540A1 (ja) 2009-02-18 2010-02-09 ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法

Publications (2)

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JPWO2010095540A1 JPWO2010095540A1 (ja) 2012-08-23
JP5082009B2 true JP5082009B2 (ja) 2012-11-28

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JP2011500565A Active JP5082009B2 (ja) 2009-02-18 2010-02-09 ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法

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US (1) US8582274B2 (de)
EP (1) EP2400536B1 (de)
JP (1) JP5082009B2 (de)
KR (1) KR101331372B1 (de)
CN (1) CN102067303B (de)
TW (1) TWI401770B (de)
WO (1) WO2010095540A1 (de)

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KR20180099494A (ko) * 2017-02-27 2018-09-05 신꼬오덴기 고교 가부시키가이샤 기판 고정구 및 기판 고정 디바이스

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CN102412176B (zh) * 2010-09-26 2014-08-27 北京北方微电子基地设备工艺研究中心有限责任公司 托盘及具有其的晶片处理设备
JP5609663B2 (ja) * 2011-01-18 2014-10-22 旭硝子株式会社 ガラス基板保持手段、およびそれを用いたｅｕｖマスクブランクスの製造方法
EP2490073B1 (de) 2011-02-18 2015-09-23 ASML Netherlands BV Substrathalter, lithografische Vorrichtung und Verfahren zur Herstellung eines Substrathalters
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
CN103094166B (zh) * 2011-10-31 2015-04-15 北京北方微电子基地设备工艺研究中心有限责任公司 晶圆承载装置及具有它的半导体处理设备
CN103187348A (zh) * 2011-12-31 2013-07-03 北京北方微电子基地设备工艺研究中心有限责任公司 晶片固定装置、半导体设备和晶片固定方法
JP6058269B2 (ja) * 2012-02-02 2017-01-11 Ｓｐｐテクノロジーズ株式会社 基板トレー、およびこれを備えたプラズマ処理装置
JP6085616B2 (ja) 2012-02-03 2017-02-22 エーエスエムエル ネザーランズ ビー．ブイ． 基板ホルダ、リソグラフィ装置、デバイス製造方法及び基板ホルダの製造方法
JP5975755B2 (ja) * 2012-06-28 2016-08-23 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
CN103594315B (zh) * 2012-08-14 2016-04-20 北京北方微电子基地设备工艺研究中心有限责任公司 一种等离子体加工设备
CN103590114B (zh) * 2012-08-17 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 一种托盘紧固装置及等离子体加工设备
JP6007039B2 (ja) * 2012-09-18 2016-10-12 株式会社アルバック 搬送トレー及び基板保持方法
US8945983B2 (en) * 2012-12-28 2015-02-03 Taiwan Semiconductor Manufacturing Company, Ltd. System and method to improve package and 3DIC yield in underfill process
CN104342758B (zh) * 2013-07-24 2017-07-21 北京北方微电子基地设备工艺研究中心有限责任公司 压环及等离子体加工设备
KR20170124620A (ko) * 2013-08-05 2017-11-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
CN110085546B (zh) * 2013-08-05 2023-05-16 应用材料公司 用于薄基板搬运的静电载体
KR20160058917A (ko) 2013-09-20 2016-05-25 어플라이드 머티어리얼스, 인코포레이티드 통합된 정전 척을 갖는 기판 캐리어
CN104752129B (zh) * 2013-12-30 2018-01-19 北京北方华创微电子装备有限公司 托盘组件和刻蚀设备
KR102247439B1 (ko) 2014-01-22 2021-05-03 가부시키가이샤 아루박 플라즈마 처리 장치 및 웨이퍼 반송용 트레이
FR3017487B1 (fr) * 2014-02-07 2016-03-18 Ion Beam Services Porte-substrat electrostatique chauffant et polarise en haute tension
KR101684281B1 (ko) * 2014-02-14 2016-12-08 (주)브이앤아이솔루션 기판처리장치의 기판캐리어
TWI660452B (zh) * 2014-02-17 2019-05-21 優貝克科技股份有限公司 用於乾式蝕刻裝置之基板托盤組
JP2017516294A (ja) 2014-05-09 2017-06-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板キャリアシステム及びそれを使用するための方法
CN105448794B (zh) * 2014-08-13 2019-07-19 北京北方华创微电子装备有限公司 一种托盘及承载装置
US9823018B2 (en) * 2014-10-08 2017-11-21 Robert M. Parker Heated shelf apparatus and freeze dry cart using same
CN105702614B (zh) * 2014-11-24 2019-08-23 北京北方华创微电子装备有限公司 基片承载装置和刻蚀设备
KR101910727B1 (ko) * 2015-01-20 2018-10-22 엔지케이 인슐레이터 엘티디 웨이퍼 지지 구조체
KR102192024B1 (ko) * 2015-01-22 2020-12-17 주식회사 원익아이피에스 기판지지대 및 그가 설치된 기판처리장치
CN104681402B (zh) * 2015-03-16 2018-03-16 京东方科技集团股份有限公司 基板加热装置和基板加热方法
JP6400188B2 (ja) * 2015-04-15 2018-10-03 株式会社アルバック 吸着装置、真空処理装置
US10460969B2 (en) 2016-08-22 2019-10-29 Applied Materials, Inc. Bipolar electrostatic chuck and method for using the same
JP6710461B2 (ja) * 2016-09-30 2020-06-17 株式会社ディスコ 搬送トレイ、及び搬送トレイの給電装置
JP6824003B2 (ja) * 2016-11-08 2021-02-03 株式会社アルバック 静電チャック付きトレイ
CN106378730A (zh) * 2016-11-24 2017-02-08 南京中电熊猫晶体科技有限公司 一种负压吸附夹具装置
WO2018179295A1 (ja) * 2017-03-30 2018-10-04 株式会社ニコン 露光装置及び方法、並びにデバイス製造方法
JP2022530906A (ja) * 2019-05-07 2022-07-04 ラム リサーチ コーポレーション 静電チャックシステム
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
CN112133664B (zh) * 2020-09-25 2024-03-26 北京北方华创微电子装备有限公司 静电卡盘装置及半导体工艺设备
JP7593309B2 (ja) * 2021-12-27 2024-12-03 株式会社Sumco 絶縁膜形成装置用トレー、絶縁膜形成装置および絶縁膜形成方法
WO2024070009A1 (ja) * 2022-09-27 2024-04-04 東京エレクトロン株式会社 静電キャリア、処理システム及び処理方法

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Publication number Priority date Publication date Assignee Title
KR20180099494A (ko) * 2017-02-27 2018-09-05 신꼬오덴기 고교 가부시키가이샤 기판 고정구 및 기판 고정 디바이스
KR102453116B1 (ko) * 2017-02-27 2022-10-12 신꼬오덴기 고교 가부시키가이샤 기판 고정구 및 기판 고정 디바이스

Also Published As

Publication number Publication date
CN102067303B (zh) 2012-11-28
WO2010095540A1 (ja) 2010-08-26
EP2400536A4 (de) 2014-07-02
JPWO2010095540A1 (ja) 2012-08-23
US8582274B2 (en) 2013-11-12
TWI401770B (zh) 2013-07-11
EP2400536B1 (de) 2020-04-15
EP2400536A1 (de) 2011-12-28
KR20110025783A (ko) 2011-03-11
CN102067303A (zh) 2011-05-18
TW201101413A (en) 2011-01-01
US20110292561A1 (en) 2011-12-01
KR101331372B1 (ko) 2013-11-20

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