JP5081578B2 - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置 Download PDF

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Publication number
JP5081578B2
JP5081578B2 JP2007277269A JP2007277269A JP5081578B2 JP 5081578 B2 JP5081578 B2 JP 5081578B2 JP 2007277269 A JP2007277269 A JP 2007277269A JP 2007277269 A JP2007277269 A JP 2007277269A JP 5081578 B2 JP5081578 B2 JP 5081578B2
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Japan
Prior art keywords
semiconductor device
resin
semiconductor chip
layer
heat
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Active
Application number
JP2007277269A
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English (en)
Japanese (ja)
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JP2009105297A5 (https=
JP2009105297A (ja
Inventor
尚司 安永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007277269A priority Critical patent/JP5081578B2/ja
Priority to US12/256,680 priority patent/US9484282B2/en
Publication of JP2009105297A publication Critical patent/JP2009105297A/ja
Publication of JP2009105297A5 publication Critical patent/JP2009105297A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2007277269A 2007-10-25 2007-10-25 樹脂封止型半導体装置 Active JP5081578B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007277269A JP5081578B2 (ja) 2007-10-25 2007-10-25 樹脂封止型半導体装置
US12/256,680 US9484282B2 (en) 2007-10-25 2008-10-23 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007277269A JP5081578B2 (ja) 2007-10-25 2007-10-25 樹脂封止型半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012190798A Division JP2012256935A (ja) 2012-08-31 2012-08-31 樹脂封止型半導体装置

Publications (3)

Publication Number Publication Date
JP2009105297A JP2009105297A (ja) 2009-05-14
JP2009105297A5 JP2009105297A5 (https=) 2010-12-02
JP5081578B2 true JP5081578B2 (ja) 2012-11-28

Family

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Family Applications (1)

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JP2007277269A Active JP5081578B2 (ja) 2007-10-25 2007-10-25 樹脂封止型半導体装置

Country Status (2)

Country Link
US (1) US9484282B2 (https=)
JP (1) JP5081578B2 (https=)

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JP5081578B2 (ja) * 2007-10-25 2012-11-28 ローム株式会社 樹脂封止型半導体装置
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JP5945326B2 (ja) * 2012-07-30 2016-07-05 パナソニック株式会社 放熱構造を備えた半導体装置
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JP2015012161A (ja) * 2013-06-28 2015-01-19 株式会社デンソー 電子装置
CN103489792B (zh) * 2013-08-06 2016-02-03 江苏长电科技股份有限公司 先封后蚀三维系统级芯片倒装封装结构及工艺方法
CN103390563B (zh) * 2013-08-06 2016-03-30 江苏长电科技股份有限公司 先封后蚀芯片倒装三维系统级金属线路板结构及工艺方法
JP6371583B2 (ja) 2014-05-20 2018-08-08 ローム株式会社 半導体パッケージ、ｐｃｂ基板および半導体装置
US20190214327A1 (en) * 2018-01-10 2019-07-11 Sonja Koller Thermal conduction devices and methods for embedded electronic devices
CN109698263B (zh) * 2018-11-28 2023-11-03 广东晶科电子股份有限公司 一种封装基板、半导体器件及其制作方法
CN110767614B (zh) * 2019-10-10 2025-05-02 华为技术有限公司 封装结构和电子装置
KR102622520B1 (ko) * 2021-03-11 2024-01-08 가부시키가이샤 메이코 기억 장치 및 기억 장치 모듈
JPWO2024262278A1 (https=) * 2023-06-22 2024-12-26

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Publication number Publication date
JP2009105297A (ja) 2009-05-14
US20090184412A1 (en) 2009-07-23
US9484282B2 (en) 2016-11-01

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