JPWO2024262278A1 - - Google Patents
Info
- Publication number
- JPWO2024262278A1 JPWO2024262278A1 JP2025527647A JP2025527647A JPWO2024262278A1 JP WO2024262278 A1 JPWO2024262278 A1 JP WO2024262278A1 JP 2025527647 A JP2025527647 A JP 2025527647A JP 2025527647 A JP2025527647 A JP 2025527647A JP WO2024262278 A1 JPWO2024262278 A1 JP WO2024262278A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/823—Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023102475 | 2023-06-22 | ||
| PCT/JP2024/019857 WO2024262278A1 (ja) | 2023-06-22 | 2024-05-30 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024262278A1 true JPWO2024262278A1 (https=) | 2024-12-26 |
| JPWO2024262278A5 JPWO2024262278A5 (https=) | 2026-03-23 |
Family
ID=93935545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025527647A Pending JPWO2024262278A1 (https=) | 2023-06-22 | 2024-05-30 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260107814A1 (https=) |
| JP (1) | JPWO2024262278A1 (https=) |
| CN (1) | CN121336531A (https=) |
| WO (1) | WO2024262278A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042977A (ja) * | 2005-08-05 | 2007-02-15 | Shinko Electric Ind Co Ltd | 半導体装置 |
| JP5081578B2 (ja) * | 2007-10-25 | 2012-11-28 | ローム株式会社 | 樹脂封止型半導体装置 |
| US10347574B2 (en) * | 2017-09-28 | 2019-07-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated fan-out packages |
| US11488883B1 (en) * | 2021-04-13 | 2022-11-01 | Western Digital Technologies, Inc. | Semiconductor device package having thermally conductive layers for heat dissipation |
-
2024
- 2024-05-30 JP JP2025527647A patent/JPWO2024262278A1/ja active Pending
- 2024-05-30 CN CN202480039790.6A patent/CN121336531A/zh active Pending
- 2024-05-30 WO PCT/JP2024/019857 patent/WO2024262278A1/ja not_active Ceased
-
2025
- 2025-12-16 US US19/422,062 patent/US20260107814A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20260107814A1 (en) | 2026-04-16 |
| WO2024262278A1 (ja) | 2024-12-26 |
| CN121336531A (zh) | 2026-01-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251216 |