JPWO2024262278A5 - - Google Patents

Info

Publication number
JPWO2024262278A5
JPWO2024262278A5 JP2025527647A JP2025527647A JPWO2024262278A5 JP WO2024262278 A5 JPWO2024262278 A5 JP WO2024262278A5 JP 2025527647 A JP2025527647 A JP 2025527647A JP 2025527647 A JP2025527647 A JP 2025527647A JP WO2024262278 A5 JPWO2024262278 A5 JP WO2024262278A5
Authority
JP
Japan
Prior art keywords
thickness direction
electronic device
insulating layer
electronic
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025527647A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024262278A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/019857 external-priority patent/WO2024262278A1/ja
Publication of JPWO2024262278A1 publication Critical patent/JPWO2024262278A1/ja
Publication of JPWO2024262278A5 publication Critical patent/JPWO2024262278A5/ja
Pending legal-status Critical Current

Links

JP2025527647A 2023-06-22 2024-05-30 Pending JPWO2024262278A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023102475 2023-06-22
PCT/JP2024/019857 WO2024262278A1 (ja) 2023-06-22 2024-05-30 電子装置

Publications (2)

Publication Number Publication Date
JPWO2024262278A1 JPWO2024262278A1 (https=) 2024-12-26
JPWO2024262278A5 true JPWO2024262278A5 (https=) 2026-03-23

Family

ID=93935545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025527647A Pending JPWO2024262278A1 (https=) 2023-06-22 2024-05-30

Country Status (4)

Country Link
US (1) US20260107814A1 (https=)
JP (1) JPWO2024262278A1 (https=)
CN (1) CN121336531A (https=)
WO (1) WO2024262278A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042977A (ja) * 2005-08-05 2007-02-15 Shinko Electric Ind Co Ltd 半導体装置
JP5081578B2 (ja) * 2007-10-25 2012-11-28 ローム株式会社 樹脂封止型半導体装置
US10347574B2 (en) * 2017-09-28 2019-07-09 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated fan-out packages
US11488883B1 (en) * 2021-04-13 2022-11-01 Western Digital Technologies, Inc. Semiconductor device package having thermally conductive layers for heat dissipation

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