JP5079209B2 - 樹脂含浸基材 - Google Patents
樹脂含浸基材 Download PDFInfo
- Publication number
- JP5079209B2 JP5079209B2 JP2004176521A JP2004176521A JP5079209B2 JP 5079209 B2 JP5079209 B2 JP 5079209B2 JP 2004176521 A JP2004176521 A JP 2004176521A JP 2004176521 A JP2004176521 A JP 2004176521A JP 5079209 B2 JP5079209 B2 JP 5079209B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- aromatic
- structural unit
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 14
- 229920005989 resin Polymers 0.000 title description 16
- 239000011347 resin Substances 0.000 title description 16
- 229920000728 polyester Polymers 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 37
- 125000003118 aryl group Chemical group 0.000 claims description 35
- 239000002904 solvent Substances 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 27
- 239000004973 liquid crystal related substance Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 22
- 239000000835 fiber Substances 0.000 claims description 14
- 239000000010 aprotic solvent Substances 0.000 claims description 6
- 150000004982 aromatic amines Chemical class 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 21
- 238000006116 polymerization reaction Methods 0.000 description 15
- 150000001408 amides Chemical class 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- -1 1,4-phenylene, 1,3-phenylene Chemical group 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 8
- 239000004745 nonwoven fabric Substances 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000007790 solid phase Substances 0.000 description 8
- 238000005809 transesterification reaction Methods 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 238000006068 polycondensation reaction Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 150000004665 fatty acids Chemical class 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000005917 acylation reaction Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 2
- LODHFNUFVRVKTH-ZHACJKMWSA-N 2-hydroxy-n'-[(e)-3-phenylprop-2-enoyl]benzohydrazide Chemical compound OC1=CC=CC=C1C(=O)NNC(=O)\C=C\C1=CC=CC=C1 LODHFNUFVRVKTH-ZHACJKMWSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N Salicylic acid Natural products OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229920000508 Vectran Polymers 0.000 description 2
- 239000004979 Vectran Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- LSACYLWPPQLVSM-UHFFFAOYSA-N isobutyric acid anhydride Chemical compound CC(C)C(=O)OC(=O)C(C)C LSACYLWPPQLVSM-UHFFFAOYSA-N 0.000 description 2
- 150000002596 lactones Chemical class 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- PSHKMPUSSFXUIA-UHFFFAOYSA-N n,n-dimethylpyridin-2-amine Chemical compound CN(C)C1=CC=CC=N1 PSHKMPUSSFXUIA-UHFFFAOYSA-N 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- JFKMVXDFCXFYNM-UHFFFAOYSA-N (2,2,2-tribromoacetyl) 2,2,2-tribromoacetate Chemical compound BrC(Br)(Br)C(=O)OC(=O)C(Br)(Br)Br JFKMVXDFCXFYNM-UHFFFAOYSA-N 0.000 description 1
- MEFKFJOEVLUFAY-UHFFFAOYSA-N (2,2,2-trichloroacetyl) 2,2,2-trichloroacetate Chemical compound ClC(Cl)(Cl)C(=O)OC(=O)C(Cl)(Cl)Cl MEFKFJOEVLUFAY-UHFFFAOYSA-N 0.000 description 1
- VGCSPGQZLMQTHC-UHFFFAOYSA-N (2,2-dibromoacetyl) 2,2-dibromoacetate Chemical compound BrC(Br)C(=O)OC(=O)C(Br)Br VGCSPGQZLMQTHC-UHFFFAOYSA-N 0.000 description 1
- RQHMQURGSQBBJY-UHFFFAOYSA-N (2,2-dichloroacetyl) 2,2-dichloroacetate Chemical compound ClC(Cl)C(=O)OC(=O)C(Cl)Cl RQHMQURGSQBBJY-UHFFFAOYSA-N 0.000 description 1
- IYXUFOCLMOXQSL-UHFFFAOYSA-N (2,2-difluoroacetyl) 2,2-difluoroacetate Chemical compound FC(F)C(=O)OC(=O)C(F)F IYXUFOCLMOXQSL-UHFFFAOYSA-N 0.000 description 1
- FUKOTTQGWQVMQB-UHFFFAOYSA-N (2-bromoacetyl) 2-bromoacetate Chemical compound BrCC(=O)OC(=O)CBr FUKOTTQGWQVMQB-UHFFFAOYSA-N 0.000 description 1
- PNVPNXKRAUBJGW-UHFFFAOYSA-N (2-chloroacetyl) 2-chloroacetate Chemical compound ClCC(=O)OC(=O)CCl PNVPNXKRAUBJGW-UHFFFAOYSA-N 0.000 description 1
- KLLYGDXCCNXESW-UHFFFAOYSA-N (2-fluoroacetyl) 2-fluoroacetate Chemical compound FCC(=O)OC(=O)CF KLLYGDXCCNXESW-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- PGZVFRAEAAXREB-UHFFFAOYSA-N 2,2-dimethylpropanoyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC(=O)C(C)(C)C PGZVFRAEAAXREB-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- MONMFXREYOKQTI-UHFFFAOYSA-N 2-bromopropanoic acid Chemical compound CC(Br)C(O)=O MONMFXREYOKQTI-UHFFFAOYSA-N 0.000 description 1
- TVPCUVQDVRZTAL-UHFFFAOYSA-N 2-ethylhexanoyl 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)OC(=O)C(CC)CCCC TVPCUVQDVRZTAL-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- JTGCXYYDAVPSFD-UHFFFAOYSA-N 4-(4-hydroxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(O)C=C1 JTGCXYYDAVPSFD-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 230000010933 acylation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
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- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- DUCKXCGALKOSJF-UHFFFAOYSA-N pentanoyl pentanoate Chemical compound CCCCC(=O)OC(=O)CCCC DUCKXCGALKOSJF-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- IAHFWCOBPZCAEA-UHFFFAOYSA-N succinonitrile Chemical compound N#CCCC#N IAHFWCOBPZCAEA-UHFFFAOYSA-N 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
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- 239000002562 thickening agent Substances 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
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- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/18—Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
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- H05K2201/01—Dielectrics
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- H05K2201/0278—Polymeric fibers
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Description
絶縁樹脂基材としては、従来からガラスクロスにエポキシ樹脂を含浸させた樹脂含浸基材が知られている(特許文献1参照)。
また、プリント配線板やパッケージ基板などの用途に利用しようと絶縁樹脂基材に導電層を付与する場合には、導電層と絶縁樹脂基材の線膨張率の差が大きいとICチップ実装時などの際に導電層を付与した絶縁樹脂基材に反りが発生することがあり、このような基板用途に利用される樹脂含浸基材には線膨張率が低い基材が求められていた。
本発明の目的は、高ハンダ耐熱性を有し且つ線膨張率の小さい樹脂含浸基材を提供することにある。
液晶性ポリエステルは、溶融時に光学異方性を示し、450℃以下の温度で異方性溶融体を形成するものであり、構造単位として以下の式(1)、(2)、(3)で示される構造単位を含み、式(1)で示される構造単位が30〜80モル%、式(2)で示される構造単位が35〜10モル%、式(3)で示される構造単位が35〜10モル%であることが好ましい。
(1) −O−Ar1−CO−
(2) −CO−Ar2−CO−
(3) ―X−Ar3−Y−
ここで、Ar1は、1,4−フェニレン、2,6−ナフタレン、または4,4‘−ビフェニレンを表わす。Ar2は、1,4−フェニレン、1,3−フェニレン、または2,6−ナフタレンを表わす。Ar3は、1,4−フェニレンまたは1,3−フェニレンを表わす。Xは−NH−であり、Yは、−O−または−NH−を表わす。
フェノール性水酸基のエステル形成性誘導体としては、例えば、エステル交換反応によりポリエステルを生成するように、フェノール性水酸基がカルボン酸類とエステルを形成しているものなどが挙げられる。
アミノ基のアミド形成性誘導体としては、例えば、アミド交換反応によりポリアミドを生成するように、アミノ基がカルボン酸類とアミドを形成しているものなどが挙げられる。
全構造単位に対して、構造単位(1)は30〜80モル%であることが好ましく、40〜70モル%であることがより好ましく、45〜65モル%であることがさらに好ましい。構造単位(1)が多いと溶媒への溶解性が著しく低下する傾向があり、少なすぎると液晶性を示さなくなる傾向がある。
全構造単位に対して、構造単位(2)は35〜10モル%であることが好ましく、30〜15モル%であることがより好ましく、27.5〜17.5モル%であることがさらに好ましい。構造単位(2)が多すぎると、液晶性が低下する傾向があり、少ないと溶媒への溶解性が低下する傾向がある。
全構造単位に対して、構造単位(3)は、35〜10モル%であることが好ましく、30〜15モル%であることがより好ましく、27.5〜17.5モル%であることがさらに好ましい。構造単位(3)が多すぎると、液晶性が低下する傾向があり、少ないと溶媒への溶解性が低下する傾向がある。
構造単位(3)は構造単位(2)と実質的に等量用いられることが好ましいが、構造単位(3)を構造単位(2)に対して、−10モル%〜+10モル%とすることにより、液晶性ポリエステルの重合度を制御することもできる。
これらの触媒の中で、N,N−ジメチルアミノピリジン、N−メチルイミダゾールなどの窒素原子を2個以上含む複素環状化合物が好ましく使用される(特開2002−146003号公報参照)。
該触媒は、通常、モノマー類の投入時に投入され、アシル化後も除去することは必ずしも必要ではなく、該触媒を除去しない場合にはそのままエステル交換を行なうことができる。
液晶性ポリエステルの製造は、例えば、回分装置、連続装置等を用いて行うことができる。
これらの中で、ハロゲン原子を含まない溶媒が環境への影響面から好ましく使用され、双極子モーメントが3以上5以下の溶媒が溶解性の観点から好ましく使用される。具体的には、N,N’−ジメチルホルムアミド、N,N’−ジメチルアセトアミド、テトラメチル尿素、N−メチルピロリドンなどのアミド系溶媒、またはγ−ブチロラクトンなどのラクトン系溶媒がより好ましく使用され、N,N‘−ジメチルホルムアミド、N,N’−ジメチルアセトアミド、またはN−メチルピロリドンがさらに好ましく使用される。
芳香族液晶ポリエステル繊維に使用することができる芳香族液晶ポリエステルとしては、特に限定するものではなく、芳香族ジオール、芳香族ジカルボン酸、芳香族ヒドロキシカルボン酸を単独、もしくは適宜組み合わせて重合したものを使用することができる。
得られた樹脂含浸基材には、必要に応じて、熱処理を行ってもよい。
積層の方法は、特に限定されないが、得られた樹脂含浸基材に他のシートやフィルム(膜)などを接着剤により接着させる方法、熱プレスにより熱融着させる方法などが挙げられる。
ここで、積層される他のシートやフィルム(膜)としては、例えば、金属膜、樹脂製フィルムなどが挙げられる。
片面または両面に導電層を有する導電層付樹脂含浸基材は、プリント配線基板やパッケージ基板として使用することができる。得られたプリント配線基板上には、導電層を保護する目的でカバーフィルムを更に積層してもよい。
(1)芳香族液晶ポリエステルの調製
攪拌装置、トルクメータ、窒素ガス導入管、温度計および還流冷却器を備えた反応器に、2−ヒドロキシ−6−ナフトエ酸 941g(5.0モル)、4−アミノフェノール 273g(2.5モル)、イソフタル酸 415.3g(2.5モル)および無水酢酸 1123g(11モル)を仕込んだ。反応器内を十分に窒素ガスで置換した後、窒素ガス気流下で15分かけて150℃まで昇温し、温度を保持して3時間還流させた。
その後、留出する副生酢酸および未反応の無水酢酸を留去しながら150分かけて300℃まで昇温し、トルクの上昇が認められる時点を反応終了とみなし、内容物を取り出した。取り出した内容物を室温まで冷却し、粗粉砕機で粉砕後、窒素雰囲気下200℃まで1時間で上昇し、その後250℃で3時間保持して固相で重合を進めた。得られた固形分を室温まで冷却し、粗粉砕機で粉砕後、窒素雰囲気下180℃まで1時間で上昇し、その後250℃で3時間保持し固相で重合を進め、液晶性ポリエステル粉末を得た。得られた樹脂は、偏光顕微鏡観察により370℃で液晶相特有のシュリーレン模様を示した。
上記工程により得られた液晶性ポリエステル粉末 8gをN−メチルピロリドン 92gに加え、160℃に加熱して溶解させた後、室温に冷却して芳香族液晶ポリエステル溶液を得た。
芳香族液晶ポリエステル繊維からなる不織布(クラレ製不織布HBBK22FX、厚み50μm)に、上記(2)で得た芳香族液晶ポリエステル溶液を含浸させ、ホットプレートにより設定温度100℃、1時間の条件で加熱して溶媒を蒸発させてシートを製造した。
得られた芳香族液晶ポリエステル樹脂含浸基材を、はんだ温度280℃のはんだ浴に1分間浸漬させ表面状態を観察した。該樹脂含浸基板は変形や膨れも見られなかった。
更に、得られた樹脂含浸基板について、理学製TMA装置により平面方向の線膨張率を評価したところ、平面方向の線膨張率は15ppm/℃(温度50〜100℃)であった。
エポキシ樹脂をガラスクロスに含浸させたシート(FR−4、日立化成製、厚み800μm)をはんだ温度280℃のはんだ浴に1分間浸漬させ表面状態を観察した。エポキシ樹脂含浸シートは一部が熱劣化しており基板自体の変形も見られた。HP製インピーダンスアナライザーを用いてこのエポキシ樹脂含浸シートの誘電正接を測定したところ0.012(1GHz)であった。
(1)芳香族液晶ポリエステルの調製
攪拌装置、トルクメータ、窒素ガス導入管、温度計および還流冷却器を備えた反応器に、2−ヒドロキシ−6−ナフトエ酸 128g(0.68モル)、4,4’−ジヒドロキシビフェニル 63.3g(0.34モル)、イソフタル酸 56.5g(0.34モル)および無水酢酸 152.7g(1.50モル)を仕込んだ。反応器内を十分に窒素ガスで置換した後、窒素ガス気流下で15分かけて150℃まで昇温し、温度を保持して3時間還流させた。
その後、留出する副生酢酸および未反応の無水酢酸を留去しながら170分かけて320℃まで昇温し、トルクの上昇が認められる時点を反応終了とみなし、内容物を取り出した。得られた固形分は室温まで冷却し、粗粉砕機で粉砕後、窒素雰囲気下250℃で3時間保持し、固層で重合反応を進めた。得られた粉末は350℃で偏光顕微鏡により液晶相に特有のシュリーレン模様が観察された。
上記工程により得られた芳香族液晶ポリエステル粉末 0.5gをp−クロロフェノール 9.5gに加え、120℃に加熱した結果、完全に溶解した溶液が得られた。
2−ヒドロキシ安息香酸と2−ヒドロキシ−6−ナフトエ酸とからなる芳香族液晶ポリエステル繊維(クラレ社製商品名ベクトラン、融点320℃、繊度1.7dtex、繊維長7mm)70重量部と、2−ヒドロキシ安息香酸と2−ヒドロキシ−6−ナフトエ酸とからなる芳香族液晶ポリエステル繊維(クラレ社製商品名ベクトラン、融点265℃、繊度2.8dtex、繊維長10mm)をリファイナーで叩解して得たカナダ標準型濾水度が300mlのパルプ状物30重量部とを、分散助剤とともにパルパーを用いて水中に分散させ、更に増粘剤を添加して均一なスラリーを調製した。このスラリーを傾斜型抄紙機を用いて湿式抄紙し、40.0g/m2の湿式不織布を得た。この湿式不織布に、170℃、線圧100kg/cmの熱カレンダー処理を施し、次いで、280℃で12時間焼成処理を施した。
この焼成処理後の芳香族液晶ポリエステル繊維からなる不織布に、上記(2)で得た芳香族ポリエステル溶液を含浸させ、ホットプレートにより設定温度100℃、1時間加熱して溶媒を蒸発させてシートを製造した。
その後、熱風式乾燥機により320℃、1時間熱処理を行い、厚み80μmの芳香族液晶ポリエステル樹脂含浸基材を得た。得られた芳香族液晶ポリエステル樹脂含浸基材を、はんだ温度280℃のはんだ浴に1分間浸漬させ表面状態を観察した。該樹脂含浸基板は変形や膨れも見られなかった。
更に、得られた樹脂含浸基板について、理学製TMA装置により平面方向の線膨張率を評価したところ、平面方向の線膨張率は90ppm/℃(温度50〜100℃)であった。
Claims (2)
- フェノール性水酸基を有する芳香族アミン由来の構造単位を全構造単位に対して10〜35モル%含む液晶性ポリエステルおよび非プロトン性溶媒からなる芳香族液晶ポリエステル溶液を、芳香族液晶ポリエステル繊維からなるシートに含浸せしめ、溶媒を除去する樹脂含浸基材の製造方法。
- 請求項1に記載の樹脂含浸基材の製造方法により樹脂含浸基材を得、その少なくとも片面に導電層を付与する導電層付樹脂含浸基材の製造方法。
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TW094118186A TW200613132A (en) | 2004-06-15 | 2005-06-02 | Resin-impregnated substrate |
US11/150,281 US7211528B2 (en) | 2004-06-15 | 2005-06-13 | Resin-impregnated substrate |
CNB2005100780358A CN100531512C (zh) | 2004-06-15 | 2005-06-13 | 浸渍有树脂的基片 |
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JP4479238B2 (ja) * | 2004-01-08 | 2010-06-09 | 住友化学株式会社 | 樹脂含浸基材 |
JP4665475B2 (ja) * | 2004-09-30 | 2011-04-06 | 住友化学株式会社 | 芳香族液晶ポリエステルフィルム |
US7816014B2 (en) * | 2005-01-18 | 2010-10-19 | Sumitomo Chemical Company, Limited | Liquid crystalline polyester and film using the same |
TWI428241B (zh) * | 2005-10-26 | 2014-03-01 | Sumitomo Chemical Co | 經浸漬樹脂之底板及其製造方法 |
JP5168928B2 (ja) * | 2006-02-21 | 2013-03-27 | 東レ株式会社 | 一体化成形品 |
JP2010114427A (ja) * | 2008-10-08 | 2010-05-20 | Sumitomo Chemical Co Ltd | チップ型ledパッケージ用基板 |
KR20110104445A (ko) * | 2010-03-16 | 2011-09-22 | 스미또모 가가꾸 가부시끼가이샤 | 액정 폴리에스테르 함침 섬유 시트의 제조 방법 |
JP2012092214A (ja) * | 2010-10-27 | 2012-05-17 | Sumitomo Chemical Co Ltd | 液晶ポリエステル液状組成物 |
JP5680426B2 (ja) * | 2011-01-17 | 2015-03-04 | 住友化学株式会社 | 液晶ポリエステル含有液状組成物 |
US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
WO2016003588A1 (en) | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
CN111155224A (zh) * | 2020-02-17 | 2020-05-15 | 上海市纺织科学研究院有限公司 | 一种聚芳酯纤维基自润滑织物的制备方法 |
CN114536924A (zh) * | 2022-01-17 | 2022-05-27 | 宁波海格拉新材料科技有限公司 | 一种阻燃低吸湿液晶聚芳酯蜂窝芯材及其制备方法 |
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JPS61236826A (ja) * | 1985-04-13 | 1986-10-22 | Kuraray Co Ltd | 全芳香族ポリエステルアミドの製法 |
JPH01229870A (ja) * | 1988-03-02 | 1989-09-13 | Toray Ind Inc | 高強度耐熱布帛及びその製法 |
JP2527181Y2 (ja) * | 1990-10-31 | 1997-02-26 | 株式会社クラレ | 積層体 |
JP3275009B2 (ja) | 1991-07-02 | 2002-04-15 | 三菱レイヨン株式会社 | プリプレグ |
US5646209A (en) * | 1994-05-20 | 1997-07-08 | Sumitomo Chemical Company, Limited | Thermoplastic resin composition comprising liquid crystalline polyester, aromatic polycarbonate and glass fiber |
JP4017769B2 (ja) * | 1997-10-07 | 2007-12-05 | 株式会社クラレ | プリント配線基板基材およびその製造方法 |
JP4470390B2 (ja) * | 2003-04-17 | 2010-06-02 | 住友化学株式会社 | 液晶性ポリエステル溶液組成物 |
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KR20060049198A (ko) | 2006-05-18 |
TW200613132A (en) | 2006-05-01 |
CN100531512C (zh) | 2009-08-19 |
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