JP4479238B2 - 樹脂含浸基材 - Google Patents
樹脂含浸基材 Download PDFInfo
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- JP4479238B2 JP4479238B2 JP2004002704A JP2004002704A JP4479238B2 JP 4479238 B2 JP4479238 B2 JP 4479238B2 JP 2004002704 A JP2004002704 A JP 2004002704A JP 2004002704 A JP2004002704 A JP 2004002704A JP 4479238 B2 JP4479238 B2 JP 4479238B2
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- resin
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- crystal polyester
- aromatic liquid
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
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- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K5/00—Plug valves; Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary
- F16K5/04—Plug valves; Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary with plugs having cylindrical surfaces; Packings therefor
- F16K5/0442—Spindles and actuating means
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
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- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
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- D06N3/00—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof
- D06N3/12—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof with macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. gelatine proteins
- D06N3/121—Artificial leather, oilcloth or other material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof with macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. gelatine proteins with polyesters, polycarbonates, alkyds
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- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
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- D21H13/24—Polyesters
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
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- D21H17/20—Macromolecular organic compounds
- D21H17/33—Synthetic macromolecular compounds
- D21H17/46—Synthetic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H17/53—Polyethers; Polyesters
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- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/44—Mechanical actuating means
- F16K31/60—Handles
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- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K5/00—Plug valves; Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary
- F16K5/08—Details
- F16K5/10—Means for additional adjustment of the rate of flow
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B2457/08—PCBs, i.e. printed circuit boards
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
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- H05K2201/0141—Liquid crystal polymer [LCP]
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2418—Coating or impregnation increases electrical conductivity or anti-static quality
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
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Description
絶縁樹脂基材としては、従来からガラスクロスにエポキシ樹脂を含浸させた樹脂含浸基材が知られている(特許文献1参照)。
しかしながら、近年のハンダ鉛フリー化に伴うハンダ付け温度の高温化(260℃以上)が進められつつあるところ、ガラスクロスにエポキシ樹脂を含浸させた樹脂含浸基材では耐熱性が不十分であり、260℃以上のハンダ浴に浸漬すると、エポキシ樹脂が熱劣化して樹脂含浸基材が変形するという問題が起きる場合があった(特許文献1参照)。
本発明の樹脂含浸基材は、芳香族液晶ポリエステル溶液を芳香族液晶ポリエステル繊維からなるシートに含浸せしめ、溶媒を除去して得られる。
本発明で使用される芳香族液晶ポリエステルは、サーモトロピック液晶ポリマーと呼ばれるポリエステルであり、450℃以下の温度で光学的に異方性を示す溶融体を形成するものである。
(1)芳香族ヒドロキシカルボン酸、芳香族ジカルボン酸および芳香族ジオールの組み合わせを重合して得られるもの、
(2)異種の芳香族ヒドロキシカルボン酸を重合して得られるもの、
(3)芳香族ジカルボン酸と芳香族ジオールとの組み合わせを重合して得られるもの、
(4)ポリエチレンテレフタレートなどの結晶性ポリエステルに芳香族ヒドロキシカルボン酸を反応させたもの
などが挙げられる。
なお、これらの芳香族ヒドロキシカルボン酸、芳香族ジカルボン酸または芳香族ジオールの代わりに、それらのエステル形成性誘導体を使用してもよい。
また、フェノール性水酸基のエステル形成性誘導体としては、例えば、エステル交換反応によりポリエステルを生成するように、フェノール性水酸基がカルボン酸類とエステルを形成しているものなどが挙げられる。
繰り返し構造単位の好ましい組み合わせとしては、例えば、下記(a)〜(f)が挙げられる。
(a):
前記繰り返し構造単位(A1)、(B2)および(C3)の組み合わせ、
前記繰り返し構造単位(A2)、(B2)および(C3)の組み合わせ、
前記繰り返し構造単位(A1)、(B1)、(B2)および(C3)の組み合わせ、または、
前記繰り返し構造単位(A2)、(B1)、(B2)および(C3)の組み合わせ。
(b):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C1)に置換した組み合わせ。
(c):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C2)に置換した組み合わせ。
(d):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C4)に置換した組み合わせ。
(e):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C4)と(C5)の混合物に置換した組み合わせ。
(f):前記(a)の組み合わせのそれぞれにおいて、(A1)の一部を(A2)に置換した組み合わせ。
芳香族液晶ポリエステルの製造は、例えば、回分装置、連続装置等を用いて行うことができる。
式中、Aはハロゲン原子またはトリハロゲン化メチル基を表わし、iはAの個数であって1〜5の整数を表わす。iが2以上の場合、複数あるAは互いに同一でも異なっていてもよいが、同一であることが好ましい。
iは好ましくは1〜3であり、より好ましくは1または2である。iが1のときのAの置換位置は4位であることが好ましく、iが2以上のとき少なくとも一つのAの置換位置は4位であることが好ましい(水酸基の置換位置を1位とする)。
ハロゲン原子がフッ素原子である一般式(I)で示されるハロゲン置換フェノール化合物の例としては、ペンタフルオロフェノール、テトラフルオロフェノール等が挙げられる。
ハロゲン原子が塩素原子である一般式(I)で示されるハロゲン置換フェノール化合物の例としては、o−クロロフェノール、p−クロロフェノールが挙げられ、溶解性の観点からp−クロロフェノールが好ましい。
トリハロゲン化メチル基のハロゲンとしては、フッ素原子、塩素原子、臭素原子、よう素原子が挙げられる。
トリハロゲン化メチル基のハロゲンがフッ素原子である一般式(I)で示されるハロゲン置換フェノール化合物の例としては、3,5−ビストリフルオロメチルフェノールが挙げられる。
含有していてもよい他の成分は、特に限定されるものではないが、例えば、クロロホルム、塩化メチレン、テトラクロロエタン等の塩素系化合物などが挙げられる。
芳香族液晶ポリエステル繊維に使用することができる芳香族ポリエステル樹脂としては、特に限定するものではなく、上記芳香族ポリエステル溶液で記載したように、芳香族ジオール、芳香族ジカルボン酸、芳香族ヒドロキシカルボン酸を単独、もしくは適宜組み合わせて重合したものを使用することができる。
得られた樹脂含浸基材には、必要に応じて、熱処理を行ってもよい。
積層の方法は、特に限定されないが、得られた樹脂含浸基材に他のシートやフィルム(膜)などを接着剤により接着させる方法、熱プレスにより熱融着させる方法などが挙げられる。
ここで、積層される他のシートやフィルム(膜)としては、例えば、金属膜、樹脂製フィルムなどが挙げられる。
片面または両面に導電層を有する導電層付樹脂含浸基材は、プリント配線基板等として使用することができる。得られたプリント配線基板上には、導電層を保護する目的でカバーフィルムを更に積層してもよい。
(1)芳香族液晶ポリエステルの調製
攪拌装置、トルクメータ、窒素ガス導入管、温度計および還流冷却器を備えた反応器に、2−ヒドロキシ−6−ナフトエ酸 128g(0.68モル)、4,4’−ジヒドロキシビフェニル 63.3g(0.34モル)、イソフタル酸 56.5g(0.34モル)および無水酢酸 152.7g(1.50モル)を仕込んだ。反応器内を十分に窒素ガスで置換した後、窒素ガス気流下で15分かけて150℃まで昇温し、温度を保持して3時間還流させた。
その後、留出する副生酢酸および未反応の無水酢酸を留去しながら170分かけて320℃まで昇温し、トルクの上昇が認められる時点を反応終了とみなし、内容物を取り出した。得られた固形分は室温まで冷却し、粗粉砕機で粉砕後、窒素雰囲気下250℃で3時間保持し、固層で重合反応を進めた。得られた粉末は350℃で偏向顕微鏡により液晶相に特有のシュリーレン模様が観察された。
また、HPインピーダンスアナライザーを用いて誘電正接を測定したところ、0.0010(1GHz)であった。
上記工程により得られた芳香族液晶ポリエステル粉末 0.5gをp−クロロフェノール 9.5gに加え、120℃に加熱した結果、完全に溶解した溶液が得られた。
2−ヒドロキシ安息香酸と2−ヒドロキシ−6−ナフトエ酸とからなる芳香族液晶ポリエステル繊維(クラレ社製商品名ベクトラン、融点320℃、繊度1.7dtex、繊維長7mm)70重量部と、2−ヒドロキシ安息香酸と2−ヒドロキシ−6−ナフトエ酸とからなる芳香族液晶ポリエステル繊維(クラレ社製商品名ベクトラン、融点265℃、繊度2.8dtex、繊維長10mm)をリファイナーで叩解して得たカナダ標準型濾水度が300mlのパルプ状物30重量部とを、分散助剤とともにパルパーを用いて水中に分散させ、更に増粘剤を添加して均一なスラリーを調製した。このスラリーを傾斜型抄紙機を用いて湿式抄紙し、40.0g/m2の湿式不織布を得た。この湿式不織布に、170℃、線圧100kg/cmの熱カレンダー処理を施し、次いで、280℃で12時間焼成処理を施した。
この焼成処理後の芳香族液晶ポリエステル繊維からなる不織布に、上記(2)で得た芳香族ポリエステル溶液を含浸させ、ホットプレートにより設定温度100℃、1時間加熱して溶媒を蒸発させてシートを製造した。当該シートについて、HPインピーダンスアナライザーを用いて誘電正接を測定したところ、0.0016(1GHz)であった。
該樹脂含浸基板について、HPインピーダンスアナライザーを用いて誘電正接を測定したところ、0.0005(1GHz)であった。
エポキシ樹脂をガラスクロスに含浸させたシート(FR−4、日立化成製、厚み800μ)をはんだ温度280℃のはんだ浴に1分間浸漬させ表面状態を観察した。エポキシ樹脂含浸シートは一部が熱劣化しており基板自体の変形も見られた。また、また、HPインピーダンスアナライザーを用いて誘電正接を測定したところ、0.012(1GHz)であった。
Claims (4)
- 芳香族液晶ポリエステル繊維からなるシートが不織布である請求項1記載の樹脂含浸基材の製造方法。
- 請求項1または2記載の樹脂含浸基材の製造方法により樹脂含浸基材を製造し、その少なくとも片面に導電層を形成する、導電層付樹脂含浸基材の製造方法。
- 導電層付樹脂含浸基材がプリント配線基板用である請求項3記載の導電層付樹脂含浸基材の製造方法。
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JP2004002704A JP4479238B2 (ja) | 2004-01-08 | 2004-01-08 | 樹脂含浸基材 |
TW93140440A TWI386431B (zh) | 2004-01-08 | 2004-12-24 | 浸漬樹脂的基板及其製造方法 |
CNB2005100002281A CN100499959C (zh) | 2004-01-08 | 2005-01-05 | 浸渍树脂的基板 |
US11/028,654 US7211527B2 (en) | 2004-01-08 | 2005-01-05 | Resin-impregnated substrate |
KR1020050001200A KR101102289B1 (ko) | 2004-01-08 | 2005-01-06 | 수지-함침 기재 |
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US7176421B2 (en) * | 2004-03-05 | 2007-02-13 | Transdigm Inc. | Straight ribbon heater |
JP2010114427A (ja) * | 2008-10-08 | 2010-05-20 | Sumitomo Chemical Co Ltd | チップ型ledパッケージ用基板 |
JP2011141535A (ja) * | 2009-12-10 | 2011-07-21 | Sumitomo Chemical Co Ltd | ラベル |
KR20110104445A (ko) * | 2010-03-16 | 2011-09-22 | 스미또모 가가꾸 가부시끼가이샤 | 액정 폴리에스테르 함침 섬유 시트의 제조 방법 |
JP2012116906A (ja) * | 2010-11-30 | 2012-06-21 | Sumitomo Chemical Co Ltd | 樹脂含浸シート及び導電層付き樹脂含浸シート |
US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
JP6094160B2 (ja) * | 2012-11-13 | 2017-03-15 | 三菱瓦斯化学株式会社 | 金属張積層板及びその製造方法並びにプリント配線板 |
WO2016003588A1 (en) | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
JP7529450B2 (ja) | 2020-06-12 | 2024-08-06 | 日鉄ケミカル&マテリアル株式会社 | 樹脂フィルム、その製造方法、金属張積層板及びプリント配線板 |
WO2022260085A1 (ja) * | 2021-06-09 | 2022-12-15 | 株式会社村田製作所 | 多孔質樹脂シート、金属層付き多孔質樹脂シート、電子回路基板、多孔質樹脂シートの製造方法、金属層付き多孔質樹脂シートの製造方法、及び、電子回路基板の製造方法 |
CN114836087B (zh) * | 2022-03-09 | 2023-07-25 | 安丹达工业技术(上海)有限公司 | 用于pvc膜和tpu膜间焊接的组合物及制法和焊接方法 |
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US5646209A (en) * | 1994-05-20 | 1997-07-08 | Sumitomo Chemical Company, Limited | Thermoplastic resin composition comprising liquid crystalline polyester, aromatic polycarbonate and glass fiber |
US6229096B1 (en) * | 1997-10-07 | 2001-05-08 | Mitsubishi Gas Chemical Company, Inc. | Nonwoven reinforcement for printed wiring base board and process for producing the same |
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KR20050073556A (ko) | 2005-07-14 |
TW200523290A (en) | 2005-07-16 |
CN1638601A (zh) | 2005-07-13 |
US20050181692A1 (en) | 2005-08-18 |
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