JP5069857B2 - 樹脂用改質剤及びこれを用いた樹脂組成物、成形品 - Google Patents

樹脂用改質剤及びこれを用いた樹脂組成物、成形品 Download PDF

Info

Publication number
JP5069857B2
JP5069857B2 JP2005518005A JP2005518005A JP5069857B2 JP 5069857 B2 JP5069857 B2 JP 5069857B2 JP 2005518005 A JP2005518005 A JP 2005518005A JP 2005518005 A JP2005518005 A JP 2005518005A JP 5069857 B2 JP5069857 B2 JP 5069857B2
Authority
JP
Japan
Prior art keywords
resin
modifier
parts
latex
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005518005A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2005078013A1 (ja
Inventor
常希 脇田
敬治 中村
英顯 牧野
正宏 大須賀
陽平 三輪
康敬 土井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp, Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Chemical Corp
Priority to JP2005518005A priority Critical patent/JP5069857B2/ja
Publication of JPWO2005078013A1 publication Critical patent/JPWO2005078013A1/ja
Application granted granted Critical
Publication of JP5069857B2 publication Critical patent/JP5069857B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
JP2005518005A 2004-02-16 2005-02-15 樹脂用改質剤及びこれを用いた樹脂組成物、成形品 Expired - Fee Related JP5069857B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005518005A JP5069857B2 (ja) 2004-02-16 2005-02-15 樹脂用改質剤及びこれを用いた樹脂組成物、成形品

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2004037784 2004-02-16
JP2004037784 2004-02-16
JP2004110913 2004-04-05
JP2004110913 2004-04-05
JP2005518005A JP5069857B2 (ja) 2004-02-16 2005-02-15 樹脂用改質剤及びこれを用いた樹脂組成物、成形品
PCT/JP2005/002210 WO2005078013A1 (ja) 2004-02-16 2005-02-15 樹脂用改質剤及びこれを用いた樹脂組成物、成形品

Publications (2)

Publication Number Publication Date
JPWO2005078013A1 JPWO2005078013A1 (ja) 2007-10-18
JP5069857B2 true JP5069857B2 (ja) 2012-11-07

Family

ID=34863470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005518005A Expired - Fee Related JP5069857B2 (ja) 2004-02-16 2005-02-15 樹脂用改質剤及びこれを用いた樹脂組成物、成形品

Country Status (7)

Country Link
US (2) US20070191542A1 (https=)
EP (1) EP1724299B1 (https=)
JP (1) JP5069857B2 (https=)
KR (1) KR100805505B1 (https=)
CN (1) CN1930226B (https=)
TW (1) TW200536892A (https=)
WO (1) WO2005078013A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003224509A1 (en) * 2002-04-25 2003-11-10 Neville Chemical Europe B.V. Improved modifiers for coatings, adhesives or sealants
JP4878129B2 (ja) * 2005-06-29 2012-02-15 三菱レイヨン株式会社 樹脂用改質剤ならびにこれを用いた樹脂組成物、成形品
KR100838731B1 (ko) * 2006-12-20 2008-06-16 주식회사 포스코 고체전해질연료전지용 밀봉재의 제조방법
JP5236892B2 (ja) * 2007-04-20 2013-07-17 三菱レイヨン株式会社 重合体粉体の製造方法
CN102040804B (zh) * 2010-11-19 2013-02-13 明基材料有限公司 环氧树脂组成物
JP5971609B2 (ja) * 2011-10-28 2016-08-17 三菱レイヨン株式会社 硬化性樹脂組成物及びこれを硬化した硬化物
CN102675803A (zh) * 2012-05-23 2012-09-19 苏健 纳米高分子复合材料交通线路标志
EP3004368B1 (en) 2013-05-29 2019-09-18 F.Hoffmann-La Roche Ag Quantitative control of sialylation
KR101638240B1 (ko) * 2013-09-30 2016-07-08 주식회사 엘지화학 고무질 중합체, 그라프트 공중합체와 이들의 제조방법, 내충격 내열수지 조성물
FR3031109B1 (fr) * 2014-12-24 2018-08-17 Arkema France Composition de polymeres, son procede de preparation, son utilisation et composition la comprenant
FR3031108B1 (fr) * 2014-12-24 2018-08-17 Arkema France Composition comprenant un polymere a phases multiples, son procede de preparation et son utlisation
KR102024138B1 (ko) * 2015-07-23 2019-09-23 주식회사 엘지화학 충격보강제, 이의 제조 방법 및 이를 포함하는 폴리유산/폴리카보네이트 수지 조성물
CN105462429B (zh) * 2015-12-11 2017-12-05 六安科瑞达新型材料有限公司 一种改性固体环氧基丙烯酸树脂及其制备方法
WO2020196923A1 (ja) * 2019-03-28 2020-10-01 株式会社カネカ 粉粒体の製造方法および粉粒体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222825A (ja) * 1985-07-23 1987-01-31 Toshiba Chem Corp 封止用樹脂組成物
JPS641731A (en) * 1987-06-06 1989-01-06 Roehm Gmbh Spray dried and emulsified polymer, its preparation, pct-processing assistant consisting thereof and molding material contg. the same
JPH1135873A (ja) * 1997-07-23 1999-02-09 Shindaiichi Enbi Kk ペースト加工用塩化ビニル系樹脂顆粒およびその製造方法
JP2000007890A (ja) * 1998-04-23 2000-01-11 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびその製法ならびに半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3988393A (en) * 1970-12-23 1976-10-26 Stauffer Chemical Company Rigid plastic admixed with crosslinked acrylate/vinyl chloride interpolymer
TW241270B (https=) * 1991-08-13 1995-02-21 Rohm & Haas
JP3597590B2 (ja) * 1994-03-25 2004-12-08 旭化成ケミカルズ株式会社 グラフト重合体粒子及び該重合体粒子を含むゴム強化熱可塑性樹脂組成物
DE69940166D1 (de) * 1998-07-01 2009-02-05 Mitsubishi Rayon Co Feinteilige acrylpolymere und diese enthaltende plastisole
JP3621918B2 (ja) 1998-07-01 2005-02-23 三菱レイヨン株式会社 アクリル系重合体微粒子の製造方法
JP3376283B2 (ja) * 1998-07-14 2003-02-10 三菱レイヨン株式会社 アクリルゴム系衝撃強度改質剤およびこれを用いた硬質塩化ビニル系樹脂組成物
EP0985692B1 (en) * 1998-09-09 2005-01-19 Rohm And Haas Company Improved MBS impact modifier
JP2002053729A (ja) * 2000-08-04 2002-02-19 Kanegafuchi Chem Ind Co Ltd 耐ブロッキング性の改良された耐衝撃性改良剤
JP2001329067A (ja) * 2000-05-19 2001-11-27 Mitsubishi Rayon Co Ltd アクリル系重合体の製造方法
TWI231305B (en) * 2000-10-25 2005-04-21 Rohm & Haas High rubber impact modifier powders
JP5142430B2 (ja) * 2001-06-26 2013-02-13 日本合成化学工業株式会社 再分散性合成樹脂粉末およびその用途
JP2003026890A (ja) 2001-07-16 2003-01-29 Nippon A & L Kk 熱可塑性樹脂組成物
EP1440988A4 (en) * 2001-08-31 2005-08-31 Kaneka Corp POLYOLEFINPROPOPOPOLYMER MADE IN THE PRESENCE OF A COORDINATION POLYMERIZATION CATALYST BASED ON A COMPLEX OF A LATE TRANSITION METAL AND METHOD FOR THE PRODUCTION THEREOF
CN100427543C (zh) * 2003-01-21 2008-10-22 株式会社可乐丽 丙烯酸类聚合物粉末、丙烯酸溶胶以及成形物
JP2004231916A (ja) * 2003-02-03 2004-08-19 Kansai Paint Co Ltd 易水分散性樹脂粉末の製造方法
TW200513492A (en) * 2003-05-14 2005-04-16 Mitsubishi Rayon Co Rubber containing graft copolymer mixed resin powder and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222825A (ja) * 1985-07-23 1987-01-31 Toshiba Chem Corp 封止用樹脂組成物
JPS641731A (en) * 1987-06-06 1989-01-06 Roehm Gmbh Spray dried and emulsified polymer, its preparation, pct-processing assistant consisting thereof and molding material contg. the same
JPH1135873A (ja) * 1997-07-23 1999-02-09 Shindaiichi Enbi Kk ペースト加工用塩化ビニル系樹脂顆粒およびその製造方法
JP2000007890A (ja) * 1998-04-23 2000-01-11 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびその製法ならびに半導体装置

Also Published As

Publication number Publication date
EP1724299A1 (en) 2006-11-22
US20140206817A1 (en) 2014-07-24
EP1724299A4 (en) 2007-03-14
KR100805505B1 (ko) 2008-02-20
CN1930226B (zh) 2011-05-18
US20070191542A1 (en) 2007-08-16
TW200536892A (en) 2005-11-16
KR20060129462A (ko) 2006-12-15
US9206310B2 (en) 2015-12-08
TWI372163B (https=) 2012-09-11
WO2005078013A1 (ja) 2005-08-25
CN1930226A (zh) 2007-03-14
JPWO2005078013A1 (ja) 2007-10-18
EP1724299B1 (en) 2011-05-18

Similar Documents

Publication Publication Date Title
US9206310B2 (en) Modifier for resin and resin composition using the same and formed article
JP5433421B2 (ja) シリコーン系重合体含有ビニル重合体の粉体及びその製造方法、樹脂組成物並びに成形体
JP2006104328A (ja) 熱硬化性樹脂組成物およびその用途
JP6302207B2 (ja) 車両用部材の製造方法
CN116635229B (zh) 固化性树脂组合物及粘接剂
JP5248029B2 (ja) グラフト共重合体及び樹脂組成物
CN1781961A (zh) 接枝共聚物和含有它的抗冲、阻燃树脂组合物
CN1227292C (zh) 阻燃剂、生产它的方法、和包含它的阻燃剂树脂组合物
JPWO2010104055A1 (ja) （メタ）アクリレート系重合体、樹脂組成物及び成形体
JP5971609B2 (ja) 硬化性樹脂組成物及びこれを硬化した硬化物
JP5593614B2 (ja) グラフト共重合体、それを含有する樹脂組成物及び成形体
CN1950413A (zh) 共聚物、接枝共聚物、接枝共聚物粒子、阻燃剂、以及树脂组合物
JP5254816B2 (ja) ポリカーボネート樹脂組成物、成形体の製造方法
JP4112421B2 (ja) グラフト共重合体およびこれを用いた熱可塑性樹脂組成物
JP4878129B2 (ja) 樹脂用改質剤ならびにこれを用いた樹脂組成物、成形品
JP3200218B2 (ja) グラフト共重合体及びその製法
JP6009727B2 (ja) 重合体粒子含有分散体及び重合体粒子含有樹脂組成物の製造方法
JP2010059245A (ja) グラフト共重合体、これを含有する樹脂組成物及び成形体
JP4942352B2 (ja) 塩素含有熱可塑性樹脂組成物
JP2005290063A (ja) 非水系塗料用垂れ防止剤
JPH04255748A (ja) ポリメタクリルイミド樹脂組成物
JP2006335877A (ja) 樹脂組成物、その製造方法および成形品
JP2013095860A (ja) 硬化性樹脂用応力緩和剤、硬化性樹脂組成物及び成形体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080212

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111213

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120202

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120807

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120820

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150824

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 5069857

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150824

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150824

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees