JP5022375B2 - トレイ搬送装置及びそれを備えた電子部品試験装置 - Google Patents

トレイ搬送装置及びそれを備えた電子部品試験装置 Download PDF

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Publication number
JP5022375B2
JP5022375B2 JP2008538542A JP2008538542A JP5022375B2 JP 5022375 B2 JP5022375 B2 JP 5022375B2 JP 2008538542 A JP2008538542 A JP 2008538542A JP 2008538542 A JP2008538542 A JP 2008538542A JP 5022375 B2 JP5022375 B2 JP 5022375B2
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JP
Japan
Prior art keywords
tray
holding
test
electronic component
movable
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Expired - Fee Related
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JP2008538542A
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English (en)
Japanese (ja)
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JPWO2008044305A1 (ja
Inventor
裕史 金子
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Advantest Corp
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Advantest Corp
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Publication of JPWO2008044305A1 publication Critical patent/JPWO2008044305A1/ja
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Publication of JP5022375B2 publication Critical patent/JP5022375B2/ja
Expired - Fee Related legal-status Critical Current
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2008538542A 2006-10-12 2006-10-12 トレイ搬送装置及びそれを備えた電子部品試験装置 Expired - Fee Related JP5022375B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/320401 WO2008044305A1 (fr) 2006-10-12 2006-10-12 Appareil de transfert de plateau et appareil de test de composant électronique doté de cet appareil de transfert de plateau

Publications (2)

Publication Number Publication Date
JPWO2008044305A1 JPWO2008044305A1 (ja) 2010-02-04
JP5022375B2 true JP5022375B2 (ja) 2012-09-12

Family

ID=39282516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008538542A Expired - Fee Related JP5022375B2 (ja) 2006-10-12 2006-10-12 トレイ搬送装置及びそれを備えた電子部品試験装置

Country Status (4)

Country Link
JP (1) JP5022375B2 (ko)
KR (1) KR101104291B1 (ko)
TW (1) TW200834097A (ko)
WO (1) WO2008044305A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101040308B1 (ko) 2008-10-24 2011-06-10 세크론 주식회사 트레이 이송 장치
KR101334765B1 (ko) * 2012-04-18 2013-11-29 미래산업 주식회사 반도체 소자 핸들링 시스템
KR102231407B1 (ko) * 2014-11-07 2021-03-25 (주)테크윙 전자부품 분류 장비
KR102631908B1 (ko) * 2018-08-21 2024-01-31 (주)테크윙 핸들러 및 이를 포함하는 오토메이션 시스템
JP3227434U (ja) 2020-03-12 2020-08-27 株式会社アドバンテスト 電子部品ハンドリング装置及び電子部品試験装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297791A (ja) * 1998-04-14 1999-10-29 Advantest Corp トレイ移送アーム及びこれを用いたトレイの移載装置、ic試験装置並びにトレイの取り廻し方法
WO2004106945A2 (ja) * 2003-05-30 2004-12-09 Advantest Corp 電子部品試験装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100206644B1 (ko) * 1994-09-22 1999-07-01 오우라 히로시 반도체 디바이스의 자동검사장치 및 방법
JP4041594B2 (ja) * 1998-09-02 2008-01-30 株式会社アドバンテスト 部品試験装置およびチャンバ入り口の開閉方法
JP2005062090A (ja) 2003-08-19 2005-03-10 Renesas Technology Corp 半導体検査装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297791A (ja) * 1998-04-14 1999-10-29 Advantest Corp トレイ移送アーム及びこれを用いたトレイの移載装置、ic試験装置並びにトレイの取り廻し方法
WO2004106945A2 (ja) * 2003-05-30 2004-12-09 Advantest Corp 電子部品試験装置

Also Published As

Publication number Publication date
TW200834097A (en) 2008-08-16
JPWO2008044305A1 (ja) 2010-02-04
WO2008044305A1 (fr) 2008-04-17
TWI356908B (ko) 2012-01-21
KR101104291B1 (ko) 2012-01-12
KR20090086956A (ko) 2009-08-14

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