JP5022375B2 - トレイ搬送装置及びそれを備えた電子部品試験装置 - Google Patents
トレイ搬送装置及びそれを備えた電子部品試験装置 Download PDFInfo
- Publication number
- JP5022375B2 JP5022375B2 JP2008538542A JP2008538542A JP5022375B2 JP 5022375 B2 JP5022375 B2 JP 5022375B2 JP 2008538542 A JP2008538542 A JP 2008538542A JP 2008538542 A JP2008538542 A JP 2008538542A JP 5022375 B2 JP5022375 B2 JP 5022375B2
- Authority
- JP
- Japan
- Prior art keywords
- tray
- holding
- test
- electronic component
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 title claims description 174
- 238000012546 transfer Methods 0.000 title claims description 63
- 238000003860 storage Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 description 32
- 238000010586 diagram Methods 0.000 description 28
- 101000798007 Homo sapiens RAC-gamma serine/threonine-protein kinase Proteins 0.000 description 10
- 102100032314 RAC-gamma serine/threonine-protein kinase Human genes 0.000 description 10
- 230000002950 deficient Effects 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 8
- 239000002243 precursor Substances 0.000 description 5
- 230000008642 heat stress Effects 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 102100032306 Aurora kinase B Human genes 0.000 description 1
- 108090000749 Aurora kinase B Proteins 0.000 description 1
- 101100258024 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) stk-4 gene Proteins 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/320401 WO2008044305A1 (fr) | 2006-10-12 | 2006-10-12 | Appareil de transfert de plateau et appareil de test de composant électronique doté de cet appareil de transfert de plateau |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008044305A1 JPWO2008044305A1 (ja) | 2010-02-04 |
JP5022375B2 true JP5022375B2 (ja) | 2012-09-12 |
Family
ID=39282516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008538542A Expired - Fee Related JP5022375B2 (ja) | 2006-10-12 | 2006-10-12 | トレイ搬送装置及びそれを備えた電子部品試験装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5022375B2 (ko) |
KR (1) | KR101104291B1 (ko) |
TW (1) | TW200834097A (ko) |
WO (1) | WO2008044305A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101040308B1 (ko) | 2008-10-24 | 2011-06-10 | 세크론 주식회사 | 트레이 이송 장치 |
KR101334765B1 (ko) * | 2012-04-18 | 2013-11-29 | 미래산업 주식회사 | 반도체 소자 핸들링 시스템 |
KR102231407B1 (ko) * | 2014-11-07 | 2021-03-25 | (주)테크윙 | 전자부품 분류 장비 |
KR102631908B1 (ko) * | 2018-08-21 | 2024-01-31 | (주)테크윙 | 핸들러 및 이를 포함하는 오토메이션 시스템 |
JP3227434U (ja) | 2020-03-12 | 2020-08-27 | 株式会社アドバンテスト | 電子部品ハンドリング装置及び電子部品試験装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11297791A (ja) * | 1998-04-14 | 1999-10-29 | Advantest Corp | トレイ移送アーム及びこれを用いたトレイの移載装置、ic試験装置並びにトレイの取り廻し方法 |
WO2004106945A2 (ja) * | 2003-05-30 | 2004-12-09 | Advantest Corp | 電子部品試験装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100206644B1 (ko) * | 1994-09-22 | 1999-07-01 | 오우라 히로시 | 반도체 디바이스의 자동검사장치 및 방법 |
JP4041594B2 (ja) * | 1998-09-02 | 2008-01-30 | 株式会社アドバンテスト | 部品試験装置およびチャンバ入り口の開閉方法 |
JP2005062090A (ja) | 2003-08-19 | 2005-03-10 | Renesas Technology Corp | 半導体検査装置 |
-
2006
- 2006-10-12 JP JP2008538542A patent/JP5022375B2/ja not_active Expired - Fee Related
- 2006-10-12 KR KR1020097008270A patent/KR101104291B1/ko active IP Right Grant
- 2006-10-12 WO PCT/JP2006/320401 patent/WO2008044305A1/ja active Application Filing
-
2007
- 2007-09-17 TW TW096134691A patent/TW200834097A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11297791A (ja) * | 1998-04-14 | 1999-10-29 | Advantest Corp | トレイ移送アーム及びこれを用いたトレイの移載装置、ic試験装置並びにトレイの取り廻し方法 |
WO2004106945A2 (ja) * | 2003-05-30 | 2004-12-09 | Advantest Corp | 電子部品試験装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200834097A (en) | 2008-08-16 |
JPWO2008044305A1 (ja) | 2010-02-04 |
WO2008044305A1 (fr) | 2008-04-17 |
TWI356908B (ko) | 2012-01-21 |
KR101104291B1 (ko) | 2012-01-12 |
KR20090086956A (ko) | 2009-08-14 |
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