JP5016892B2 - 検査装置及び検査方法 - Google Patents

検査装置及び検査方法 Download PDF

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Publication number
JP5016892B2
JP5016892B2 JP2006283015A JP2006283015A JP5016892B2 JP 5016892 B2 JP5016892 B2 JP 5016892B2 JP 2006283015 A JP2006283015 A JP 2006283015A JP 2006283015 A JP2006283015 A JP 2006283015A JP 5016892 B2 JP5016892 B2 JP 5016892B2
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JP
Japan
Prior art keywords
chip
probe pin
inspection
metal film
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006283015A
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English (en)
Japanese (ja)
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JP2008101944A (ja
JP2008101944A5 (enExample
Inventor
茂和 小松
光義 宮園
和也 浅岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Toyota Motor Corp
Original Assignee
Tokyo Electron Ltd
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Toyota Motor Corp filed Critical Tokyo Electron Ltd
Priority to JP2006283015A priority Critical patent/JP5016892B2/ja
Priority to EP07829980.7A priority patent/EP2088441B1/en
Priority to US12/444,695 priority patent/US8159245B2/en
Priority to PCT/JP2007/070246 priority patent/WO2008050648A1/ja
Publication of JP2008101944A publication Critical patent/JP2008101944A/ja
Publication of JP2008101944A5 publication Critical patent/JP2008101944A5/ja
Application granted granted Critical
Publication of JP5016892B2 publication Critical patent/JP5016892B2/ja
Active legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2006283015A 2006-10-17 2006-10-17 検査装置及び検査方法 Active JP5016892B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006283015A JP5016892B2 (ja) 2006-10-17 2006-10-17 検査装置及び検査方法
EP07829980.7A EP2088441B1 (en) 2006-10-17 2007-10-17 Inspection device and inspection method
US12/444,695 US8159245B2 (en) 2006-10-17 2007-10-17 Holding member for inspection, inspection device and inspecting method
PCT/JP2007/070246 WO2008050648A1 (en) 2006-10-17 2007-10-17 Holding member for inspection, inspecting device, and inspecting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006283015A JP5016892B2 (ja) 2006-10-17 2006-10-17 検査装置及び検査方法

Publications (3)

Publication Number Publication Date
JP2008101944A JP2008101944A (ja) 2008-05-01
JP2008101944A5 JP2008101944A5 (enExample) 2009-11-26
JP5016892B2 true JP5016892B2 (ja) 2012-09-05

Family

ID=39324447

Family Applications (1)

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JP2006283015A Active JP5016892B2 (ja) 2006-10-17 2006-10-17 検査装置及び検査方法

Country Status (4)

Country Link
US (1) US8159245B2 (enExample)
EP (1) EP2088441B1 (enExample)
JP (1) JP5016892B2 (enExample)
WO (1) WO2008050648A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102118422B (zh) * 2010-01-05 2016-01-20 中兴通讯股份有限公司 Reload对等网络的对等节点及其配置的更新方法和系统
JP5296117B2 (ja) 2010-03-12 2013-09-25 東京エレクトロン株式会社 プローブ装置
JP5725543B2 (ja) * 2011-02-17 2015-05-27 上野精機株式会社 電子部品測定装置
JP5291157B2 (ja) * 2011-08-01 2013-09-18 東京エレクトロン株式会社 パワーデバイス用のプローブカード
JP5265746B2 (ja) 2011-09-22 2013-08-14 東京エレクトロン株式会社 プローブ装置
JP5796870B2 (ja) 2011-12-05 2015-10-21 株式会社日本マイクロニクス 半導体デバイスの検査装置とそれに用いるチャックステージ
TWI506283B (zh) * 2012-11-12 2015-11-01 Mpi Corp Low power loss probe card structure
KR101794744B1 (ko) 2013-08-14 2017-12-01 에프이아이 컴파니 하전 입자 비임 시스템용 회로 프로브
JP6480099B2 (ja) * 2013-11-13 2019-03-06 三菱電機株式会社 半導体試験治具、測定装置、試験方法
TWI500945B (zh) * 2013-12-17 2015-09-21 Primax Electronics Ltd 電路板之測試系統
JP6254514B2 (ja) * 2014-02-18 2017-12-27 本田技研工業株式会社 電流印加装置、半導体素子の製造方法及び検査装置
US9435849B2 (en) * 2014-06-30 2016-09-06 Infineon Technologies Ag Method for testing semiconductor dies and a test apparatus
US9268938B1 (en) 2015-05-22 2016-02-23 Power Fingerprinting Inc. Systems, methods, and apparatuses for intrusion detection and analytics using power characteristics such as side-channel information collection
US10859609B2 (en) 2016-07-06 2020-12-08 Power Fingerprinting Inc. Methods and apparatuses for characteristic management with side-channel signature analysis
JP6477947B2 (ja) * 2018-03-05 2019-03-06 三菱電機株式会社 半導体試験治具、測定装置、試験方法
JP7138463B2 (ja) 2018-03-30 2022-09-16 株式会社日本マイクロニクス プローバ
CN112394280B (zh) * 2020-11-17 2024-05-28 广州市力驰微电子科技有限公司 一种电源芯片生产用的测试装置
KR102410310B1 (ko) * 2021-05-03 2022-06-22 (주) 엔지온 검출 유니트 및 이를 구비하는 반도체 필름층 검사 장치 및 이를 이용한 검사 방법
CN113617701A (zh) * 2021-07-31 2021-11-09 东莞市川冈自动化设备有限公司 一种弹簧针阻抗检测机及其工作方法
US12254977B2 (en) * 2022-12-30 2025-03-18 Cilag Gmbh International Detection of knock-off or counterfeit surgical devices

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US5150041A (en) * 1991-06-21 1992-09-22 Compaq Computer Corporation Optically alignable printed circuit board test fixture apparatus and associated methods
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
JP3153834B2 (ja) 1993-02-15 2001-04-09 三菱電機エンジニアリング株式会社 半導体装置のテスト装置及び半導体装置の検査方法
US5633122A (en) * 1993-08-16 1997-05-27 Micron Technology, Inc. Test fixture and method for producing a test fixture for testing unpackaged semiconductor die
US5838159A (en) * 1996-03-22 1998-11-17 Sun Microsystems, Inc. Chip carrier to allow electron beam probing and FIB modifications
JP3642456B2 (ja) * 1998-02-24 2005-04-27 株式会社村田製作所 電子部品の検査方法および装置
US6967497B1 (en) * 1998-08-21 2005-11-22 Micron Technology, Inc. Wafer processing apparatuses and electronic device workpiece processing apparatuses
JP3371869B2 (ja) * 1999-10-29 2003-01-27 日本電気株式会社 ベアチップｌｓｉ搭載基板の高速テスト装置
US6605951B1 (en) * 2000-12-11 2003-08-12 Lsi Logic Corporation Interconnector and method of connecting probes to a die for functional analysis
US6759860B1 (en) * 2001-06-19 2004-07-06 Lsi Logic Corporation Semiconductor device package substrate probe fixture
JP4043339B2 (ja) * 2002-10-22 2008-02-06 川崎マイクロエレクトロニクス株式会社 試験方法および試験装置
JP4387125B2 (ja) * 2003-06-09 2009-12-16 東京エレクトロン株式会社 検査方法及び検査装置
JP4509811B2 (ja) * 2005-01-28 2010-07-21 三菱電機株式会社 検査治具
US7262615B2 (en) * 2005-10-31 2007-08-28 Freescale Semiconductor, Inc. Method and apparatus for testing a semiconductor structure having top-side and bottom-side connections
US7425839B2 (en) * 2006-08-25 2008-09-16 Micron Technology, Inc. Systems and methods for testing packaged microelectronic devices

Also Published As

Publication number Publication date
US20100033199A1 (en) 2010-02-11
EP2088441A1 (en) 2009-08-12
WO2008050648A1 (en) 2008-05-02
EP2088441B1 (en) 2014-01-15
EP2088441A4 (en) 2012-11-28
US8159245B2 (en) 2012-04-17
JP2008101944A (ja) 2008-05-01

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