JP5010990B2 - 接続方法 - Google Patents

接続方法 Download PDF

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Publication number
JP5010990B2
JP5010990B2 JP2007150180A JP2007150180A JP5010990B2 JP 5010990 B2 JP5010990 B2 JP 5010990B2 JP 2007150180 A JP2007150180 A JP 2007150180A JP 2007150180 A JP2007150180 A JP 2007150180A JP 5010990 B2 JP5010990 B2 JP 5010990B2
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JP
Japan
Prior art keywords
particles
substrate
particle size
conductive particles
pressing force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007150180A
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English (en)
Japanese (ja)
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JP2008305887A5 (https=
JP2008305887A (ja
Inventor
朋之 石松
大祐 佐藤
裕樹 大関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2007150180A priority Critical patent/JP5010990B2/ja
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to KR1020097026916A priority patent/KR101130002B1/ko
Priority to CN2008800190225A priority patent/CN101681858B/zh
Priority to HK10105568.9A priority patent/HK1139785B/xx
Priority to PCT/JP2008/059388 priority patent/WO2008149678A1/ja
Priority to CN201110244407.5A priority patent/CN102448255B/zh
Priority to TW97119581A priority patent/TWI394811B/zh
Publication of JP2008305887A publication Critical patent/JP2008305887A/ja
Priority to US12/631,210 priority patent/US8273207B2/en
Publication of JP2008305887A5 publication Critical patent/JP2008305887A5/ja
Application granted granted Critical
Publication of JP5010990B2 publication Critical patent/JP5010990B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
JP2007150180A 2007-06-06 2007-06-06 接続方法 Active JP5010990B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2007150180A JP5010990B2 (ja) 2007-06-06 2007-06-06 接続方法
CN2008800190225A CN101681858B (zh) 2007-06-06 2008-05-21 电子部件的连接方法及接合体
HK10105568.9A HK1139785B (en) 2007-06-06 2008-05-21 Method for connecting electronic part and jointed structure
PCT/JP2008/059388 WO2008149678A1 (ja) 2007-06-06 2008-05-21 電子部品の接続方法及び接合体
KR1020097026916A KR101130002B1 (ko) 2007-06-06 2008-05-21 전자 부품의 접속 방법 및 접합체
CN201110244407.5A CN102448255B (zh) 2007-06-06 2008-05-21 电子部件的连接方法及接合体
TW97119581A TWI394811B (zh) 2007-06-06 2008-05-27 電子零件的連接方法及其接合體
US12/631,210 US8273207B2 (en) 2007-06-06 2009-12-04 Method for connecting electronic part and joined structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007150180A JP5010990B2 (ja) 2007-06-06 2007-06-06 接続方法

Publications (3)

Publication Number Publication Date
JP2008305887A JP2008305887A (ja) 2008-12-18
JP2008305887A5 JP2008305887A5 (https=) 2011-12-08
JP5010990B2 true JP5010990B2 (ja) 2012-08-29

Family

ID=40093503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007150180A Active JP5010990B2 (ja) 2007-06-06 2007-06-06 接続方法

Country Status (6)

Country Link
US (1) US8273207B2 (https=)
JP (1) JP5010990B2 (https=)
KR (1) KR101130002B1 (https=)
CN (2) CN101681858B (https=)
TW (1) TWI394811B (https=)
WO (1) WO2008149678A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101075192B1 (ko) 2009-03-03 2011-10-21 도레이첨단소재 주식회사 전자부품 제조용 점착테이프
JP5106457B2 (ja) * 2009-03-24 2012-12-26 パナソニック株式会社 電子部品接合方法とバンプ形成方法およびその装置
KR20130077816A (ko) * 2010-04-22 2013-07-09 세키스이가가쿠 고교가부시키가이샤 이방성 도전 재료 및 접속 구조체
JP5533393B2 (ja) * 2010-07-26 2014-06-25 パナソニック株式会社 電子部品接着用の接着剤および電子部品接着方法。
SG187259A1 (en) * 2010-08-05 2013-03-28 Sumitomo Bakelite Co Functional particle, functional particle group, filler, resin composition for electronic component, electronic component and semiconductor device
DE102010055318B4 (de) * 2010-12-21 2025-06-12 Audi Ag Verfahren und Einrichtung zur Steuerung des Drucks im Inneren eines Kraftstofftanks
JP5672022B2 (ja) * 2011-01-25 2015-02-18 日立化成株式会社 絶縁被覆導電粒子、異方導電性材料及び接続構造体
JP6044195B2 (ja) * 2011-09-06 2016-12-14 日立化成株式会社 絶縁被覆用粒子、絶縁被覆導電粒子、異方導電材料及び接続構造体
KR101950516B1 (ko) * 2011-09-06 2019-02-20 히타치가세이가부시끼가이샤 절연 피복용 입자, 절연 피복 도전 입자, 이방 도전 재료 및 접속 구조체
JP5768676B2 (ja) * 2011-11-18 2015-08-26 デクセリアルズ株式会社 異方性導電フィルム、その製造方法、接続構造体及びその製造方法
KR20140113717A (ko) * 2012-02-15 2014-09-24 코니카 미놀타 가부시키가이샤 기능성 필름 및 그의 제조 방법, 및 상기 기능성 필름을 포함하는 전자 디바이스
GB201212489D0 (en) 2012-07-13 2012-08-29 Conpart As Improvements in conductive adhesives
TW201408754A (zh) * 2012-08-29 2014-03-01 Compal Electronics Inc 黏著材料及具有熱阻隔能力基板結構的製作方法
US9756728B2 (en) * 2012-08-31 2017-09-05 Panasonic Intellectual Property Management Co., Ltd. Component-mounted structure
JP6066643B2 (ja) * 2012-09-24 2017-01-25 デクセリアルズ株式会社 異方性導電接着剤
TWI578571B (zh) * 2012-12-24 2017-04-11 鴻海精密工業股份有限公司 發光晶片組合及其製造方法
JP6261386B2 (ja) * 2014-03-04 2018-01-17 デクセリアルズ株式会社 多層型熱伝導性シート、多層型熱伝導性シートの製造方法
KR102430609B1 (ko) * 2014-03-31 2022-08-08 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
JPWO2015190409A1 (ja) * 2014-06-12 2017-04-20 コニカミノルタ株式会社 インクジェットヘッド及びインクジェット記録装置
TWI809284B (zh) * 2015-01-13 2023-07-21 日商迪睿合股份有限公司 異向導電膜、連接構造體及連接構造體之製造方法
EP3047973A3 (en) * 2015-01-23 2016-09-07 Konica Minolta, Inc. Inkjet head, method of producing inkjet head, and inkjet recording device
JP6659247B2 (ja) 2015-06-16 2020-03-04 デクセリアルズ株式会社 接続体、接続体の製造方法、検査方法
JP6610117B2 (ja) * 2015-09-18 2019-11-27 コニカミノルタ株式会社 接続構造体、インクジェットヘッド、インクジェットヘッドの製造方法及びインクジェット記録装置
JP6658695B2 (ja) * 2016-08-03 2020-03-04 株式会社豊田中央研究所 複合めっき膜
JP2019084703A (ja) * 2017-11-02 2019-06-06 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射記録装置
CN113271719B (zh) * 2021-06-23 2022-07-08 昆山丘钛生物识别科技有限公司 柔性电路板处理方法、装置及设备
CN113805388B (zh) * 2021-08-25 2023-05-30 Tcl华星光电技术有限公司 框胶材料、液晶显示面板和显示装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JPH04223348A (ja) 1990-12-26 1992-08-13 Oki Electric Ind Co Ltd 異方導電接続構造
JPH05334912A (ja) 1992-06-01 1993-12-17 Casio Comput Co Ltd 異方性導電接着剤および導電接続構造
JP3561748B2 (ja) 1994-10-14 2004-09-02 綜研化学株式会社 異方導電性接着剤
JP3422243B2 (ja) * 1998-01-07 2003-06-30 日本電気株式会社 樹脂フィルム
WO2000033375A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Couche conductrice anisotrope, puce a semi-conducteur et procede de conditionnement
JP3365367B2 (ja) 1999-09-14 2003-01-08 ソニーケミカル株式会社 Ｃｏｇ実装品および接続材料
JP2002075488A (ja) * 2000-09-04 2002-03-15 Sekisui Chem Co Ltd 異方性導電膜及びその製造方法
JP2002217239A (ja) * 2001-01-19 2002-08-02 Matsushita Electric Ind Co Ltd 異方性導電膜
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP2003165825A (ja) 2001-11-30 2003-06-10 Mitsui Chemicals Inc 異方性導電ペーストおよびその使用方法
JP4761108B2 (ja) * 2004-12-27 2011-08-31 荒川化学工業株式会社 シラン変性ポリアミック酸微粒子の製造法、ポリイミド−シリカ複合微粒子の製造法、当該複合微粒子および導電性微粒子
JP2005347273A (ja) 2005-06-06 2005-12-15 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法

Also Published As

Publication number Publication date
CN101681858B (zh) 2012-01-11
CN102448255B (zh) 2015-04-22
WO2008149678A1 (ja) 2008-12-11
US20100080995A1 (en) 2010-04-01
CN101681858A (zh) 2010-03-24
KR101130002B1 (ko) 2012-03-28
TWI394811B (zh) 2013-05-01
TW200848486A (en) 2008-12-16
HK1139785A1 (en) 2010-09-24
CN102448255A (zh) 2012-05-09
US8273207B2 (en) 2012-09-25
JP2008305887A (ja) 2008-12-18
KR20100021485A (ko) 2010-02-24

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