JP5010199B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5010199B2 JP5010199B2 JP2006203964A JP2006203964A JP5010199B2 JP 5010199 B2 JP5010199 B2 JP 5010199B2 JP 2006203964 A JP2006203964 A JP 2006203964A JP 2006203964 A JP2006203964 A JP 2006203964A JP 5010199 B2 JP5010199 B2 JP 5010199B2
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- substrate
- light
- led
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Led Device Packages (AREA)
Description
2 実装基板
2b 壁部
2c 梁状片
4 光センサ
5 封止部
12a 電極(パッド)
12b 電極
14 バンプ
20 LED搭載用基板(ベース基板部)
30 中間層基板
40 配線用基板
44 張出部
45 配線
Claims (3)
- LEDチップと、LEDチップが搭載されるベース基板部およびLEDチップを囲む形でベース基板部から突設された壁部を有する実装基板とを備え、LEDチップの両電極のうちの少なくとも一方の電極がLEDチップにおけるベース基板部側とは反対の一表面側に設けられた発光装置であって、実装基板は、壁部の先端部から内方へ少なくともLEDチップの前記一表面側に設けられた電極であるパッドと重なる位置まで張り出した梁状片を有し、当該梁状片にパッドと接合されて電気的に接続される配線が設けられてなり、梁状片におけるベース基板部側にLEDチップから放射された光の一部を光電変換する光センサが設けられてなることを特徴とする発光装置。
- 前記配線と前記パッドとがバンプを介して接合されてなることを特徴とする請求項1記載の発光装置。
- 前記実装基板は、3枚のシリコン基板を用いて形成されてなることを特徴とする請求項1または請求項2記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006203964A JP5010199B2 (ja) | 2006-07-26 | 2006-07-26 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006203964A JP5010199B2 (ja) | 2006-07-26 | 2006-07-26 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008034488A JP2008034488A (ja) | 2008-02-14 |
JP5010199B2 true JP5010199B2 (ja) | 2012-08-29 |
Family
ID=39123627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006203964A Active JP5010199B2 (ja) | 2006-07-26 | 2006-07-26 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5010199B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5115073B2 (ja) * | 2007-07-23 | 2013-01-09 | 富士ゼロックス株式会社 | 半導体発光装置 |
CN102185090B (zh) * | 2011-03-29 | 2013-08-21 | 晶科电子(广州)有限公司 | 一种采用cob封装的发光器件及其制造方法 |
KR101246220B1 (ko) | 2011-10-05 | 2013-03-21 | 한국과학기술원 | 표면 내장형 발광 소자 패키지 |
JPWO2018105448A1 (ja) * | 2016-12-05 | 2019-10-24 | シチズン電子株式会社 | 発光装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4050802B2 (ja) * | 1996-08-02 | 2008-02-20 | シチズン電子株式会社 | カラー表示装置 |
JP2959517B2 (ja) * | 1997-03-31 | 1999-10-06 | オムロン株式会社 | 光源装置および電気部品の実装方法 |
JPH11161197A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 画像表示装置 |
US6828538B2 (en) * | 2001-12-26 | 2004-12-07 | Xerox Corporation | Illumination detection method for LED printbars |
CN1770942B (zh) * | 2004-11-01 | 2010-09-08 | 安华高科技Ecbuip(新加坡)私人有限公司 | 具有强度监控系统的发光二极管照明系统 |
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2006
- 2006-07-26 JP JP2006203964A patent/JP5010199B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008034488A (ja) | 2008-02-14 |
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