JP5008262B2 - 半導体発光素子 - Google Patents

半導体発光素子 Download PDF

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Publication number
JP5008262B2
JP5008262B2 JP2005057874A JP2005057874A JP5008262B2 JP 5008262 B2 JP5008262 B2 JP 5008262B2 JP 2005057874 A JP2005057874 A JP 2005057874A JP 2005057874 A JP2005057874 A JP 2005057874A JP 5008262 B2 JP5008262 B2 JP 5008262B2
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JP
Japan
Prior art keywords
electrode
layer
metal film
semiconductor layer
light emitting
Prior art date
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Expired - Fee Related
Application number
JP2005057874A
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English (en)
Japanese (ja)
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JP2006245231A5 (enrdf_load_stackoverflow
JP2006245231A (ja
Inventor
健 楠瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2005057874A priority Critical patent/JP5008262B2/ja
Publication of JP2006245231A publication Critical patent/JP2006245231A/ja
Publication of JP2006245231A5 publication Critical patent/JP2006245231A5/ja
Application granted granted Critical
Publication of JP5008262B2 publication Critical patent/JP5008262B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005057874A 2005-03-02 2005-03-02 半導体発光素子 Expired - Fee Related JP5008262B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005057874A JP5008262B2 (ja) 2005-03-02 2005-03-02 半導体発光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005057874A JP5008262B2 (ja) 2005-03-02 2005-03-02 半導体発光素子

Publications (3)

Publication Number Publication Date
JP2006245231A JP2006245231A (ja) 2006-09-14
JP2006245231A5 JP2006245231A5 (enrdf_load_stackoverflow) 2008-03-27
JP5008262B2 true JP5008262B2 (ja) 2012-08-22

Family

ID=37051343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005057874A Expired - Fee Related JP5008262B2 (ja) 2005-03-02 2005-03-02 半導体発光素子

Country Status (1)

Country Link
JP (1) JP5008262B2 (enrdf_load_stackoverflow)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5139005B2 (ja) 2007-08-22 2013-02-06 株式会社東芝 半導体発光素子及び半導体発光装置
JP5191837B2 (ja) 2008-08-28 2013-05-08 株式会社東芝 半導体発光素子及び半導体発光装置
JP5325506B2 (ja) * 2008-09-03 2013-10-23 株式会社東芝 半導体発光素子及びその製造方法
JP5334601B2 (ja) * 2009-01-21 2013-11-06 株式会社東芝 半導体発光ダイオード素子及び半導体発光装置
JP5258707B2 (ja) 2009-08-26 2013-08-07 株式会社東芝 半導体発光素子
JPWO2012026068A1 (ja) * 2010-08-24 2013-10-28 パナソニック株式会社 発光素子
JP2010272894A (ja) * 2010-08-27 2010-12-02 Toshiba Lighting & Technology Corp 発光装置
JP5886584B2 (ja) 2010-11-05 2016-03-16 ローム株式会社 半導体発光装置
US8785952B2 (en) * 2011-10-10 2014-07-22 Lg Innotek Co., Ltd. Light emitting device and light emitting device package including the same
KR101832165B1 (ko) * 2011-11-15 2018-02-26 엘지이노텍 주식회사 발광소자
KR101872735B1 (ko) 2011-11-15 2018-08-02 엘지이노텍 주식회사 발광소자 패키지
JP5395916B2 (ja) * 2012-01-27 2014-01-22 株式会社東芝 半導体発光素子
JP5535250B2 (ja) * 2012-01-27 2014-07-02 株式会社東芝 半導体発光素子の製造方法
JP5319820B2 (ja) * 2012-04-27 2013-10-16 株式会社東芝 半導体発光ダイオード素子及び半導体発光装置
JP6003246B2 (ja) * 2012-06-04 2016-10-05 日亜化学工業株式会社 発光装置
JP5372220B2 (ja) * 2012-07-13 2013-12-18 株式会社東芝 半導体発光素子及び半導体発光装置
JP6221926B2 (ja) 2013-05-17 2017-11-01 日亜化学工業株式会社 半導体発光素子およびその製造方法
JP5774650B2 (ja) * 2013-08-13 2015-09-09 株式会社東芝 半導体発光素子
JP6661964B2 (ja) * 2014-10-28 2020-03-11 日亜化学工業株式会社 発光装置
TWI565102B (zh) * 2015-04-29 2017-01-01 隆達電子股份有限公司 發光二極體模組及使用該發光二極體模組的燈具
JP7445120B2 (ja) * 2020-02-21 2024-03-07 日亜化学工業株式会社 発光装置
CN116979000A (zh) * 2021-11-23 2023-10-31 厦门市三安光电科技有限公司 一种发光二极管芯片及发光装置
CN117497681B (zh) * 2023-12-29 2024-04-05 南昌凯捷半导体科技有限公司 一种Mini-LED芯片及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634007Y2 (ja) * 1989-11-02 1994-09-07 住友重機械工業株式会社 コイル巻取装置
JP3503439B2 (ja) * 1997-09-11 2004-03-08 日亜化学工業株式会社 窒化物半導体素子
JP4118370B2 (ja) * 1997-12-15 2008-07-16 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 反射ｐ電極を有する窒化物半導体発光装置およびその製造方法ならびに半導体光電子装置
JPH11220171A (ja) * 1998-02-02 1999-08-10 Toyoda Gosei Co Ltd 窒化ガリウム系化合物半導体素子
JP2001217461A (ja) * 2000-02-04 2001-08-10 Matsushita Electric Ind Co Ltd 複合発光素子
JP2003168823A (ja) * 2001-09-18 2003-06-13 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子
JP2003243705A (ja) * 2002-02-07 2003-08-29 Lumileds Lighting Us Llc 発光半導体の方法及び装置

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JP2006245231A (ja) 2006-09-14

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