JP4998274B2 - セラミック多層基板の製造方法 - Google Patents

セラミック多層基板の製造方法 Download PDF

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Publication number
JP4998274B2
JP4998274B2 JP2008002923A JP2008002923A JP4998274B2 JP 4998274 B2 JP4998274 B2 JP 4998274B2 JP 2008002923 A JP2008002923 A JP 2008002923A JP 2008002923 A JP2008002923 A JP 2008002923A JP 4998274 B2 JP4998274 B2 JP 4998274B2
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Prior art keywords
green sheet
multilayer substrate
wiring
fine particles
pattern
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Expired - Fee Related
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JP2008002923A
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Japanese (ja)
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JP2009164507A5 (enExample
JP2009164507A (ja
Inventor
健嗣 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2008002923A priority Critical patent/JP4998274B2/ja
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Publication of JP2009164507A5 publication Critical patent/JP2009164507A5/ja
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JP2008002923A 2008-01-10 2008-01-10 セラミック多層基板の製造方法 Expired - Fee Related JP4998274B2 (ja)

Priority Applications (1)

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JP2008002923A JP4998274B2 (ja) 2008-01-10 2008-01-10 セラミック多層基板の製造方法

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JP2008002923A JP4998274B2 (ja) 2008-01-10 2008-01-10 セラミック多層基板の製造方法

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JP2009164507A JP2009164507A (ja) 2009-07-23
JP2009164507A5 JP2009164507A5 (enExample) 2011-02-10
JP4998274B2 true JP4998274B2 (ja) 2012-08-15

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JP2008002923A Expired - Fee Related JP4998274B2 (ja) 2008-01-10 2008-01-10 セラミック多層基板の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574038B2 (ja) 2011-03-07 2014-08-20 株式会社村田製作所 セラミック多層基板およびその製造方法
JP7579051B2 (ja) * 2019-07-18 2024-11-07 日本特殊陶業株式会社 中空構造部材の作製方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04116892A (ja) * 1990-09-06 1992-04-17 Fujitsu Ltd 多層セラミック基板およびその製造方法
JPH04219993A (ja) * 1990-12-20 1992-08-11 Fujitsu Ltd 多層セラミック基板およびその製造方法
JPH0521958A (ja) * 1991-07-17 1993-01-29 Nec Corp 多層配線基板の積層体及びその製造方法
JP3762095B2 (ja) * 1998-03-31 2006-03-29 京セラ株式会社 多層回路基板
JP3973402B2 (ja) * 2001-10-25 2007-09-12 株式会社日立製作所 高周波回路モジュール
JP2003304064A (ja) * 2002-04-08 2003-10-24 Sumitomo Metal Ind Ltd 空気層を内蔵したセラミック多層回路基板及びその製造方法
JP2005057140A (ja) * 2003-08-06 2005-03-03 Seiko Epson Corp 多層配線基板とその製造方法
JP4874644B2 (ja) * 2005-12-22 2012-02-15 京セラ株式会社 セラミック構造体の製造方法

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JP2009164507A (ja) 2009-07-23

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