JP4996838B2 - 多層配線基板 - Google Patents

多層配線基板 Download PDF

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Publication number
JP4996838B2
JP4996838B2 JP2005285482A JP2005285482A JP4996838B2 JP 4996838 B2 JP4996838 B2 JP 4996838B2 JP 2005285482 A JP2005285482 A JP 2005285482A JP 2005285482 A JP2005285482 A JP 2005285482A JP 4996838 B2 JP4996838 B2 JP 4996838B2
Authority
JP
Japan
Prior art keywords
wiring board
particles
multilayer wiring
conductive paste
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005285482A
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English (en)
Japanese (ja)
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JP2007096121A5 (enExample
JP2007096121A (ja
Inventor
紳月 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Priority to JP2005285482A priority Critical patent/JP4996838B2/ja
Publication of JP2007096121A publication Critical patent/JP2007096121A/ja
Publication of JP2007096121A5 publication Critical patent/JP2007096121A5/ja
Application granted granted Critical
Publication of JP4996838B2 publication Critical patent/JP4996838B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005285482A 2005-09-29 2005-09-29 多層配線基板 Expired - Fee Related JP4996838B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005285482A JP4996838B2 (ja) 2005-09-29 2005-09-29 多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005285482A JP4996838B2 (ja) 2005-09-29 2005-09-29 多層配線基板

Publications (3)

Publication Number Publication Date
JP2007096121A JP2007096121A (ja) 2007-04-12
JP2007096121A5 JP2007096121A5 (enExample) 2007-07-12
JP4996838B2 true JP4996838B2 (ja) 2012-08-08

Family

ID=37981438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005285482A Expired - Fee Related JP4996838B2 (ja) 2005-09-29 2005-09-29 多層配線基板

Country Status (1)

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JP (1) JP4996838B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009071036A (ja) * 2007-09-13 2009-04-02 Fujikura Ltd 部品実装基板、複合基板
JP2009188218A (ja) * 2008-02-07 2009-08-20 Murata Mfg Co Ltd 多層基板
US8787030B2 (en) 2008-10-30 2014-07-22 Sumitomo Electric Industries, Ltd. Multilayer circuit board with resin bases and separators
JP6177639B2 (ja) 2013-09-20 2017-08-09 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板
JP6138026B2 (ja) 2013-11-12 2017-05-31 日本メクトロン株式会社 導電ペーストの充填方法、および多層プリント配線板の製造方法
JP6746817B1 (ja) 2020-03-05 2020-08-26 日本メクトロン株式会社 プリント配線板およびその製造方法
JP7062548B2 (ja) 2018-07-25 2022-05-17 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03287680A (ja) * 1990-04-03 1991-12-18 Toagosei Chem Ind Co Ltd 有機厚膜ペースト組成物
JP3514647B2 (ja) * 1999-01-05 2004-03-31 三菱樹脂株式会社 多層プリント配線板およびその製造方法
JP2000223836A (ja) * 1999-01-28 2000-08-11 Kyocera Corp 多層配線基板およびその製造方法
JP2000323804A (ja) * 1999-05-07 2000-11-24 Toagosei Co Ltd プリント配線板用銅張り積層板
JP3473601B2 (ja) * 2000-12-26 2003-12-08 株式会社デンソー プリント基板およびその製造方法
JP2003092467A (ja) * 2001-09-19 2003-03-28 Tatsuta Electric Wire & Cable Co Ltd プリント配線基板およびその製法
JP4401070B2 (ja) * 2002-02-05 2010-01-20 ソニー株式会社 半導体装置内蔵多層配線基板及びその製造方法
JP2004111702A (ja) * 2002-09-19 2004-04-08 Denso Corp 配線基板およびその製造方法

Also Published As

Publication number Publication date
JP2007096121A (ja) 2007-04-12

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